scholarly journals Development of 6 U CubeSat’s Deployable Solar Panel with Burn Wire Triggering Holding and Release Mechanism

2019 ◽  
Vol 2019 ◽  
pp. 1-13
Author(s):  
Tae-Yong Park ◽  
Bong-Geon Chae ◽  
Hyun-Ung Oh
Keyword(s):  
Random Vibration ◽  
Printed Circuit Board ◽  
Solar Panel ◽  
Circuit Board ◽  
Structural Safety ◽  
Release Mechanism ◽  
Printed Circuit ◽  
Test Conditions ◽  
Wire Cutting ◽  
Vibration Tests

In the present work, a deployable solar panel based on a burn wire triggering holding and release mechanism was developed for use of 6 U CubeSat. The holding and release mechanism was designed based on a nichrome burn wire cutting method widely used for CubeSat applications. However, it provides a high loading capability, reliable wire cutting, multiplane constraints, and handling simplicity during the tightening process of wire. A demonstration model of a printed circuit board-based solar panel stiffened by a high-pressure fiberglass-laminated G10 material was fabricated and tested to validate the effectiveness of the design and functionality of the mechanism under various test conditions. The structural safety of the solar panel combined with the mechanism in a launch vibration environment was verified through sine and random vibration tests at qualification level.

scholarly journals Development of a Novel Deployable Solar Panel and Mechanism for 6U CubeSat of STEP Cube Lab-II

Aerospace ◽  
2021 ◽  
Vol 8 (3) ◽  
pp. 64
Author(s):  
Shankar Bhattarai ◽  
Ji-Seong Go ◽  
Hongrae Kim ◽  
Hyun-Ung Oh
Keyword(s):  
Solar Cells ◽  
Printed Circuit Board ◽  
Solar Panel ◽  
Circuit Board ◽  
Structural Safety ◽  
Release Mechanism ◽  
Constrained Layer Damping ◽  
Solar Panels ◽  
Printed Circuit ◽  
Design Effectiveness

The structural safety of solar cells mounted on deployable solar panels in the launch vibration environment is a significant aspect of a successful CubeSat mission. This paper presents a novel highly damped deployable solar panel module that is effective in ensuring structural protection of solar cells under the launch environment by rapidly suppressing the vibrations transmitting through the solar panel by constrained layer damping achieved using printed circuit board (PCB)-based multilayered thin stiffeners with double-sided viscoelastic tapes. A high-damping solar panel demonstration model with a three-pogo pin-based burn wire release mechanism was fabricated and tested for application in the 6U CubeSat “STEP Cube Lab-II” developed by Chosun University, South Korea. The reliable release function and radiation hardness assurance of the mechanism in an in-orbit environment were confirmed by performing solar panel deployment tests and radiation tests, respectively. The design effectiveness and structural safety of the proposed solar panel module were validated by launch vibration and in-orbit environment tests at the qualification level.

Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

1996 ◽  
Vol 118 (2) ◽  
pp. 101-104 ◽  
Author(s):  
John Lau ◽  
Eric Schneider ◽  
Tom Baker
Keyword(s):  
Mathematical Analysis ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Plane Shock ◽  
Printed Circuit ◽  
Flip Chips ◽  
Solder Bumps ◽  
Out Of Plane ◽  
Vibration Tests

The reliability of solder bumped flip chips on organic coated copper (OCC) printed circuit board (PCB) has been studied by shock and vibration tests and a mathematical analysis. Two different chip sizes (7 mm and 14 mm on a side) have been studied, and the larger chips have many internal solder bumps. For the in-plane and out-of-plane and out-of-plane shock tests, the chips were assembled with and without underfill encapsulants. However, for the out-of-plane vibration tests all the chips were underfilled with epoxy.

scholarly journals CubeSat’s Deployable Solar Panel with Viscoelastic Multilayered Stiffener for Launch Vibration Attenuation

2020 ◽  
Vol 2020 ◽  
pp. 1-10 ◽  
Author(s):  
Shankar Bhattarai ◽  
Hongrae Kim ◽  
Hyun-Ung Oh
Keyword(s):  
Solar Cells ◽  
Free Vibration ◽  
Dynamic Characteristics ◽  
Random Vibration ◽  
Solar Panel ◽  
Structural Safety ◽  
Vibration Attenuation ◽  
Vibration Tests

Ensuring the structural safety of a deployable solar panel under a severe launch vibration environment is one of the important factors for a successful CubeSat mission. A CubeSat’s deployable solar panel proposed in this study is effective to guarantee the structural safety of solar cells by attenuating launch loads owing to the superior damping characteristic achieved by a multilayered stiffener with viscoelastic acrylic tapes. The demonstration model of 3 U CubeSat’s deployable solar panel was fabricated and tested to validate the effectiveness of the proposed design. The basic dynamic characteristics of the solar panel were measured through free-vibration tests according to the various layers of the stiffener. Moreover, the characteristics of the deployed solar panel were measured and investigated under various temperatures to predict its capability under in-orbit operation. The effectiveness of the proposed design for launch vibration attenuation was demonstrated through qualification level sine and random vibration tests.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

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