scholarly journals Improvement of Sintering Performance of Nanosilver Paste by Tin Doping

2020 ◽  
Vol 2020 ◽  
pp. 1-6
Author(s):  
Hui Yang ◽  
Jihui Wu
Keyword(s):  
Solid Solution ◽  
Shear Strength ◽  
Decomposition Temperature ◽  
Maximum Temperature ◽  
Joint Shear Strength ◽  
Solid Solution Strengthening ◽  
Strength Limit ◽  
Brittle Phase ◽  
Sintering Properties ◽  
Nanosilver Paste

Nanosilver paste, an interconnect solder, is a common choice in the electronics packaging industry. However, higher sintering temperature and lower sintering strength limit its application. At present, doped nanosilver paste has been studied for use in chip interconnection. In order to improve the sintering properties and shear strength of nanosilver paste, we have developed a new tin-doped nanosilver paste (referred to as silver tin paste), and according to the decomposition temperature of the organic dispersant in the slurry, a corresponding sintering process with a maximum temperature of 300°C was developed. The product after sintering of the silver tin paste is a mixture of a solid solution of Ag and an Ag3Sn phase. Among them, the hard and brittle phase Ag3Sn diffuse distribution in the silver matrix for strengthening, and the solid solution of Ag acts as a replacement solid solution strengthening. As the content of doped Sn increases, the sintering strength increases remarkably. When the Sn content is 5%, the joint shear strength reaches the highest value of 50 MPa. When it exceeds 5%, the sintering strength gradually decreases, which may be caused by the excessive formation of the intermetallic compound IMC as the dopant content increases. This new tin-doped nanosilver technology has the characteristics of low-temperature sintering and high-temperature service, so it is expected to be widely used in semiconductor power devices.

scholarly journals Preparation and sintering characteristics of nano-silver wrapped tin paste

2020 ◽  
Author(s):  
Hui Yang ◽  
Jihui Wu
Keyword(s):  
Solid Solution ◽  
Decomposition Temperature ◽  
Maximum Temperature ◽  
Core Shell ◽  
Strengthening Effect ◽  
Dispersion Strengthening ◽  
Joint Shear Strength ◽  
Nano Silver ◽  
Strength Limit ◽  
Nanosilver Paste

Abstract Nanosilver paste, an interconnect solder is a common choice in the electronics packaging industry, however higher sintering temperatures and lower sintering strength limit its application. At present, core-shell nano-slurry has been studied and applied to chip interconnection. Based on the mechanism of heterogeneous flocculation, we have developed a new nano-silver wrapped tin paste (Sn@Ag paste), and according to the decomposition temperature of the organic dispersant in the slurry, A corresponding sintering process with a maximum temperature of 300 ° C was developed. The Sn@Ag core-shell structure makes Sn have good dispersibility and oxidation resistance, and the sintered product of the slurry is a mixture of a solid solution of Ag and an Ag 3 Sn phase. Among them, the hard and brittle phase Ag 3 Sn acts as a dispersion strengthening effect in the Ag matrix phase, and the solid solution of Ag acts as a replacement solid solution strengthening. With the increase of doping Sn content, the sintering strength is significantly improved. When the Sn content is 5%, the joint shear strength reaches the highest value of 50Mpa, which is higher than the pure nano silver paste by 10 Mpa. This new nano-silver wrapped tin paste technology has the characteristics of low temperature sintering and high temperature service, so it is expected to be widely used in semiconductor power devices.

Brazing of transparent polycrystalline Al2O3 and GH99 with the assistance of (Cu, Ni) solid solution cladding layer

2020 ◽  
Author(s):  
Bo Zhang ◽  
Lixia Zhang ◽  
Zhan Sun ◽  
Jicai Feng
Keyword(s):  
Solid Solution ◽  
Shear Strength ◽  
Mechanical Response ◽  
Mechanical Performance ◽  
Joint Shear Strength ◽  
Brazed Joints ◽  
Brazed Joint ◽  
Solution Layer ◽  
Cu Foil ◽  
Pure Cu

Abstract In this study, pure Cu foil was firstly vacuum cladding on the GH99 alloy (GH99) surface to prepare a (Cu, Ni) solid solution layer. By varying the cladding temperatures, (Cu, Ni) solid solution layers with different Ni contents were achieved. The vacuum cladding process was then followed by vacuum brazing of the Cu-coated GH99 to transparent polycrystalline Al 2 O 3 (TPA). Typical microstructure of the TPA/Cu-cladding GH99 brazed joint was characterized. The effects of different cladding temperatures on microstructural evolution and mechanical response of the brazed joints were discussed. By varying the cladding temperature, different thickness of the reaction layer at the braze filler/TPA interfaces can be achieved, which shows a strong correlation with the mechanical performance of the brazed joint. The maximum shear strength of the brazed joint reached 103 MPa when the cladding temperature was 1105 ºC. Compared with the directly brazed joint, shear strength was improved by 472%.

Spot lap joining of AA5052 to AISI 1006 by aluminium extrusion via friction forming technique

2019 ◽  
Vol 15 (6) ◽  
pp. 1337-1351 ◽  
Author(s):  
Sabah Khammass Hussein ◽  
Isam Tareq Abdullah ◽  
Abbas Khammas Hussein
Keyword(s):  
Shear Strength ◽  
Process Parameters ◽  
Maximum Temperature ◽  
Joint Shear Strength ◽  
Content Type ◽  
Pull Out ◽  
Modes Of Failure ◽  
Joint Efficiency ◽  
Joint Shear ◽  
Joining Process

Purpose The purpose of this paper is to join AA5052 to AISI 1006 steel sheets using the spot friction forming technique. Design/methodology/approach A steel sheet was pre-holed with a diameter of 4.8 mm and pre-threaded with a single internal M6 thread. Lap joint configuration was used so that the aluminium specimen was put over steel. A rotating tool with a 10 mm diameter was used for the joining process. A Taguchi method was used to design three process parameters (plunging tool depth, rotating speed and preheating time), with three levels for each parameter. The effect of the process parameters on the joint shear strength was analysed. The macrostructure, microstructure and scanning electron microscope of the joint were investigated. The temperature distribution during the joining process was recorded. Findings The formed aluminium was extruded through the steel hole and penetrated through the thread slot. A mechanical interlock was achieved between the extruded aluminium and the steel. The plunging depth of the tool exhibited a significant effect on the joint shear strength. The joint efficiency increased gradually as the plunging depth increased. Two modes of failure were found shear and pull-out. The maximum temperature during the process reached 50 per cent of aluminium’s melting point. Originality/value For the first time, AA5052 was joined with AISI 1006 steel using a friction spot forming technique with an excellent joint efficiency.

OLIN ALLOY C5218

Alloy Digest ◽  
2004 ◽  
Vol 53 (6) ◽  
Keyword(s):  
Solid Solution ◽  
Physical Properties ◽  
Tensile Properties ◽  
Bend Strength ◽  
Bronze Alloy ◽  
Solid Solution Strengthening ◽  
Solution Strengthening

Abstract Olin Alloy C5218 is a phosphor bronze alloy given both dispersion- and solid-solution strengthening for applications in the automotive connector market. This datasheet provides information on composition, physical properties, elasticity, tensile properties, and bend strength. Filing Code: CU-715. Producer or source: Olin Brass.

Lattice distortion as an estimator of solid solution strengthening in high-entropy alloys

2021 ◽  
pp. 110877
Author(s):  
Ankit Roy ◽  
Praveen Sreeramagiri ◽  
Tomas Babuska ◽  
Brandon Krick ◽  
Pratik K. Ray ◽  
...  
Keyword(s):  
Solid Solution ◽  
Lattice Distortion ◽  
High Entropy Alloys ◽  
High Entropy ◽  
Solid Solution Strengthening ◽  
Solution Strengthening

scholarly journals Strength, Hardness, and Ductility Evidence of Solid Solution Strengthening and Limited Hydrogen Embrittlement in the Alloy System Palladium-Copper (Cu wt. % 5–25)

Hydrogen ◽  
2021 ◽  
Vol 2 (3) ◽  
pp. 262-272
Author(s):  
Sebastian DiMauro ◽  
Gabrielle Legall ◽  
Coleman Lubinsky ◽  
Monica Nadeau ◽  
Renee Tait ◽  
...  
Keyword(s):  
Solid Solution ◽  
Hydrogen Embrittlement ◽  
Copper Content ◽  
Vickers Microhardness ◽  
Copper Alloys ◽  
Alloy System ◽  
Weight Percent ◽  
Solid Solution Strengthening ◽  
Solution Strengthening ◽  
Palladium Copper Alloys

Strength, hardness, and ductility characteristics were determined for a series of palladium-copper alloys that compositionally vary from 5 to 25 weight percent copper. Alloy specimens subjected to vacuum annealing showed clear evidence of solid solution strengthening. These specimens showed, as a function of increasing copper content, increased yield strength, ultimate strength, and Vickers microhardness, while their ductility was little affected by compositional differences. Annealed alloy specimens subsequently subjected to exposure to hydrogen at 323 K and PH2 = 1 atm showed evidence of hydrogen embrittlement up to a composition of ~15 wt. % Cu. The magnitude of the hydrogen embrittlement decreased with increasing copper content in the alloy.

scholarly journals Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments

Micromachines ◽  
2021 ◽  
Vol 12 (7) ◽  
pp. 750
Author(s):  
Jun-Hao Lee ◽  
Pin-Kuan Li ◽  
Hai-Wen Hung ◽  
Wallace Chuang ◽  
Eckart Schellkes ◽  
...  
Keyword(s):  
Shear Strength ◽  
Joint Strength ◽  
Maximum Stress ◽  
Geometrical Parameters ◽  
Experimental Demonstration ◽  
Joint Shear Strength ◽  
Element Analysis ◽  
Ultrasonic Bonding ◽  
Simulation Results ◽  
Geometrical Effects

This study employed finite element analysis to simulate ultrasonic metal bump direct bonding. The stress distribution on bonding interfaces in metal bump arrays made of Al, Cu, and Ni/Pd/Au was simulated by adjusting geometrical parameters of the bumps, including the shape, size, and height; the bonding was performed with ultrasonic vibration with a frequency of 35 kHz under a force of 200 N, temperature of 200 °C, and duration of 5 s. The simulation results revealed that the maximum stress of square bumps was greater than that of round bumps. The maximum stress of little square bumps was at least 15% greater than those of little round bumps and big round bumps. An experimental demonstration was performed in which bumps were created on Si chips through Al sputtering and lithography processes. Subtractive lithography etching was the only effective process for the bonding of bumps, and Ar plasma treatment magnified the joint strength. The actual joint shear strength was positively proportional to the simulated maximum stress. Specifically, the shear strength reached 44.6 MPa in the case of ultrasonic bonding for the little Al square bumps.

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