Thermal Degradation and Combustion Performance Comparison of Plywood Based on Inorganic Adhesive and Phenol-Formaldehyde Resin
The main objective of this work was to study a new inorganic adhesive used for wood-based panel. Inorganic adhesive and its poplar plywood were prepared to investigate their properties. Thermo-gravimetric analysis tests revealed that the total mass loss of inorganic adhesive was 76.24%, which was higher than that of phenol-formaldehyde resin (64.97%). The results showed better thermal stability of inorganic adhesive. For inorganic adhesive plywood, approximately 30% decrease in peak of heat release rate, 62% in total smoke production and 20% in mean CO2 yield, respectively, were seen compared to the control by cone calorimeter analysis. Scanning electron microscopy imaged wider glue line of inorganic adhesives plywood, which was related to the bonding strength of plywood. Thus the inorganic adhesive of fireproofing made in lab could be better used for plywood processing.