Homogeneous Liquid Crystal Molecules on Al2O3 Alignment Films Using Atomic Layer Deposition as a Function of Deposition Temperature

2016 ◽  
Vol 16 (8) ◽  
pp. 8402-8406 ◽  
Author(s):  
Gun-Young Lee ◽  
Hong-Gyu Park ◽  
Hae-Chang Jeong ◽  
Byeong-Yun Oh ◽  
Jeong-Min Han ◽  
...  
Keyword(s):  
Liquid Crystal ◽  
Atomic Layer Deposition ◽  
Deposition Temperature ◽  
Atomic Layer ◽  
Homogeneous Liquid ◽  
Layer Deposition

Atomic layer deposition of noble metals: Exploration of the low limit of the deposition temperature

2004 ◽  
Vol 19 (11) ◽  
pp. 3353-3358 ◽  
Author(s):  
Titta Aaltonen ◽  
Mikko Ritala ◽  
Yung-Liang Tung ◽  
Yun Chi ◽  
Kai Arstila ◽  
...  
Keyword(s):  
Atomic Layer Deposition ◽  
Seed Layer ◽  
Crystal Orientation ◽  
Deposition Temperature ◽  
Noble Metals ◽  
Film Growth ◽  
Atomic Layer ◽  
Temperature Limit ◽  
Pure Oxygen ◽  
Layer Deposition

The low limit of the deposition temperature for atomic layer deposition (ALD) of noble metals has been studied. Two approaches were taken; using pure oxygen instead of air and using a noble metal starting surface instead of Al2O3. Platinum thin films were obtained by ALD from MeCpPtMe3 and pure oxygen at deposition temperature as low as 200 °C, which is significantly lower than the low-temperature limit of300 °C previously reported for the platinum ALD process in which air was used as the oxygen source. The platinum films grown in this study had smooth surfaces, adhered well to the substrate, and had low impurity contents. ALD of ruthenium, on the other hand, took place at lower deposition temperatures on an iridium seed layer than on an Al2O3 layer. On iridium surface, ruthenium films were obtained from RuCp2 and oxygen at 225 °C and from Ru(thd)3 and oxygen at 250 °C, whereas no films were obtained on Al2O3 at temperatures lower than 275 and 325 °C, respectively. The crystal orientation of the ruthenium films was found to depend on the precursor. ALD of palladium from a palladium β-ketoiminate precursor and oxygen at 250 and 275 °C was also studied. However, the film-growth rate did not saturate to a constant level when the precursor pulse times were increased.

Non-laminated growth of chlorine-doped zinc oxide films by atomic layer deposition at low temperatures

2015 ◽  
Vol 3 (32) ◽  
pp. 8336-8343 ◽  
Author(s):  
Yong-June Choi ◽  
Kyung-Mun Kang ◽  
Hong-Sub Lee ◽  
Hyung-Ho Park
Keyword(s):  
Zinc Oxide ◽  
Atomic Layer Deposition ◽  
Low Temperatures ◽  
Deposition Temperature ◽  
Oxide Films ◽  
Atomic Layer ◽  
Zinc Oxide Films ◽  
Chlorine Doping ◽  
Layer Deposition ◽  
Low Deposition Temperature

Chlorine doping in a ZnO matrix to a concentration of 0.65 ± 0.05 at% was accomplished via atomic layer deposition using a home-made chlorine source at a low deposition temperature of 140 °C.

scholarly journals Positive onset potential and stability of Cu2O-based photocathodes in water splitting by atomic layer deposition of a Ga2O3buffer layer

2015 ◽  
Vol 8 (5) ◽  
pp. 1493-1500 ◽  
Author(s):  
Changli Li ◽  
Takashi Hisatomi ◽  
Osamu Watanabe ◽  
Mamiko Nakabayashi ◽  
Naoya Shibata ◽  
...  
Keyword(s):  
Atomic Layer Deposition ◽  
Water Splitting ◽  
Energy Band ◽  
Deposition Temperature ◽  
Atomic Layer ◽  
Band Alignment ◽  
Onset Potential ◽  
Layer Deposition

The improved energy band alignment of Pt/TiO2/Ga2O3/Cu2O structure results in a positive onset potential of ∼1 Vvs.RHE and a stable cathodic photocurrent under appropriate TiO2deposition temperature.

Atomic layer deposition prepared Al-doped ZnO for liquid crystal displays applications

2018 ◽  
Vol 50 (5) ◽  
Author(s):  
Y. C. Su ◽  
C. C. Chiou ◽  
V. Marinova ◽  
S. H. Lin ◽  
N. Bozhinov ◽  
...  
Keyword(s):  
Liquid Crystal ◽  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Liquid Crystal Displays ◽  
Layer Deposition ◽  
Doped Zno

Evaluation of Pb Precursors for Liquid Injection Atomic Layer Deposition of Pb(ZrxTi1-x)O3 Thin Films

2005 ◽  
Vol 902 ◽  
Author(s):  
Takayuki Watanabe ◽  
Susanne Hoffmann-Eifert ◽  
Cheol Seong Hwang ◽  
Rainer Waser
Keyword(s):  
Growth Rate ◽  
Thermal Decomposition ◽  
Atomic Layer Deposition ◽  
Deposition Rate ◽  
Deposition Temperature ◽  
Atomic Layer ◽  
Decomposition Temperature ◽  
Thermal Decomposition Temperature ◽  
Layer Deposition ◽  
Liquid Injection

AbstractPb(DPM)2 and Pb(TMOD)2 dissolved in ethylcyclohexane were evaluated as precursors for future atomic layer deposition (ALD) of Pb(Zr,Ti)O3 films. PbO films were deposited by a liquid injection atomic layer deposition on Pt-covered Si substrates at different deposition temperature and precursor volume per cycle. Pb(DPM)2 and Pb(TMOD)2 started thermal decomposition at deposition temperature of around 270°C and 320°C, respectively. Against increasing Pb(DPM)2 injection at 240°C, the deposition rate of PbO films saturated at around 1 Å/cycle, but kept increasing at 300°C, which is above the thermal decomposition temperature. The deposition rate of PbO films at 240°C dropped to a constant value with enough purge time after precursor injection and reactant supply. A saturated deposition rate of PbO films was also observed for Pb(TMOD)2 below the thermal decomposition temperature. However, the saturation behavior observed for Pb(TMOD)2 was slower and the saturated growth rate was higher comparing to Pb(DPM)2. In addition, the film thickness of the PbO films had an apparent gradient over the substrates. These results indicate that Pb(DPM)2 shows more reactive and stable chemisorption comparing to Pb(TMOD)2 for the self-limiting growth rate.

Sign in / Sign up

Export Citation Format

Share Document