Flame Retardant Properties and Mechanical Properties of Polypropylene with Halogen and Halogen-Free Flame Retardant System

In this study, to improve the flame retardancy properties of polypropylene, DBDPE/Sb2O3 and DBDPE/HBCD/Sb2O3 flame retardant systems were used for flame retardant PP, and a halogen-free flame retardant PP material was prepared using the one-component intumescent flame retardant PNP1D. Tensile tests, impact tests, ultimate oxygen index, UL94V-0 vertical combustion, thermogravimetric analysis, rheological analysis and scanning electron microscopy were used to study the flame retardant properties and mechanical properties of the flame retardant PP. The test results show that both the ultimate oxygen index of DBDPE/Sb2O3 compounded flame retardant PP and the ultimate oxygen index of PNP1D flame retardant PP are nearly double that of pure PP, passing the UL-94V-0 flame retardant standard. The thermal decomposition temperature range of DBDPE/Sb2O3 compounded system and the thermal decomposition temperature range of PNP1D flame retardant PP both completely cover the thermal decomposition temperature range of both the DBDPE/Sb2O3 compound system and PNP1D flame retardant PP completely covered the thermal decomposition temperature range of pure PP. The tensile and impact strength of the DBDPE/Sb2O3 flame retardant system with 10% SK-80 is 50% higher than that of the DBDPE/Sb2O3 flame retardant system without SK-80. The modified PP with 25% PNP1D is nearly 1 time higher than pure PP in terms of carbon formation and has an ideal flame retardant effect.

Investigating the Kinetics of the Thermolysis of 3-nitro-2,4-dihydro-3H-1,2,4-triazol-5-one (NTO) and Reduced Size NTO the Presence of Cobalt Ferrite Additive

Less sensitive high energetic materials (HEMs) are explored as a potential replacement of highly sensitive HEMs in propellants, and explosive applications. More research have been devoted to improve the thermal decomposition of such a less sensitive HEMs. Nanosize Cobalt ferrite (CoF) has been successfully synthesized using the co-precipitation method. Synthesis of less sensitive HEM 3-nitro-2,4-dihydro-3H-1,2,4-triazol-5-one(NTO) and its size reduction using solvent-antisolvent method is successfully achieved. Effect of 5 % by weight CoF on the thermolysis of NTO and NTO with reduced size (r-NTO) has been studied using the simultaneous thermal analysis. Three isoconversional methods namely Flynn Ozawa Wall, Kissinger-Akahira-Sunose (KAS), and Starink are employed to evaluate the kinetic parameter of NTO, and r-NTO in the presence of CoF additive. It was found that both the addition of CoF as well as reducing size of NTO can decrease the thermal decomposition temperature of NTO, the later decreasing the thermal decomposition temperature to a good extent compared to former. However, the kinetic study using isoconversional methods suggested that in the presence of CoF additive, the activation energy of both NTO as well as n-NTO is increased.

Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure

As the miniaturization of electronic appliances and microprocessors progresses, low-permittivity interlayer materials are becoming increasingly important for their suppression of electronic crosstalk, signal propagation delay and loss, and so forth. Herein, a kind of copolyimide (CPI) film with a “fluorene” rigid conjugated structure was prepared successfully. By introducing 9,9-Bis(3-fluoro-4-aminophenyl) fluorene as the rigid conjugated structure monomer, a series of CPI films with different molecular weights were fabricated by in situ polymerization, which not only achieved the reduction of permittivity but also maintained excellent thermodynamic stability. Moreover, the hydrophobicity of the CPI film was also improved with the increasing conjugated structure fraction. The lowest permittivity reached 2.53 at 106 Hz, while the thermal decomposition temperature (Td5%) was up to 530 °C, and the tensile strength was ≥ 96 MPa. Thus, the CPI films are potential dielectric materials for microelectronic and insulation applications.

Measurement of Thermal Decomposition Temperature and Rate of Sodium Hydride

In decommissioning sodium-cooled fast reactors, the operators can be exposed to radiation during dismantling of cold trap equipment (C/T). The C/T is higher dose equipment because the C/T trapped tritium of fission products during the operation to purify the sodium coolant. In this study, thermal decomposition temperature and rate of sodium hydride (NaH) were measured as a fundamental research for development of “thermolysis” process prior to the dismantling. We measured the thermal decomposition temperature and rate using NaH powder (95.3%, Sigma-Aldrich) in alumina pan with ThermoGravimetry-Differential Thermal Analysis (TG-DTA) instrument (STA2500 Regulus, NETZSCH Japan). The heating rates of TG-DTA were set to β = 2.0, 5.0, 10.0 and 20.0 K/min. The DTA showed endothermic reaction and the TG showed two-steps mass-loss over 580K. This first-step mass-loss was consistent with change of chemical composition of the NaH with heating (NaH → Na+1/2H2). The thermal decomposition temperature and rate were obtained from the onset temperature of the mass-loss and the simplified Kissinger plots, respectively. Furthermore, we set to the thermal decomposition temperature of around 590K, and the mass-loss rates were measured. As a result, over 590K, the thermal decomposition occurred actively, and showed good agreement with the estimation curves obtained by the simplified Kissinger plots. The thermal decomposition rate strongly depended on the heating temperature.

Polyimide-Based PolyHIPEs Prepared via Pickering High Internal Phase Emulsions

Pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) oligoimide particles and PMDA-ODA poly(amic acid) salt (PAAS) were synthesized and used as stabilizers to prepare oil-in-water Pickering high internal phase emulsions (HIPEs). The stability of the Pickering HIPEs was investigated by dispersion stability analysis. Polyimide-based polyHIPEs could be prepared through freeze-drying and subsequent thermal imidization of the Pickering HIPEs. The characteristics of the polyHIPEs, including their morphology, porosity, thermal decomposition temperature, and compression modulus, were investigated. The thermal decomposition temperature (T10) of the polyHIPEs was very high (>530 °C), and their porosity was as high as 92%. The polyimide-based polyHIPEs have the potential to be used in high-temperature environments.

Colorless Semi-Alicyclic Copolyimides with High Thermal Stability and Solubility

A series of colorless copolyimide films with high thermal stability and good solubility are synthesized from (trifluoromethyl)biphenyl-4,4’-diamine (TFMB) with different 1,2,4,5-cyclohexanetetracarboxylic dianhydride (HPMDA) to 2,2-bis(3,4-dicarboxyphenyl)-hexafluoropropane (6FDA) dianhydride mole ratios through one-pot solution polycondensation. These copolyimide films exhibit excellent optical transparency (T400 > 90% and λ0 ~305–333 nm) with a thickness of 15 μm and good solubility in most organic solvents. The excellent optical properties are mainly attributed to the low inter- and intra-molecular charge transfer interactions due to the alicyclic structure and the strong electronegative CF3 groups. The glass transition temperature increases from 332 to 352 °C with increasing HPMDA content in the copolymers, while the thermal decomposition temperature is improved with increasing 6FDA content. These results indicate that the copolyimide films can be successfully utilized in the development of novel heat-resistant plastic substrates for the optoelectronic engineering applications.

Improved Wear Resistance of UHMWPE Fibers by Modified Nano-Graphite

Single ultra-high molecular weight polyethylene (UHMWPE) fiber was modified by modified nano-graphite (NG) in wear resistance. Wear resistance, tensile strength, thermogravimetric analysis (TGA) were used to characterize the effect of modified NG on the properties of UHMWPE fiber. The results showed that with the increasing content of modified NG, the wear resistance of UHMWPE fiber was enhanced and its tensile strength was decreased. Considering the tensile strength and wear resistance of fiber, the optimum content of modified NG in UHMWPE fiber was around 0.58%. At this content, the wear resistance and thermal decomposition temperature of UHMWPE fiber were increased 1.88 times and 50°C respectively than pure UHMWPE fiber.