Pulse Electroplating of Ni–W Alloy for the Diffusion Barrier in Under Bump Metallurgy

2021 ◽  
Vol 21 (5) ◽  
pp. 3016-3019
Author(s):  
Seo-Hyang Lee ◽  
Jae-Ho Lee
Keyword(s):  
Diffusion Barrier ◽  
Shear Force ◽  
Solder Ball ◽  
Surface Hardness ◽  
Surface Cracks ◽  
Pulse Electroplating ◽  
Citrate Bath

Ni–W alloy was electroplated from citrate bath. The crack-free coatings were obtained using the pulse electroplating method. The surface hardness was increased up to 700 Hv and it is twice as high than that of the electroplated Ni. The surface hardness was increased as the content of W in the coating increased. However, the higher W contents made surface cracks and the surface hardness was decreased. Ni–W alloy made less intermetallic components (IMC) and the shear force of solder ball was increased as much as 20% compared with conventional Ni plating.

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode

2011 ◽  
Author(s):  
Takahiro Kano ◽  
Ikuo Shohji ◽  
Tetsuyuki Tsuchida ◽  
Toshikazu Ookubo
Keyword(s):  
Reaction Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Lead Free ◽  
Joint Interface ◽  
Lead Free Solder ◽  
Solder Balls ◽  
Free Solder ◽  
Ball Joints ◽  
Electroless Ni

An electroless Ni/Pd/Au plated electrode is expected to be used as an electrode material for lead-free solder to improve joint reliability. The aim of this study is to investigate the effect of the thickness of the Pd layer on joint properties of the lead-free solder joint with the electroless Ni/Pd/Au plated electrode. Solder ball joints were fabricated with Sn-3Ag-0.5Cu (mass%) lead-free solder balls and electroless Ni/Pd/Au and Ni/Au plated electrodes. Ball shear force and microstructure of the joint were investigated. The (Cu,Ni)6Sn5 reaction layer formed in the joint interface in all specimens. The thickness of the reaction layer decreased with increasing the thickness of the Pd layer. In the joint with a Pd layer 0.36 μm thick, the remained Pd layer was observed in the joint interface. In the joint, impact shear force decreased compared with that of the joint without the remained Pd layer. On the contrary, when the thickness of the Pd layer was less than 0.36 μm, the Pd layer was not remained in the joint interface and impact shear force improved. Impact shear force of the joint with the electroless Ni/Pd/Au plated electrode was higher than that with the electroless Ni/Au one.

Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

2003 ◽  
Vol 125 (4) ◽  
pp. 617-620 ◽  
Author(s):  
Tan Chee Wei ◽  
Abdul Razak Daud
Keyword(s):  
Electrical Properties ◽  
Shear Force ◽  
Intermetallic Layer ◽  
Surface Hardness ◽  
Threshold Value ◽  
Mechanical And Electrical Properties ◽  
Bonding System ◽  
Ball Shear Test ◽  
Aging Test ◽  
Bonding Systems

Mechanical and electrical properties of the Au-Al intermetallics layer were compared to the Cu-Al intermetallics layer. A thermal aging test was used to expedite the formation and growth of the intermetallics layer. Dynamic hardness, surface hardness, and intermetallic thickness of both bonding systems was compared. Unencapsulated samples were subjected to a ball shear test while encapsulated samples were electrically tested. Results showed that the Cu-Al intermetallics layer is relatively harder than Au-Al. Both intermetallic thicknesses grow linearly at about 18.0 and 0.07 nm/h, respectively, but the Au-Al intermetallic layer is 20 times thicker than Cu-Al before the aging test. The 1.5-μm growth of Au-Al intermetallic thickness acquired an additional shear force of 160 gf. The threshold value of the intermetallics layer thickness for the Au-Al and Cu-Al bonding system is 3.8 and 0.14 μm, respectively, before it shows degradation in shear force. Electrical resistance for the Au-Al system is higher than the Cu-Al system, especially at higher aging readout points.

Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength

2006 ◽  
Vol 510-511 ◽  
pp. 546-549 ◽  
Author(s):  
Jong Woong Kim ◽  
Seung Boo Jung
Keyword(s):  
Finite Element ◽  
Computational Modeling ◽  
Finite Element Modeling ◽  
Failure Mode ◽  
Shear Force ◽  
Joint Strength ◽  
Solder Ball ◽  
Void Formation ◽  
Mechanical Joint ◽  
Solder Balls

The effects of void formation on the joint strength and failure mode of the solder joints were examined. A computational modeling technique, i.e., finite element modeling, was employed to investigate the effects. The effects of location, size and number of void were also investigated and compared with the case that has no void in the solder ball. When there was 1 or more voids in the solder ball, the joint strength decreased regardless of the location, size, and number of voids. Especially, the shear force of the joints decreased about 50% when 3 voids were formed in the solder ball. From the stress analyses, the possibility of preliminary brittle interfacial failure should be lower when voids were formed in the solder ball.

scholarly journals Characteristics of Electomigration & Surface Hardness about Tungsten-Carbon-Nitrogen(W-C-N) Related Diffusion Barrier

2009 ◽  
Vol 18 (3) ◽  
pp. 203-207 ◽  
Author(s):  
Soo-In Kim ◽  
Young-Joo Hwang ◽  
Dong-Shik Ham ◽  
Jae-Kue Nho ◽  
Jae-Yun Lee ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Surface Hardness

Transmembrane Calcium Influx Associated with von Willebrand Factor Binding to GP Ib in the Initiation of Shear-Induced Platelet Aggregation

1993 ◽  
Vol 69 (05) ◽  
pp. 496-502 ◽  
Author(s):  
Yasuo Ikeda ◽  
Makoto Handa ◽  
Tetsuji Kamata ◽  
Koichi Kawano ◽  
Yohko Kawai ◽  
...  
Keyword(s):  
Shear Force ◽  
Calcium Influx ◽  
Fold Increase ◽  
Intracellular Camp ◽  
Recombinant Fragment ◽  
Transmembrane Flux ◽  
Irreversible Aggregation ◽  
Von Willebrand ◽  
Willebrand Factor ◽  
Camp Levels

SummaryWe found that the binding of multimeric vWF to GP Ib under a shear force of 108 dynes/cm2 resulted in the transmembrane flux of Ca2+ ions with a two-to three-fold increase in their intracellular concentration ([Ca2+]i). The blockage of this event, obtained by inhibiting the vWF-GP Ib interaction, suppressed aggregation. In contrast, the blockage of vWF binding to GP IIb-IIIa, as well as the prevention of activation caused by increased intracellular cAMP levels, inhibited aggregation but had no significant effect on [Ca2+]i increase. A monomeric recombinant fragment of vWF containing the GP Ib-binding domain of the molecule (residues 445-733) prevented all effects mediated by multimeric vWF but, by itself, failed to support the increase in [Ca2+]i and aggregation. These results suggest that the binding of multimeric vWF to GP Ib initiates platelets aggregation induced by high shear stress by mediating a transmembrane flux of Ca2+ ions, perhaps through a receptor-dependent calcium channel. The increase in [Ca2+]i may act as an intracellular message and cause the activation of GP IIb-IIIa; the latter receptor then binds vWF and mediates irreversible aggregation.

Effect of silver nitrate on some mechanical properties of heat polymerizing acrylic resins

2019 ◽  
Vol 14 (1) ◽  
pp. 110
Author(s):  
Assiss. Prof. Dr. Sabiha Mahdi Mahdi ◽  
Dr. Firas Abd K. Abd K.
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Silver Nitrate ◽  
Surface Hardness ◽  
Mechanical Tests ◽  
Hardness Tester ◽  
Acrylic Resins ◽  
The Difference

Aim: The aimed study was to evaluate the influence of silver nitrate on surfacehardness and tensile strength of acrylic resins.Materials and methods: A total of 60 specimens were made from heat polymerizingresins. Two mechanical tests were utilized (surface hardness and tensile strength)and 4 experimental groups according to the concentration of silver nitrate used.The specimens without the use of silver nitrate were considered as control. Fortensile strength, all specimens were subjected to force till fracture. For surfacehardness, the specimens were tested via a durometer hardness tester. Allspecimens data were analyzed via ANOVA and Tukey tests.Results: The addition of silver nitrate to acrylic resins reduced significantly thetensile strength. Statistically, highly significant differences were found among allgroups (P≤0.001). Also, the difference between control and experimental groupswas highly significant (P≤0.001). For surface hardness, the silver nitrate improvedthe surface hardness of acrylics. Highly significant differences were statisticallyobserved between control and 900 ppm group (P≤0.001); and among all groups(P≤0.001)with exception that no significant differences between control and150ppm; and between 150ppm and 900ppm groups(P>0.05).Conclusion: The addition of silver nitrate to acrylics reduced significantly the tensilestrength and improved slightly the surface hardness.

Effect of light intensity and water aging on surface hardness of dental resin-composites

2019 ◽  
Vol 64 (11) ◽  
pp. 1007-1014
Author(s):  
Tong XU ◽  
◽  
Jia-Hui ZHANG ◽  
Zhao-Ying LIU ◽  
Xuan LI ◽  
...  
Keyword(s):  
Light Intensity ◽  
Surface Hardness ◽  
Resin Composites ◽  
Dental Resin ◽  
Dental Resin Composites ◽  
Effect Of Light
Sign in / Sign up

Export Citation Format

Share Document