Design of a Capacitorless Dynamic Random Access Memory Based on Junctionless Dual-Gate Field-Effect Transistor with a Silicon-Germanium/Silicon Nanotube

2021 ◽  
Vol 21 (8) ◽  
pp. 4235-4242
Author(s):  
Sang Ho Lee ◽  
Min Su Cho ◽  
Hye Jin Mun ◽  
Jin Park ◽  
Hee Dae An ◽  
...  

In this paper, a 1T-DRAM based on the junctionless field-effect transistor (JLFET) with a silicon-germanium (SiGe) and silicon (Si) nanotube structure was designed and investigated by using technology computer-aided design (TCAD) simulations. Utilizing bandgap engineering to make a quantum well in the core–shell structure, the storage pocket is formed by the difference in bandgap energy between SiGe and Si. By applying different voltage conditions at the inner gate and outer gate, excess holes are generated in the storage region by the band-to-band tunneling (BTBT) mechanism. The BTBT mechanism results in the floating body effect, which is the principle of 1T-DRAM. The varying amount of the accumulated holes in the SiGe region allows differentiating between state “1” and state “0.” Additionally, the outer gate plays a role of the conventional gate, while the inner gate retains holes in the hold state by applying voltage. Consequently, the optimized SiGe/Si JLFET-based nanotube 1T-DRAM achieved a high sensing margin of 15.4 μA/μm, and a high retention time of 105 ms at a high temperature of 358 K. In addition, it has been verified that a single cycle of 1T-DRAM operations consumes only 33.6 fJ of energy, which is smaller than for previously proposed 1T-DRAMs.

2021 ◽  
Author(s):  
Dharmender Nishad ◽  
Kaushal Nigam ◽  
Satyendra Kumar

Abstract Temperature-induced performance variation is one of the main concerns of the conventional stack gate oxide double gate tunnel field-effect transistor (SGO-DG-TFET). In this regard, we investigate the temperature sensitivity of extended source double gate tunnel field-effect transistor (ESDG-TFET). For this, we have analyzed the effect of temperature variations on the transfer characteristics, analog/RF, linearity and distortion figure of merits (FOMs) using technology computer aided design (TCAD) simulations. Further, the temperature sensitivity performance is compared with conventional SGO-DG-TFET. The comparative analysis shows that ESDG-TFET is less sensitive to temperature variations compared to the conventional SGO-DG-TFET. Therefore, this indicates that ESDG-TFET is more reliable for low-power, high-frequency applications at a higher temperature compared to conventional SGO-DG-TFET.


Micromachines ◽  
2019 ◽  
Vol 10 (1) ◽  
pp. 30 ◽  
Author(s):  
Jang Hyun Kim ◽  
Hyun Woo Kim ◽  
Garam Kim ◽  
Sangwan Kim ◽  
Byung-Gook Park

In this paper, a novel tunnel field-effect transistor (TFET) has been demonstrated. The proposed TFET features a SiGe channel, a fin structure and an elevated drain to improve its electrical performance. As a result, it shows high-level ON-state current (ION) and low-level OFF-state current (IOFF); ambipolar current (IAMB). In detail, its ION is enhanced by 24 times more than that of Si control group and by 6 times more than of SiGe control group. The IAMB can be reduced by up to 900 times compared with the SiGe control group. In addition, technology computer-aided design (TCAD) simulation is performed to optimize electrical performance. Then, the benchmarking of ON/OFF current is also discussed with other research group’s results.


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