The dislocation content of some near-coincidence grain boundaries in polycrystalline silicon

2020 ◽  
pp. 39-44
Author(s):  
Y S Oei ◽  
F W Schapink ◽  
S Radelaar
Keyword(s):  
Grain Boundaries ◽  
Polycrystalline Silicon ◽  
Dislocation Content

Grain Boundary Structures and Properties in Polycrystalline Silicon

1981 ◽  
Vol 5 ◽  
Author(s):  
Y.S. Tsuo ◽  
J.B. Milstein ◽  
T. Surek
Keyword(s):  
Grain Boundaries ◽  
Polycrystalline Silicon ◽  
Physical Vapor Deposition ◽  
Growth Parameters ◽  
Defect Structures ◽  
Photovoltaic Properties ◽  
Structures And Properties ◽  
Silicon Materials ◽  
Silicon Sheet ◽  
Ribbon Growth

ABSTRACTThe method of preparation of polycrystalline silicon can have a strong influence on the types and distributions of grain boundaries, and thereby influence the electrical properties of devices made from such materials. Examples of methods employed in the preparation of polycrystalline silicon for solar cell applications include directional solidification (Czochralski pulling and various casting techniques), ribbon growth techniques (ribbon-to-ribbon, edgedefined film-fed growth, low-angle silicon sheet growth, edge supported pulling, silicon-on-ceramic), chemical and physical vapor deposition (CVD and PVD) on silicon and foreign substrates, recrystallization techniques (laser, electron beam), and others such as graphoepitaxy and electrodeposition. This paper reviews the important morphological features such as grain size and defect structures of the various polycrystalline silicon materials and the influence of growth parameters on these features. The effects of grain boundaries on the electrical and photovoltaic properties of various polycrystalline silicon materials will also be discussed.

Imaging Electron Transport across Grain Boundaries in an Integrated Electron and Atomic Force Microscopy Platform: Application to Polycrystalline Silicon Solar Cells

2009 ◽  
Vol 1153 ◽  
Author(s):  
Manuel J Romero ◽  
Fude Liu ◽  
Oliver Kunz ◽  
Johnson Wong ◽  
Chun-Sheng Jiang ◽  
...  
Keyword(s):  
Thin Films ◽  
Atomic Force Microscopy ◽  
Solar Cells ◽  
Electron Transport ◽  
Grain Boundaries ◽  
Polycrystalline Silicon ◽  
High Energy ◽  
Dominant Factor ◽  
Force Microscopy ◽  
Atomic Force

AbstractWe have investigated the local electron transport in polycrystalline silicon (pc-Si) thin-films by atomic force microscopy (AFM)-based measurements of the electron-beam-induced current (EBIC). EVA solar cells are produced at UNSW by <i>EVAporation</i> of a-Si and subsequent <i>solid-phase crystallization</i>–a potentially cost-effective approach to the production of pc-Si photovoltaics. A fundamental understanding of the electron transport in these pc-Si thin films is of prime importance to address the factors limiting the efficiency of EVA solar cells. EBIC measurements performed in combination with an AFM integrated inside an electron microscope can resolve the electron transport across individual grain boundaries. AFM-EBIC reveals that most grain boundaries present a high energy barrier to the transport of electrons for both p-type and n-type EVA thin-films. Furthermore, for p-type EVA pc-Si, in contrast with n-type, charged grain boundaries are seen. Recombination at grain boundaries seems to be the dominant factor limiting the efficiency of these pc-Si solar cells.

Electrical Properties of Polycrystalline-Silicon Thin Films for VLSI

1986 ◽  
Vol 71 ◽  
Author(s):  
T I Kamins
Keyword(s):  
Electrical Properties ◽  
Integrated Circuits ◽  
Single Crystal ◽  
Grain Boundaries ◽  
Polycrystalline Silicon ◽  
Crystalline Silicon ◽  
Single Crystal Silicon ◽  
Active Regions ◽  
Crystal Silicon ◽  
Polysilicon Film

AbstractThe electrical properties of polycrystalline silicon differ from those of single-crystal silicon because of the effect of grain boundaries. At low and moderate dopant concentrations, dopant segregation to and carrier trapping at grain boundaries reduces the conductivity of polysilicon markedly compared to that of similarly doped single-crystal silicon. Because the properties of moderately doped polysilicon are limited by grain boundaries, modifying the carrier traps at the grain boundaries by introducing hydrogen to saturate dangling bonds improves the conductivity of polysilicon and allows fabrication of moderate-quality transistors with their active regions in the polycrystalline films. Removing the grain boundaries by melting and recrystallization allows fabrication of high-quality transistors. When polysilicon is used as an interconnecting layer in integrated circuits, its limited conductivity can degrade circuit performance. At high dopant concentrations, the active carrier concentration is limited by the solid solubility of the dopant species in crystalline silicon. The current through oxide grown on polysilicon can be markedly higher than that on oxide of similar thickness grown on singlecrystal silicon because the rough surface of a polysilicon film enhances the local electric field in oxide thermally grown on it. Consequently, the structure must be controlled to obtain reproducible conduction through the oxide. The differences in the behavior of polysilicon and single-crystal silicon and the limited electrical conductivity in polysilicon are having a greater impact on integrated circuits as the feature size decreases and the number of devices on a chip increases in the VLSI era.

scholarly journals Characterization of Defects and Stress in Polycrystalline Silicon Thin Films on Glass Substrates by Raman Microscopy

2011 ◽  
Vol 2011 ◽  
pp. 1-14 ◽  
Author(s):  
Kuninori Kitahara ◽  
Toshitomo Ishii ◽  
Junki Suzuki ◽  
Takuro Bessyo ◽  
Naoki Watanabe
Keyword(s):  
Grain Boundaries ◽  
Polycrystalline Silicon ◽  
Solid Phase ◽  
Raman Microscopy ◽  
Laser Crystallization ◽  
Local Vibration ◽  
Optical Phonon Mode ◽  
Glass Substrates ◽  
Silicon Thin Films ◽  
Si Films

Raman microscopy was applied to characterize polycrystalline silicon (poly-Si) on glass substrates for application as thin-film transistors (TFTs) integrated on electronic display panels. This study examines the crystallographic defects and stress in poly-Si films grown by industrial techniques: solid phase crystallization and excimer laser crystallization (ELC). To distinguish the effects of defects and stress on the optical-phonon mode of the Si–Si bond, a semiempirical analysis was performed. The analysis was compared with defect images obtained through electron microscopy and atomic force microscopy. It was found that the Raman intensity for the ELC film is remarkably enhanced by the hillocks and ridges located around grain boundaries, which indicates that Raman spectra mainly reflect the situation around grain boundaries. A combination of the hydrogenation of films and the observation of the Si-hydrogen local-vibration mode is useful to support the analysis on the defects. Raman microscopy is also effective for detecting the plasma-induced damage suffered during device processing and characterizing the performance of Si layer in TFTs.

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