Preparation of MoS2 thin films by chemical vapor deposition

1994 ◽  
Vol 9 (6) ◽  
pp. 1474-1483 ◽  
Author(s):  
Woo Y. Lee ◽  
Theodore M. Besmann ◽  
Michael W. Stott
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Thermodynamic Analysis ◽  
Vapor Deposition ◽  
Substrate Surface ◽  
Chemical Vapor ◽  
Precursor Concentration ◽  
Wide Range ◽  
Thermochemical Stability

The chemical vapor deposition (CVD) of MoS2 by reaction of H2S with molybdenum halides was determined to be thermodynamically favored over a wide range of temperature, pressure, and precursor concentration conditions as long as excess H2S was available. The thermochemical stability of H2S, MoF6, and MoCI5 was also assessed to address their suitability as precursors for the CVD of MoS2. The results from the thermodynamic analysis were used as guidance in the deposition of MoS2 thin films from MoF6 and H2S. The (002) basal planes of MoS2 films deposited above 700 K were preferentially oriented perpendicular to the substrate surface.

Gas-phase diffusion and surface reaction as limiting mechanisms in the aerosol-assisted chemical vapor deposition of TiO2 films from titanium diisopropoxide

2006 ◽  
Vol 21 (12) ◽  
pp. 3205-3209 ◽  
Author(s):  
A. Conde-Gallardo ◽  
M. Guerrero ◽  
R. Fragoso ◽  
N. Castillo
Keyword(s):  
Chemical Vapor Deposition ◽  
Gas Phase ◽  
Vapor Deposition ◽  
Surface Reaction ◽  
Crystalline Silicon ◽  
Substrate Surface ◽  
Chemical Vapor ◽  
Thermal Reaction ◽  
Phase Diffusion ◽  
Wide Range

Titanium dioxide thin films were deposited on crystalline silicon (100) substrates by delivering a liquid aerosol of titanium-diisopropoxide. The evidence of a metalorganic chemical vapor deposition process observed in the crystalline and morphological features of the films is strongly supported by the behavior of the growth rate rg as a function of the deposition temperature. The rg line shape indicates that in a wide range of temperatures (∼180–400 °C), the film formation is limited by both gas-phase diffusion of some molecular species toward the substrate surface and the thermal reaction of those species on that surface. The activation energy EA that characterizes the surface reaction depends somewhat on the precursor concentration; a fitting procedure to an equation that takes into account both limiting mechanisms (gas-phase diffusion + surface reaction) yields EA ≃ 27.6 kJ/mol.

Single molecular precursor metal-organic chemical vapor deposition of MgAl2O4 thin films

1994 ◽  
Vol 9 (6) ◽  
pp. 1333-1336 ◽  
Author(s):  
Jiming Zhang ◽  
Gregory T. Stauf ◽  
Robin Gardiner ◽  
Peter Van Buskirk ◽  
John Steinbeck
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Liquid Solution ◽  
Organic Chemical ◽  
Starting Compound ◽  
Wide Range ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

MgAl2O4 films have been grown epitaxially on both Si(100) and MgO(100) by a novel single source metal-organic chemical vapor deposition (MOCVD) process. A single molecular source reagent [magnesium dialuminum isopropoxide, MgAl2(OC3H7)8] having the desired Mg: Al ratio was dissolved in a liquid solution and flash-vaporized into the reactor. Both thermal and plasma-enhanced MOCVD were used to grow epitaxial MgAl2O4 thin films. The Mg: Al ratio in the deposited films was the same as that of the starting compound (Mg: Al = 1:2) over a wide range of deposition conditions. The deposition temperature required for the formation of crystalline spinel was found to be significantly reduced and crystallinity was much improved on Si by using a remote plasma-enhanced MOCVD process. The epitaxial nature of the MgAl2O4 films was established by x-ray pole figure analysis.

Growth of Ge-on-Si Structures using Remote Plasma-Enhanced Chemical Vapor Deposition

1992 ◽  
Vol 281 ◽  
Author(s):  
Rong Z. Qian ◽  
D. Kinosky ◽  
A. Mahajan ◽  
S. Thomas ◽  
J. Fretwell ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Substrate Surface ◽  
Chemical Vapor ◽  
Buffer Layers ◽  
Remote Plasma ◽  
Tem Analysis ◽  
Cross Sectional ◽  
Si Substrates ◽  
Wide Range

ABSTRACTRemote Plasma-enhanced Chemical Vapor Deposition (RPCVD) has been successfully used to grow GexSi1−x/Si (x = 0.1 – 1.0) heteroepitaxial structures at low temperatures (∼450°C). This technique utilizes a noble gas (Ar or He) r-f plasma to decompose reactant gases (SiH4 and GeH4) and drive the chemical deposition reactions in the gas phase as well as on the substrate surface. Growth of pure Ge on Si is of great interest because it provides a promising technique for making suitable low-cost substrates for thin-film Ge photodetectors as well as GaAs devices on Si substrates. The realization of these applications depends on the ability to grow high-quality epitaxial Ge layers on Si substrates. Since GaAs is lattice matched to Ge, growth of Ge layers on Si substrates with good crystalline perfection would permit the integration of GaAs and Si devices. Islanding was observed after the growth of pure Ge films directly on Si(100) for a wide range of plasma powers (7W ∼ 16W) in RPCVD. Cross-sectional TEM analysis showed that the islands have complicated facet structures, including {311} planes. Graded Gex Si1−x buffer layers with different Ge profiles have been used prior to the growth of Ge. It was found that uniform Ge films can be obtained using a buffer with an abrupt Ge profile, and the dislocation density in the Ge film decreases with increasing distance from the substrate.

Chemical vapor deposition of superconducting Bi-Sr-Ca-Cu-O films using fluorocarbon-based precursors

1990 ◽  
Vol 5 (1) ◽  
pp. 1-4 ◽  
Author(s):  
Masanori Nemoto ◽  
Mitsugu Yamanaka
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Diffraction Data ◽  
Vapor Deposition ◽  
Substrate Surface ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
X Ray ◽  
Resistivity Measurements ◽  
First Time

Superconducting Bi-Sr-Ca-Cu-O thin films have been prepared for the first time by chemical vapor deposition using triphenyl bismuth and fluorocarbon-based chelates such as bis(hexafluoroacetylacetonate)strontium, bis(hexafluoroacetylacetonate)calcium, and bis(hexafluoroacetylacetonate)copper. After annealing in air, x-ray diffraction data reveal that the films deposited on (001) SrTiO3 substrates have preferential orientation of their crystalline c-axis perpendicular to the substrate surface. Four-probe resistivity measurements reveal the onset of superconductivity at 80 K and zero resistivity at 50 K.

{10} edge dislocations in YSZ films grown on (100)MgO by PLD

1994 ◽  
Vol 52 ◽  
pp. 530-531
Author(s):  
Jason R. Heffelfinger ◽  
C. Barry Carter
Keyword(s):  
Thin Films ◽  
Semiconductor Lasers ◽  
Vapor Deposition ◽  
Substrate Surface ◽  
Laser System ◽  
Average Energy ◽  
Target Material ◽  
Chemical Vapor ◽  
Buffer Layers ◽  
Organic Chemical

Yttria-stabilized zirconia (YSZ) is currently used in a variety of applications including oxygen sensors, fuel cells, coatings for semiconductor lasers, and buffer layers for high-temperature superconducting films. Thin films of YSZ have been grown by metal-organic chemical vapor deposition, electrochemical vapor deposition, pulse-laser deposition (PLD), electron-beam evaporation, and sputtering. In this investigation, PLD was used to grow thin films of YSZ on (100) MgO substrates. This system proves to be an interesting example of relationships between interfaces and extrinsic dislocations in thin films of YSZ.In this experiment, a freshly cleaved (100) MgO substrate surface was prepared for deposition by cleaving a lmm-thick slice from a single-crystal MgO cube. The YSZ target material which contained 10mol% yttria was prepared from powders and sintered to 85% of theoretical density. The laser system used for the depositions was a Lambda Physik 210i excimer laser operating with KrF (λ=248nm, 1Hz repetition rate, average energy per pulse of 100mJ).

High Band Gap Nanocrystalline Tungsten Carbide (nc-WC) Thin Films Grown by Hot Wire Chemical Vapor Deposition (HW-CVD) Method

2018 ◽  
Vol 10 (3) ◽  
pp. 03001-1-03001-6 ◽  
Author(s):  
Bharat Gabhale ◽  
◽  
Ashok Jadhawar ◽  
Ajinkya Bhorde ◽  
Shruthi Nair ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Tungsten Carbide ◽  
Band Gap ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Hot Wire ◽  
Cvd Method ◽  
High Band

NITROGEN INCORPORATED HYDROGENATED AMORPHOUS CARBON THIN FILMS DEPOSITED BY MICROWAVE SURFACE-WAVE PLASMA CHEMICAL VAPOR DEPOSITION

2009 ◽  
Vol 23 (09) ◽  
pp. 2159-2165 ◽  
Author(s):  
SUDIP ADHIKARI ◽  
MASAYOSHI UMENO
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Surface Wave ◽  
Amorphous Carbon ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Plasma Chemical ◽  
Hydrogenated Amorphous Carbon ◽  
Plasma Chemical Vapor Deposition ◽  
Hydrogenated Amorphous

Nitrogen incorporated hydrogenated amorphous carbon (a-C:N:H) thin films have been deposited by microwave surface-wave plasma chemical vapor deposition on silicon and quartz substrates, using helium, methane and nitrogen ( N 2) as plasma source. The deposited a-C:N:H films were characterized by their optical, structural and electrical properties through UV/VIS/NIR spectroscopy, Raman spectroscopy, atomic force microscope and current-voltage characteristics. The optical band gap decreased gently from 3.0 eV to 2.5 eV with increasing N 2 concentration in the films. The a-C:N:H film shows significantly higher electrical conductivity compared to that of N 2-free a-C:H film.

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