Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys

2008 ◽  
Vol 23 (12) ◽  
pp. 3303-3308 ◽  
Author(s):  
Chien-Neng Liao ◽  
Ching-Hua Lee
Keyword(s):  
Reaction Time ◽  
Layered Structure ◽  
Controlled Growth ◽  
Square Root ◽  
Solder Alloys ◽  
Cu Content ◽  
Cu Alloys ◽  
Diffusion Controlled ◽  
Morphology Changes

Reactions of molten Sn–xCu (x = 0.05 to 1.0) alloys with Te substrate at 250 °C were investigated. A dosage of 0.1 wt% Cu in Sn is found to be effective in suppressing the vigorous Sn/Te reaction by forming a thin CuTe at the solder/Te interface. The CuTe morphology changes from irregular clusters into a layered structure with increasing Cu content in Sn. With the same reaction time, the CuTe thickness increases proportionally to the square root of Cu content in Sn–Cu alloys, suggesting a diffusion-controlled growth for CuTe.

Modeling the Diffusion-Controlled Growth of Needle and Plate-Shaped Precipitates

2002 ◽  
Vol 731 ◽  
Author(s):  
Z. Guo ◽  
W. Sha
Keyword(s):  
Free Energy ◽  
Transformation Strain ◽  
Interfacial Free Energy ◽  
Growth Theory ◽  
Controlled Growth ◽  
Precipitate Morphology ◽  
Interface Kinetics ◽  
Diffusion Controlled ◽  
Precipitate Growth ◽  
Strain Stress

AbstractVarious theories have been developed to describe the diffusion-controlled growth of precipitates with shapes approximating needles or plates. The most comprehensive one is due to Ivantsov, Horvay and Cahn, and Trivedi (HIT theory), where all the factors that may influence the precipitate growth, i.e. diffusion, interface kinetics and capillarity, are accounted for within one equation. However, HIT theory was developed based on assumptions that transformation strain/stress and interfacial free energy are isotropic, which are not true in most of the real systems. An improved growth theory of precipitates of needle and plate shapes was developed in the present study. A new concept, the compression ratio, was introduced to account for influences from the anisotropy of transformation strain/stress and interfacial free energy on the precipitate morphology. Experimental evidence supports such compression effect. Precipitate growth kinetics were quantified using this concept. The improved HIT theory (IHIT theory) was then applied to study the growth of Widmanstatten austenite in ferrite in Fe-C-Mn steels. The calculated results agree well with the experimental observations.

scholarly journals Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2335
Author(s):  
Jialong Qiu ◽  
Yanzhi Peng ◽  
Peng Gao ◽  
Caiju Li
Keyword(s):  
Tensile Strength ◽  
Solder Alloy ◽  
Tensile Tests ◽  
Melting Behavior ◽  
Second Phase ◽  
Solder Alloys ◽  
Cu Content ◽  
Diffusion Force ◽  
Fine Microstructure ◽  
Effect Of Copper

The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile properties, wettability, interfacial characterization and melting behavior of the Sn-Zn-Cu solder alloys were investigated. The Sn29Zn4.6Cu0.4 solder alloy exhibited a fine microstructure, but the excessive substitution of the Cu atoms in the CPGA model resulted in extremely coarse intermetallic compound (IMC). The tensile tests revealed that with the increase in Cu content, the tensile strength of the solder alloy first increased and then slightly decreased, while its elongation increased slightly first and then decreased slightly. The tensile strength of the Sn29Zn4.6Cu0.4 solder alloy reached 95.3 MPa, which was 57% higher than the plain Sn-Zn solder alloy, which is attributed to the fine microstructure and second phase strengthening. The spreadability property analysis indicated that the wettability of the Sn-Zn-Cu solder alloys firstly increased and then decreased with the increase in Cu content. The spreading area of the Sn29Zn0.6Cu0.4 solder alloy was increased by 27.8% compared to that of the plain Sn-Zn solder due to Cu consuming excessive free state Zn. With the increase in Cu content, the thickness of the IMC layer decreased owing to Cu diminishing the diffusion force of Zn element to the interface.

Refinement of Size Distributions for Primary Crystallizations

1997 ◽  
Vol 481 ◽  
Author(s):  
E. Pineda ◽  
T. Pradell ◽  
D. Crespo ◽  
N. Clavaguera ◽  
J. ZHU ◽  
...  
Keyword(s):  
Grain Size ◽  
Metastable Phase ◽  
Primary Crystallization ◽  
Controlled Growth ◽  
Diffusion Controlled ◽  
Average Grain Size ◽  
Soft Impingement ◽  
Single Grain ◽  
Kinetics Of ◽  
And Diffusion

ABSTRACTThe microstructure developed in primary crystallizations is studied under realistic conditions. The primary crystallization of an amorphous alloy is modeled by considering the thermodynamics of a metastable phase transition and the kinetics of nucleation and crystal growth under isothermal annealing. A realistic growth rate, including an interface controlled growth at the beginning of the growth of each single grain and diffusion controlled growth process with soft impingement afterwards is considered. The reduction in the nucleation rate due to the compositional change in the remaining amorphous matrix is also taken into account. The microstructures developed during the transformation are obtained by using the Populational KJMA method, from the above thermodynamic and kinetic factors. Experimental data of transformed fraction, grain density, average grain size, grain size distribution and other related parameters obtained from annealed metallic glasses are modeled.

scholarly journals Ringwoodite rim around olivine core in shock-induced melt-vein of GRV 022321 chondrite: Transformation kinetics of olivine to ringwoodite

2021 ◽  
Author(s):  
Zhidong Xie ◽  
Thomas G. Sharp ◽  
Shuhao Zuo ◽  
Xiaochun Li
Keyword(s):  
Electron Microscopy ◽  
Raman Spectroscopy ◽  
Natural Occurrence ◽  
Controlled Growth ◽  
Rock Fragments ◽  
Nano Crystalline ◽  
Diffusion Controlled ◽  
State Diffusion ◽  
Crystallite Sizes ◽  
Electron Imaging

Abstract Here we report the natural occurrence of the ringwoodite rims around olivine cores in shock-induced melt veins of the Antarctic chondrite GRV 022321. Electron microprobe analysis (EMPA), Raman spectroscopy, Scanning electron microscopy (SEM) and Transmission electron microscopy (TEM) were used to examine the sample to better elucidate the mechanisms of transformation of the olivine to ringwoodite and Fe-Mg partitioning in olivine under the shock. The GRV 022321 is an L6 chondrite with a network of black veins enclosing abundant olivine host-rock fragments. Some of the enclosed fragments ranging from 5 µm to 100 µm in size have bright rims up to 20 µm wide, and a dark core under reflected light and backscatter electron imaging. Raman spectroscopy reveals that rims are made of ringwoodite, and cores are predominantly olivine. EMPA data show the ringwoodites in rims are richer in Fe (Fa46) than the olivine cores (Fa10-Fa23). The olivine cores have variable contrast in BSE images with the heterogeneities in fayalite content (Fa10 to Fa23) and a branching network of low-Fa olivine. FIB-TEM observations reveal that the ringwoodite rims are polycrystalline with crystallite sizes from 200 nm to 800 nm, while the olivine cores are also polycrystalline, but with smaller crystallites from 100 nm to 200 nm. Based on observation, we conclude that the original Fa23 olivine transformed to Fa10 olivine and Fa46 ringwoodite by a solid-state diffusion-controlled growth mechanism during shock, and the branching network of low-Fa olivine acted as long-range(up to 10µm)high-diffusion pathways for grain-boundary Fe-Mg interdiffusion through highly deformed nano-crystalline olivine to accommodate the diffusion-controlled growth of ringwoodite.

scholarly journals Quantitative Evaluation of Nucleic Acid Degradability of Copper Alloy Surfaces and Its Correlation to Antibacterial Activity

Antibiotics ◽  
2021 ◽  
Vol 10 (12) ◽  
pp. 1439
Author(s):  
Akiko Yamamoto ◽  
Shinji Tanaka ◽  
Keiichiro Ohishi
Keyword(s):  
Nucleic Acid ◽  
Nucleic Acids ◽  
Copper Ion ◽  
Antibacterial Activities ◽  
Ion Release ◽  
Antibacterial Materials ◽  
Cu Content ◽  
Cu Alloys ◽  
Film Method

Copper (Cu) and its alloys have bactericidal activity known as “contact killing” with degradation of nucleic acids inside the bacteria, which is beneficial to inhibit horizontal gene transfer (HGF). In order to understand the nucleic acid degradability of Cu and its alloy surfaces, we developed a new in vitro method to quantitatively evaluate it by a swab method under a “dry” condition and compared it with that of commercially available antibacterial materials such as antibacterial stainless steel, pure silver, and antibacterial resins. As a result, only Cu and its alloys showed continuous degradation of nucleic acids for up to 6 h of contact time. The nucleic acid degradability levels of the Cu alloys and other antibacterial materials correlate to their antibacterial activities evaluated by a film method referring to JIS Z 2801:2012 for Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) bacteria. Nucleic acid degradation by copper (I) and (II) chlorides was confirmed at the ranges over 10 mM and 1–20 mM, respectively, suggesting that the copper ion release may be responsible for the degradation of the nucleic acids on Cu and its alloy surfaces. In conclusion, the higher Cu content in the alloys gave higher nucleic acid degradability and higher antibacterial activities.

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