Multiscale Modeling of Thin-Film Deposition: Applications to Si Device Processing
Keyword(s):
Metallization is the back end of the integrated-circuit (IC) fabrication process where the transistor interconnections are formed. Figure 1 shows the metallized part of a static random-access memory chip. Metal lines for electrical connections (Al and Cu) in Si devices are deposited as blanket films and then etched or polished away to define the conducting lines.
1992 ◽
Vol 10
(6)
◽
pp. 3109
◽
Keyword(s):
Keyword(s):
2017 ◽
Vol 11
(1)
◽
pp. 89-94
◽
Keyword(s):
2020 ◽
Vol 29
(01n04)
◽
pp. 2040010
1994 ◽
Vol 33
(Part 1, No. 1B)
◽
pp. 790-793
◽