Sb-Doped Polycrystalline Si Obtained by Means of Sb and Si Thin-Film Reactions

1987 ◽  
Vol 106 ◽  
Author(s):  
S. F. Gong ◽  
A. E. Robertsson ◽  
S.-E. Hörnström ◽  
G. Radnoczi ◽  
H. T. G. Hentzell
Keyword(s):  
Thin Film ◽  
Electron Spectroscopy ◽  
Secondary Ion Mass Spectrometry ◽  
Si Substrate ◽  
Transmission Electron ◽  
Diffusion Source ◽  
Amorphous Si ◽  
P Type ◽  
Secondary Ion

ABSTRACTWe have grown Sb-doped poly-Si by thin-film reactions between Sb and amorphous Si (a-Si). The reactions and microstructures of the films were investigated by transmission electron microscopy (TEM) during in situ annealing and Auger electron spectroscopy (AES). The reactions either resulted in an amorphous Sb-Si (a-Sb-Si) alloy or caused crystallization of a-Si at low temperatures, depending on the film thickness of the a-Si layer as well as the heating rate. The electrical properties of the as-deposited and the annealed thin multi-layers deposited on SiO2 layer were determined using Hall measurements. After annealing at 1375 K for 60 minutes, Sb-doped poly-Si with a resistivity of 1.4×10−2 ohm-cm was obtained. A p-n junction was formed in a p-type Si substrate by using an a-Si/Sb/a-Si multi-layer as a diffusion source. The doping concentration in the Si substrate was obtained using secondary ion mass spectrometry (SIMS).

Determination of the Distribution of Ion Implantation Boron in Silicon

2000 ◽  
Vol 650 ◽  
Author(s):  
Te-Sheng Wang ◽  
A.G. Cullis ◽  
E.J.H. Collart ◽  
A.J. Murrell ◽  
M.A. Foad
Keyword(s):  
Electron Microscopy ◽  
Secondary Ion Mass Spectrometry ◽  
Low Energy ◽  
Concentration Profiles ◽  
Impurity Profile ◽  
Transmission Electron ◽  
Device Applications ◽  
P Type ◽  
Secondary Ion

ABSTRACTBoron is the most important p-type dopant in Si and it is essential that, especially for low energy implantation, both as-implanted B distributions and those produced by annealing should be characterized in very great detail to obtain the required process control for advanced device applications. While secondary ion mass spectrometry (SIMS) is ordinarily employed for this purpose, in the present studies implant concentration profiles have been determined by direct B imaging with approximately nanometer depth and lateral resolution using energy-filtered imaging in the transmission electron microscopy. The as-implanted B impurity profile is correlated with theoretical expectations: differences with respect to the results of SIMS measurements are discussed. Changes in the B distribution and clustering that occur after annealing of the implanted layers are also described.

Strain-Induced Diffusion in Heteroepitaxially Grown CuInSe2 on GaAs Substrates

1995 ◽  
Vol 399 ◽  
Author(s):  
P. Fons ◽  
S. Niki ◽  
A. Yamada ◽  
A. Okada ◽  
D.J. Tweet
Keyword(s):  
Thin Film ◽  
Secondary Ion Mass Spectrometry ◽  
Second Phase ◽  
X Ray Diffraction ◽  
X Ray ◽  
State Of Stress ◽  
Gaas Substrates ◽  
Transmission Electron ◽  
Secondary Ion ◽  
Lattice Matched

ABSTRACTA series of CuInSe2 thin films of varying thicknesses were grown on both GaAs(001) substrates and nominally lattice-matched In0.29Ga0.71As (001) linearly graded buffers by MBE at 450°C. Transmission electron microscopy and high resolution x-ray diffraction measurements revealed the presence of a second phase with chalcopyrite symmetry strained to the CuInSe2 thin film in-plane lattice constant for CuInSe2 films grown on GaAs substrates. Further examination confirmed that the second phase possessed chalcopyrite symmetry. No second phase was observed in films grown on nearly lattice-matched In0.29Ga0.71As (001) linearly graded buffers. Secondary ion mass spectrometry confirmed the presence of interdiffusion from of Ga from the substrate into the CuInSe2layer. It is speculated that this diffusion is related to the state of stress due to heteroepitaxial misfit.

Interfacial Reactions Between Metal Thin Films and p-GaN

1995 ◽  
Vol 395 ◽  
Author(s):  
J.T. Trexler ◽  
S.J. Miller ◽  
P.H. Holloway ◽  
M.A. Khan
Keyword(s):  
Thin Films ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Doping Concentration ◽  
Secondary Ion Mass Spectrometry ◽  
Surface Region ◽  
Metal Thin Films ◽  
Current Voltage ◽  
P Type ◽  
Secondary Ion

ABSTRACTThe reactions between Au, Au/Ni and Au/C/Ni thin films on p-GaN have been studied using current-voltage (I-V) measurements, Auger electron spectroscopy (AES) and secondary ion mass spectrometry (SIMS). The metallization schemes consisted of ≈2000Ǻ sputtered Au, 1000Ǻ Au/500Ǻ Ni, and 1000Ǻ Au/100Ǻ C/500Ǻ Ni electron beam evaporated. The Au/Ni metallization scheme is of particular interest since it is the basis for the most commonly used ohmic p-type contacts for blue GaN LED’s. Au does not decompose the GaN matrix, while Ni has been shown to react with GaN above a temperature of 400° C for times longer than 5 minutes. Upon decomposition of the GaN by Ni, incorporation of C at the metal/GaN interface occurred. It is believed that a regrowth of GaN occurred, with the surface region being doped with C. Attempts at increasing this doping concentration by introducing an interfacial C layer were not successful.

Influence of Atomic Hydrogen on Nickel Silicide Formation

2004 ◽  
Vol 810 ◽  
Author(s):  
A. Vengurlekar ◽  
Satheesh Balasubramanian ◽  
S. Ashok ◽  
N. D. Theodore ◽  
D.Z. Chi
Keyword(s):  
Sheet Resistance ◽  
Secondary Ion Mass Spectrometry ◽  
Hydrogen Plasma ◽  
Nickel Silicide ◽  
Oxide Semiconductor ◽  
Si Substrate ◽  
Nickel Deposition ◽  
Transmission Electron ◽  
Hall Effect Measurements ◽  
Secondary Ion

ABSTRACTNickel monosilicide (NiSi) is a leading contender to replace the currently used class of silicides for contacts to the source, drain and gate regions in Complimentary Metal-Oxide- Semiconductor (CMOS) circuits. In this work, the effect of substrate hydrogenation by a hydrogen plasma treatment prior to nickel deposition and silicidation was studied. The sheet resistance of the silicide film shows a significant decrease under hydrogenation of the Si substrate prior to Ni evaporation/anneal for projected silicidation temperatures below 600°C. Correspondingly, the Si region near the interface is decorated with defects. At higher silicidation temperatures, the sheet resistance rises along with greater in-diffusion of Ni into the hydrogenated Si samples. Secondary Ion Mass Spectrometry, Transmission Electron Microscopy and Hall effect measurements are used to characterize the samples.

Growth and Characterization of Si-GaP and Si-GaP-Si Heterostructures

1993 ◽  
Vol 334 ◽  
Author(s):  
N. Dietz ◽  
S. Habermehl ◽  
J. T. Kelliher ◽  
G. Lucovsky ◽  
K. J. Bachmann
Keyword(s):  
Epitaxial Growth ◽  
Chemical Beam Epitaxy ◽  
Si Substrate ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Amorphous Sic ◽  
Secondary Ion ◽  
Source Materials

AbstractThe low temperature epitaxial growth of Si / GaP / Si heterostructures is investigated with the aim using GaP as a dielectric isolation layer for Si circuits. GaP layers have been deposited on Si(100) surfaces by chemical beam epitaxy (CBE) using tertiarybutyl phosphine (TBP) and triethylgallium (TEG) as source materials. The influence of the cleaning and passivation of the GaP surface has been studied in-situ by AES and LEED, with high quality epitaxial growth proceeding on vicinal GaP(100) substrates. Si / GaP / Si heterostructures have been investigated by cross sectional high resolution transmission electron microscope (HRTEM) and secondary ion mass spectroscope (SIMS). These methods reveal the formation of an amorphous SiC interlayer between the Si substrate and GaP film due to diffusion of carbon generated in the decomposition of the metalorganic precursors at the surface to the GaP/Si interface upon prolonged growth (layer thickness > 300Å). The formation of twins parallel to {111} variants in the GaP epilayer are extended into the subsequently grown Si film with minor generation of new twins.

Formation of The Interface between InP and Arsenic Based Alloys by Chemical Beam Epitaxy

1992 ◽  
Vol 263 ◽  
Author(s):  
M. C. Tamargo ◽  
M.J.S.P. Brasil ◽  
R. E. Nahory ◽  
D. E. Aspnes ◽  
B. Philips ◽  
...  
Keyword(s):  
Interfacial Layer ◽  
Secondary Ion Mass Spectrometry ◽  
Chemical Beam Epitaxy ◽  
Interface Chemistry ◽  
Switching Sequence ◽  
Surface Steps ◽  
Transmission Electron ◽  
Secondary Ion ◽  
Low Temperature Photoluminescence

ABSTRACTWe investigate the formation of inAs-rich layers at the interface between InP and arsenicbased Ill-V alloys grown by chemical beam epitaxy (CBE). In-situ spectroscopic ellipsometry, low temperature photoluminescence, secondary ion mass spectrometry and transmission electron microscopy were used to characterize the formation of these layers. We present evidence for interfacial layer roughness that depends strongly on growth temperature and on the presence of surface steps, and show that modifications of the interface chemistry and of the gas-switching sequence can reduce interfacial layer thicknesses.

scholarly journals In Situ Study of Dislocation Behavior in Columnar Al Thin Film on Si Substrate During Thermal Cycling

1999 ◽  
Vol 594 ◽  
Author(s):  
Charles W. Allen ◽  
Herbert Schroeder ◽  
Jon M. Hiller
Keyword(s):  
Thin Film ◽  
Thermal Cycling ◽  
Grain Structure ◽  
Dislocation Model ◽  
Si Substrate ◽  
Transmission Electron ◽  
Dislocation Behavior ◽  
Columnar Grain ◽  
Al Thin Film

AbstractIn situ transmission electron microscopy (150 kV) has been employed to study the evolution of dislocation microstructures during relatively rapid thermal cycling of a 200 nm Al thin film on Si substrate. After a few thermal cycles between 150 and 500°C, nearly stable Al columnar grain structure is established with average grain less than a μm. On rapid cooling (3–30+ °C/s) from 500°C, dislocations first appear at a nominal temperature of 360–380°C, quickly multiplying and forming planar glide plane arrays on further cooling. From a large number of such experiments we have attempted to deduce the dislocation evolution during thermal cycling in these polycrystalline Al films and to account qualitatively for the results on a simple dislocation model.

Determination of the Distribution of Ion Implantation Boron in Silicon

2000 ◽  
Vol 647 ◽  
Author(s):  
Te-Sheng Wang ◽  
A.G. Cullis ◽  
E.J.H. Collart ◽  
A.J. Murrell ◽  
M.A. Foad
Keyword(s):  
Electron Microscopy ◽  
Secondary Ion Mass Spectrometry ◽  
Low Energy ◽  
Concentration Profiles ◽  
Impurity Profile ◽  
Transmission Electron ◽  
Device Applications ◽  
P Type ◽  
Secondary Ion

AbstractBoron is the most important p-type dopant in Si and it is essential that, especially for low energy implantation, both as-implanted B distributions and those produced by annealing should be characterized in very great detail to obtain the required process control for advanced device applications. While secondary ion mass spectrometry (SIMS) is ordinarily employed for this purpose, in the present studies implant concentration profiles have been determined by direct B imaging with approximately nanometer depth and lateral resolution using energy-filtered imaging in the transmission electron microscopy. The as-implanted B impurity profile is correlated with theoretical expectations: differences with respect to the results of SIMS measurements are discussed. Changes in the B distribution and clustering that occur after annealing of the implanted layers are also described.

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