Study of Germanium Epitaxial Recrystallization on Bulk-Si Substrates

2010 ◽  
Vol 1252 ◽  
Author(s):  
Byron Ho ◽  
Reinaldo Vega ◽  
Tsu-Jae King-Liu

AbstractLPCVD Ge films are deposited onto bulk Si substrates and subjected to either a rapid thermal anneal (RTA) or furnace anneal (FA) at a temperature that is higher than the melting point of Ge in an attempt to induce epitaxial recrystallization. Spiking into the Si and voids in the Ge film are observed after the anneal. This is attributed to defect-assisted Ge diffusion into the Si substrate caused by strain at the Ge-Si interface. Simple diffusion theory using published diffusivity values predicts diffusion depths similar to the spiking depths observed by scanning electron microscopy and transmission electron microscopy. Approaches to reduce the strain at the interface are explored. It is found that the quasi-equilibrium nature of FA reduces spiking and that there is an area dependence. Grazing-incidence x-ray diffraction analysis suggests that this technique for epitaxial recrystallization does not result in single-crystalline Ge.

2017 ◽  
Vol 19 (48) ◽  
pp. 32514-32525 ◽  
Author(s):  
Alexandru Sarbu ◽  
Patrick Hermet ◽  
David Maurin ◽  
David Djurado ◽  
Laure Biniek ◽  
...  

Polarized FTIR and TEM helps determine the supramolecular organization of PBI gelators.


2007 ◽  
Vol 119 ◽  
pp. 79-82
Author(s):  
Hyoun Woo Kim ◽  
S.H. Shim ◽  
Jong Woo Lee

We have demonstrated the growth of SiOx nanowires by the simple heating of the Au-coated Si substrates. We used X-ray diffraction, scanning electron microscopy, energy dispersive x-ray spectroscopy, and transmission electron microscopy to characterize the samples. The as-synthesized SiOx nanowires had amorphous structures with diameters in the range of 10-70 nm. We have discussed the possible growth mechanism.


1999 ◽  
Vol 595 ◽  
Author(s):  
Andrey Nikolaev ◽  
Irina Nikitina ◽  
Andrey Zubrilov ◽  
Marina Mynbaeva ◽  
Yuriy Melnik ◽  
...  

AbstractWe report on AlN wafers fabricated by hydride vapor phase epitaxy (HVPE). AlN thick layers were grown on Si substrates by HVPE. Growth rate was up to 60 microns per hour. After the growth of AlN layers, initial substrates were removed resulting in free-standing AlN wafers. The maximum thickness of AlN layer was about 1 mm. AlN free-standing single crystal wafers with a thickness ranging from 0.05 to 0.8 mm were studied by x-ray diffraction, transmission electron microscopy, optical absorption, and cathodoluminescence.


1987 ◽  
Vol 94 ◽  
Author(s):  
David A. Smith ◽  
Armin Segmüller ◽  
A. R. Taranko

ABSTRACTOriented deposits are commonplace in vapor deposited films. The origins of this behavior are not always clear. Various bcc metals (Fe, Nb, Mo, Ta, Cr) have been deposited onto single crystal fcc substrates (Au, Ni, MgO, Si, NaCI) which were selected with the intention of varying the character of the substrate-deposit interaction. The resulting structures have been characterized by transmission electron microscopy and grazing incidence x-ray diffraction. The observed variants of the cube-cube and Nishiyama-Wassermann orientation relationship can be understood in terms of minimization of misfit except when there is a weak interaction between substrate and deposit.


1991 ◽  
Vol 220 ◽  
Author(s):  
P. M. Adams ◽  
R. C. Bowman ◽  
V. Arbet-Engols ◽  
K. L. Wang ◽  
C. C. Ahn

ABSTRACTP-I-N diodes whose intrinsic region consists of strained layer superlattices (SLS), separated by 40 nm Si spacers, have been grown by MBE on Si substrates with <100>, <110>, and <111> orientations. These structures have been characterized by x-ray diffraction (XRD) and cross-sectional transmission electron microscopy (XTEM). The dual periodicities in these structures produced unique XRD effects and the quality was highly dependent on substrate orientation. The <100> sample was in general free of defects, whereas the <110> and <111> specimens contained significant numbers of twins and dislocations.


2007 ◽  
Vol 124-126 ◽  
pp. 1289-1292
Author(s):  
Hyoun Woo Kim ◽  
S.H. Shim ◽  
Hae Jin Hwang ◽  
Jae Hyun Shim ◽  
Nam Hee Cho ◽  
...  

This study reported the fabrication of tin oxide (SnO2) nanostructures on Co-coated Si substrates by the thermal heating of Sn powders. The microstructures and morphologies of the resultant nanostructures were studied by means of X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), and scanning electron microscopy (SEM). The product mainly comprised the tangled nanowires with average diameters in the range of 50-180 nm. The nanostructures were single-crystalline rutile structure of SnO2. The PL measurement with the Gaussian fitting exhibited visible light emission bands centered at 576 nm and 638 nm, respectively. We have discussed the possible growth mechanism of the nanostructures.


2000 ◽  
Vol 5 (S1) ◽  
pp. 432-437 ◽  
Author(s):  
Andrey Nikolaev ◽  
Irina Nikitina ◽  
Andrey Zubrilov ◽  
Marina Mynbaeva ◽  
Yuriy Melnik ◽  
...  

We report on AlN wafers fabricated by hydride vapor phase epitaxy (HVPE). AlN thick layers were grown on Si substrates by HVPE. Growth rate was up to 60 microns per hour. After the growth of AlN layers, initial substrates were removed resulting in free-standing AlN wafers. The maximum thickness of AlN layer was about 1 mm. AlN free-standing single crystal wafers with a thickness ranging from 0.05 to 0.8 mm were studied by x-ray diffraction, transmission electron microscopy, optical absorption, and cathodoluminescence.


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