Thermal Stability of Si/Si0.85Ge0.15/Si Modulation Doped Double Heterostructures

1989 ◽  
Vol 160 ◽  
Author(s):  
P.J. Wang ◽  
B.S. Meyerson ◽  
P.M. Fahey ◽  
F. LeGoues ◽  
G.J. Scilla ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Misfit Dislocations ◽  
Two Dimensional ◽  
Double Heterostructures ◽  
Vapor Deposition Technique ◽  
P Type ◽  
Thermal Stability Of

AbstractThe thermal stability of Si/Si0.85Ge0.15/Si p-type modulation doped double heterostructures grown by the Ultra High Vacuum/ Chemical Vapor Deposition technique has been examined by Hall measurement, transmission electron microscopy, secondary ion mass spectroscopy, and Raman spectroscopy. As deposited heterostructures showed two-dimensional hole gas formation at the abrupt Si/SiGe and SiGe/Si interfaces. Annealing at 800 °C. for 1 hr. caused the diffusion of boron acceptors to the heterointerfaces, degrading the hole mobilities observed in the two dimensional hole gas. Rapid redistribution of boron, causing a loss of the 2 dimensional carrier behavior, was observed after a 900 °C, 0.5 hr. anneal. Neither Ge interdiffusion nor the generation of misfit dislocations were observed in the annealed heterostructures, evincing the defect-free crystal quality of these as-grown strained heteroepitaxial layers. The superior stability of these heterostructures have strong positive implications for Si:Ge heterojunction devices.

Carbon Incorporation in Gaas grown by UHVCVD Using Trimethylgallium and Arsine

1992 ◽  
Vol 281 ◽  
Author(s):  
Seong-Ju Park ◽  
Jeong-Rae Ro ◽  
Jae-Ki Sim ◽  
El-Hang Lee
Keyword(s):  
Growth Rates ◽  
Hole Concentration ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Chemical Beam Epitaxy ◽  
Hydrogen Atoms ◽  
Carbon Incorporation ◽  
Significant Drop ◽  
P Type

ABSTRACTWe present results of a study on the effect of unprecracked arsine(AsH3) and trimethylgallium(TMGa) on carbon incorporation in UHVCVD(Ultra High Vacuum Chemical Vapor Deposition) grown GaAs epilayers on GaAs(100). Three distinct temperature-dependent regions of growth rates were identified as growth temperature was increased from 570 to 690°C. The growth rates were also strongly dependent on V/III ratio in a range of 5 to 30, which clearly indicates that the growth rate is determined by the amount of arsenic adsorbed on the surface at low V/III ratio and adsorption of TMGa or decomposition process at high V/III ratio. Hall concentration measurements and low temperature photoluminescence data show that the films are all p-type and their impurity concentrations are reduced by two orders of magnitude compared to those of epilayers grown by CBE(Chemical Beam Epitaxy) which employs TMGa and arsenic(precracked arsines) as source materials. Our results indicate that the hydrogen atoms dissociated from adsorbed arsine may remove hydrocarbon species resulting in a significant drop in hole concentration.

High Mobility Two-Dimensional Electron Gas in Modulation-Doped Si/SiGe Heterostructures

1991 ◽  
Vol 220 ◽  
Author(s):  
P. J. Wang ◽  
B. S. Meyerson ◽  
K. Ismail ◽  
F. F. Fang ◽  
J. Nocera
Keyword(s):  
High Vacuum ◽  
Electron Gas ◽  
Ultra High Vacuum ◽  
Threading Dislocation ◽  
High Electron ◽  
Two Dimensional ◽  
Dimensional Electron ◽  
Two Dimensional Electron Gas ◽  
Vapor Deposition Technique ◽  
Dimensional Electron Gas

ABSTRACTWe report record-high electron mobilities obtained in the Si/SiGe alloy system via single-junction n-type modulation-doped Si/Si0.7Ge0.9 heterostructurcs grown by the ultra-high vacuum chemical vapor deposition technique. Peak electron mobilities as high as 1,800 cm2/Vs, 9,000 cm2/Vs and 19,000 cm2/Vs were measured at room temperature, 77K and 1.4K, respectively. These high mobilities resulted from excellent Si/SiGe interfacial properties by employing a compositional graded Si/SiGe superlattice prior to the growth of a thick S0.7Ge0.3 buffer, which brought about a dramatic reduction of the threading dislocation density in the active Si channel. Two thin phosphorous-doped layers were incorporated in the SiGe barrier and at its surface to supply electrons to the Si channel and to suppress the surface depletion, respectively. The transport properties of these heterostructurcs were determined to be those of a two dimensional electron gas at Si/SiGe heterointerfaces at low temperatures.

Onset of Misfit Dislocation Generation in As-Grown and Annealed Sil-XGex/Si Films

1988 ◽  
Vol 130 ◽  
Author(s):  
M. P. Scott ◽  
S. S. Laderman ◽  
T. I. Kamins ◽  
S. J. Rosner ◽  
K. Nauka ◽  
...  
Keyword(s):  
Misfit Dislocation ◽  
Chemical Vapor ◽  
Misfit Dislocations ◽  
Epitaxial Silicon ◽  
Dislocation Generation ◽  
Transmission Electron ◽  
Vapor Deposition Technique ◽  
Si Films ◽  
Reaction Processing ◽  
Thermal Stability Of

AbstractX-ray topography and transmission electron microscopy were used to quantify misfit-dislocation spacings in as-grown Si1-xGex films formed by Limited Reaction Processing (LRP), which is a chemical vapor deposition technique. These analysis techniques were also used to study dislocation formation during annealing of material grown by both LRP and by molecular beam epitaxy (MBE). The thickness at which misfit dislocations first appear in as-grown material was similar for both growth techniques. The thermal stability of capped and uncapped films was also investigated after rapid thermal annealing in the range of 625 to 1000°C. Significantly fewer misfit dislocations were observed in samples containing an epitaxial silicon cap. Some differences in the number of misfit dislocation generated in CVD and MBE films were observed after annealing uncapped layers at temperatures between 625 and 825°C.

Thermal Stability of Ir-Silicide/SiGe Layers Grown in a Dual Electron Gun Chamber at Ultra-High Vacuum (Extended Abstract)

1994 ◽  
Vol 299 ◽  
Author(s):  
C. K. Chung ◽  
J. Hwang
Keyword(s):  
Thermal Stability ◽  
Thermal Instability ◽  
High Vacuum ◽  
Epitaxial Films ◽  
Ultra High Vacuum ◽  
Electron Gun ◽  
Guard Ring ◽  
X Ray ◽  
Silicide Layer ◽  
Thermal Stability Of

AbstractHeteroepitaxial Ir-silicide/SiGe layers on the top of p-Si(100) have been achieved at a substrate temperature of 450 °C. The co-deposited Ir-silicide layer was determined to be Ir3Si4 with four types of epitaxial modes. Thermal stability of the film was examined by using Auger electron spectroscopy and X-ray diffractometer. The Ir3Si4/SiGe layers were stable as annealed at 550 °C for 20 sec in a rapid thermal annealing furnace, while interdiffusion between Ir3Si4 and SiGe occurs at a temperature of 750 deg;C or higher for 20 sec. The traditional guard-ring fabrication process should be performed before epitaxial films deposition due to this thermal instability.

Construction of carbon-based two-dimensional crystalline nanostructure by chemical vapor deposition of benzene on Cu(111)

Nanoscale ◽  
2014 ◽  
Vol 6 (14) ◽  
pp. 7934-7939 ◽  
Author(s):  
Qinghua Han ◽  
Huan Shan ◽  
Jialiang Deng ◽  
Aidi Zhao ◽  
Bing Wang ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Two Dimensional ◽  
Carbon Based

A new carbon-based two-dimensional crystalline nanostructure was constructed by chemical vapor deposition of benzene on Cu(111) in ultra-high vacuum.

Thermal stability of uranium nitride and oxynitride films in an ultra-high vacuum environment

2018 ◽  
Vol 509 ◽  
pp. 408-416 ◽  
Author(s):  
Lei Lu ◽  
Fangfang Li ◽  
Hong Xiao ◽  
Yin Hu ◽  
Lizhu Luo ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Vacuum ◽  
Ultra High Vacuum ◽  
Uranium Nitride ◽  
High Vacuum Environment ◽  
Thermal Stability Of

Influence of chemical vapor precursor flow rate on the structure and thermal stability of phase-modulated VSiCN/Ag coatings

2021 ◽  
Vol 39 (6) ◽  
pp. 063409
Author(s):  
Forest C. Thompson ◽  
Frank M. Kustas ◽  
Kent E. Coulter ◽  
Grant A. Crawford
Keyword(s):  
Thermal Stability ◽  
Flow Rate ◽  
Chemical Vapor ◽  
Thermal Stability Of

Low Pressure MOCVD Growth and Characterization of GaAs and InP on Silicon Substrates

1988 ◽  
Vol 126 ◽  
Author(s):  
M. Razeghi ◽  
M. Defour ◽  
F. Omnes ◽  
J. Nagle ◽  
P. Maurel ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Low Pressure ◽  
Buffer Layers ◽  
Silicon Substrates ◽  
Misfit Dislocations ◽  
X Ray Diffraction ◽  
High Quality ◽  
Mocvd Growth ◽  
Vapor Deposition Technique ◽  
Low Pressure Mocvd

ABSTRACTHigh quality GaAs and InP have been grown on silicon substrates, using low pressure metalorganic chemical vapor deposition technique. The growth temperature is 550°C and the growth rate 100 A/min.Photoluminescence, X-ray diffraction and electrochemical profiling verified the high quality of these layers. The use of superlattices as buffer layers, (GaAs/GaInP) in the case of GaAs/Si and (GaInAsP/InP) in the case of InP/Si, decreased the amount of misfit dislocations in the epitaxial layer. Carrier concentrations as low as 5.1015 cm−3 have been measured by electrochemical profiling.

Challenge to 200 mm 3C-SiC Wafers Using SOI

2005 ◽  
Vol 483-485 ◽  
pp. 205-208 ◽  
Author(s):  
Motoi Nakao ◽  
Hirofumi Iikawa ◽  
Katsutoshi Izumi ◽  
Takashi Yokoyama ◽  
Sumio Kobayashi
Keyword(s):  
Cross Section ◽  
Vapor Deposition ◽  
Seed Layer ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Average Thickness ◽  
Entire Region ◽  
Transmission Electron ◽  
Good Crystallinity

200 mm wafer with 3C-SiC/SiO2/Si structure has been fabricated using 200 mm siliconon- insulator (SOI) wafer. A top Si layer of 200 mm SOI wafer was thinned down to approximately 5 nm by sacrificial oxidization, and the ultrathin top Si layer was metamorphosed into a 3C-SiC seed layer using a carbonization process. Afterward, an epitaxial SiC layer was grown on the SiC seed layer with ultra-high vacuum chemical vapor deposition. A cross-section transmission electron microscope indicated that a 3C-SiC seed layer was formed directly on the buried oxide layer of 200 mm wafer. The epitaxial SiC layer with an average thickness of approximately 100 nm on the seed was recognized over the entire region of the wafer, although thickness uniformity of the epitaxial SiC layer was not as good as that of SiC seed layer. A transmission electron diffraction image of the epitaxial SiC layer showed a monocrystalline 3C-SiC(100) layer with good crystallinity. These results indicate that our method enables to realize 200 mm SiC wafers.

scholarly journals Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions

2018 ◽  
Vol 2018 ◽  
pp. 1-11 ◽  
Author(s):  
Naiming Miao ◽  
Jinjin Jiang ◽  
Wangping Wu
Keyword(s):  
Thermal Stability ◽  
Chemical Composition ◽  
Deposition Rate ◽  
Electroless Nickel ◽  
Monocrystalline Silicon ◽  
P Content ◽  
Almost All ◽  
P Type ◽  
Electroless Ni ◽  
Thermal Stability Of

Electroless nickel–phosphorus (Ni–P) films were produced on the surface of p-type monocrystalline silicon in the alkaline citrate solutions. The influences of bath chemistry and plating variables on the chemical composition, deposition rate, morphology, and thermal stability of electroless Ni–P films on silicon wafers were studied. The as-deposited Ni–P films were almost all medium- and high-P deposits. The concentrations of Ni2+ and citric ions influenced the deposition rate of the films but did not affect P content in the deposits. With increasing H2PO2− content, the P content and deposition rate were steadily increased. The pH and plating temperature had a significant effect on the chemical composition and the deposition rate of the films. The thermal stability of the medium-P film was better than that of the high-P deposit. At the same time, the proposed mechanism of Ni–P films on monocrystalline silicon substrates in the alkaline bath solution was discussed and addressed.

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