scholarly journals Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions

2018 ◽  
Vol 2018 ◽  
pp. 1-11 ◽  
Author(s):  
Naiming Miao ◽  
Jinjin Jiang ◽  
Wangping Wu
Keyword(s):  
Thermal Stability ◽  
Chemical Composition ◽  
Deposition Rate ◽  
Electroless Nickel ◽  
Monocrystalline Silicon ◽  
P Content ◽  
Almost All ◽  
P Type ◽  
Electroless Ni ◽  
Thermal Stability Of

Electroless nickel–phosphorus (Ni–P) films were produced on the surface of p-type monocrystalline silicon in the alkaline citrate solutions. The influences of bath chemistry and plating variables on the chemical composition, deposition rate, morphology, and thermal stability of electroless Ni–P films on silicon wafers were studied. The as-deposited Ni–P films were almost all medium- and high-P deposits. The concentrations of Ni2+ and citric ions influenced the deposition rate of the films but did not affect P content in the deposits. With increasing H2PO2− content, the P content and deposition rate were steadily increased. The pH and plating temperature had a significant effect on the chemical composition and the deposition rate of the films. The thermal stability of the medium-P film was better than that of the high-P deposit. At the same time, the proposed mechanism of Ni–P films on monocrystalline silicon substrates in the alkaline bath solution was discussed and addressed.

scholarly journals Heterogeneity of the chemical composition and thermal stability of particulate organic matter in French forest soils

Geoderma ◽  
2019 ◽  
Vol 342 ◽  
pp. 65-74 ◽  
Author(s):  
Laure Soucémarianadin ◽  
Lauric Cécillon ◽  
Claire Chenu ◽  
François Baudin ◽  
Manuel Nicolas ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Organic Matter ◽  
Chemical Composition ◽  
Particulate Organic Matter ◽  
Forest Soils ◽  
Thermal Stability Of

Thermal stability of Ni/Ti/Al ohmic contacts to p-type 4H-SiC

2015 ◽  
Vol 117 (2) ◽  
pp. 025703 ◽  
Author(s):  
Hailong Yu ◽  
Xufang Zhang ◽  
Huajun Shen ◽  
Yidan Tang ◽  
Yun Bai ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Ohmic Contacts ◽  
P Type ◽  
Thermal Stability Of

Study of Thermal Stability of Magnesium Alloys

2013 ◽  
Vol 690-693 ◽  
pp. 74-77
Author(s):  
Zuzana Turnova ◽  
Tomas Chrebet ◽  
Ivana Turekova ◽  
Karol Balog
Keyword(s):  
Thermal Stability ◽  
Chemical Composition ◽  
Magnesium Alloys ◽  
Ignition Temperature ◽  
Structural Materials ◽  
Mg Alloys ◽  
Muffle Furnace ◽  
Dynamic Heating ◽  
Thermal Stability Of

Today, magnesium (Mg) alloys are recognized alternatives to iron and aluminum to reduce the weight of structural materials. This contribution was performed to provide information on the flammability of magnesium alloys through investigation of the ignition temperature of selected Mg alloys. The test was performed in a muffle furnace with dynamic heating program. Also were performed tests of chemical composition of studied specimens.

Thermal Stability of Mechanical Properties of Copper after Equal-Channel Angular Pressing

2008 ◽  
Vol 584-586 ◽  
pp. 960-965 ◽  
Author(s):  
Tamara Kravchenko ◽  
Alexander Korshunov ◽  
Natalia Zhdanova ◽  
Lev Polyakov ◽  
Irina Kaganova
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Tensile Strength ◽  
Chemical Composition ◽  
Yield Strength ◽  
Equal Channel Angular Pressing ◽  
Angular Pressing ◽  
Different Temperatures ◽  
Thermal Stability Of

Annealed oxygen-free and tough-pitch copper samples have been processed by equalchannel angular pressing (ECAP) by route BC. The samples included 8 x 8 mm section pieces and a 40 mm diameter bar. Thermal stability was assessed based on the changes in the standard mechanical properties (conventional yield strength, tensile strength, elongation, proportional elongation and contraction) after annealing at different temperatures for 1 hour. Thermal stability of the same grade of material has been found to be different for different batches and to depend on the structural conditions of deformed material. The zone of thermal stability for copper of the two grades of interest does not depend on the material’s chemical composition.

Crystallization of Ni-Cr-Si-B and Ni-Cr-Fe-Si-B Amorphous Alloys

2014 ◽  
Vol 216 ◽  
pp. 35-38 ◽  
Author(s):  
Cosmin Codrean ◽  
Dragoş Buzdugan ◽  
Ramona Lǎzar ◽  
Viorel Aurel Şerban ◽  
Ion Mitelea
Keyword(s):  
Thermal Stability ◽  
Chemical Composition ◽  
Rapid Solidification ◽  
Amorphous Alloys ◽  
Structural Characteristics ◽  
Glass Forming Ability ◽  
Glass Forming ◽  
Melting Temperatures ◽  
Dta Analysis ◽  
Thermal Stability Of

Ni based amorphous alloys with Si and B, which can also, contains Fe and Cr, prepared by rapid solidification, have low melting temperatures. This fact increases their susceptibility to be joined by welding and brazing. The glass forming ability (GFA) is conditioned also by the crystallization delay, due to certain chemical composition of the alloys. The thermal stability of these alloys was revealed by DTA analysis and structural characteristics were investigated by XRD. Applying an annealing at temperatures between 420°C and 540°C, with 30 minutes maintaining time, allowed the investigation of phase occurred during the crystallization and the estimation of the crystalline grains dimensions.

Thermal Stability of Pd Schottky Contacts to p-Type 6H-SiC

2003 ◽  
Vol 433-436 ◽  
pp. 681-684 ◽  
Author(s):  
M.E. Samiji ◽  
A.M. Venter ◽  
A.W.R. Leitch
Keyword(s):  
Thermal Stability ◽  
Schottky Contacts ◽  
P Type ◽  
Thermal Stability Of

Growth and Stability of MgO/NiO Multilayered Films on Single Crystal NiO(100)

1995 ◽  
Vol 401 ◽  
Author(s):  
S. Imaduddin ◽  
R. J. Lad
Keyword(s):  
Thermal Stability ◽  
Chemical Composition ◽  
Chemical Analysis ◽  
Single Crystal ◽  
Lattice Mismatch ◽  
Composition Studies ◽  
Single Crystal Substrate ◽  
Multilayered Films ◽  
Crystal Substrate ◽  
Thermal Stability Of

AbstractThe less than 1% lattice mismatch between MgO and NiO makes them ideal candidates for investigating the growth and stability of multilayered oxide films. Ultra-thin multilayers composed of alternating films of MgO and NiO were deposited onto a stoichiometric NiO(100) single crystal substrate at 250°C by evaporating Mg and Ni in 5×10−7 Torr of O2, respectively. The structure of these multilayers was determined using LEED. Reactivity and chemical composition studies of the MgO/NiO interfaces were carried out using XPS and UPS. The MgO/NiO multilayers grow epitaxially on NiO(100), as evidenced by LEED. XPS and UPS analysis indicates attenuation of the NiO or MgO peaks during growth which is consistent with discrete layering. Chemical analysis also reveals negligible intermixing of the MgO and NiO layers during deposition. Results pertaining to the thermal stability of the multilayers show that UHV annealing above 750°C results in significant diffusion of MgO into the NiO(100) substrate.

scholarly journals Electroless Plating – Its Applications in Resistor Technology

1976 ◽  
Vol 3 (2) ◽  
pp. 103-111 ◽  
Author(s):  
J. Dearden
Keyword(s):  
Thermal Stability ◽  
Tin Oxide ◽  
Electroless Nickel ◽  
Temperature Sensors ◽  
Metal Films ◽  
Temperature Coefficient Of Resistance ◽  
Distribution Requirement ◽  
Improved Performance ◽  
Mylar Sheet ◽  
Thermal Stability Of

Electroless processes for the deposition of metal films onto insulators have been known for many years. Various aspects of this technology have been applied in the field of resistor technology leading to improved performance of existing resistors and the evaluation of new resistors with novel characteristics.The applications of electroless nickel as a readily solderable, completely ohmic contact for tin oxide resistors is described.Copper oxide layers produced from oxidised electroless copper are shown to improve the thermal stability of tin oxide resistors.A range of electroless high precision metal film resistors from a fraction of an ohm to 100 kohm per square and from a few millimetres in length to over 1 metre is shown to be feasible. This technology has been applied to the manufacture of thin film circuits.The outstanding thermal stability of the electroless nickel-boron films and their temperature coefficient of resistance indicates a potential application in the field of temperature sensors.The ability to produce “weightless” films on Mylar sheet at 10 Gohm per square is considered to be a solution to the charge distribution requirement for electrostatic loudspeakers.

Zirconium Mediated Hydrogen Outdiffusion from p-GaN

1999 ◽  
Vol 595 ◽  
Author(s):  
E. Kaminska ◽  
A. Piotrowska ◽  
A. Barcz ◽  
J. Jasinski ◽  
M. Zielinski ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Thermal Behavior ◽  
Ohmic Contact ◽  
Contact System ◽  
P Type ◽  
Thermal Stability Of

AbstractWe have shown that Zr-based metallization can effectively remove hydrogen from the p-type GaN subsurface, which eventually leads to the formation of an ohmic contact. As the release of hydrogen starts at ∼900°C, the thermal stability of the contact system is of particular importance. The remarkable thermal behavior of the ZrN/ZrB2 metallization is associated to the microstructure of each individual Zr-based compound, as well as to the interfacial crystalline accommodation.

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