“Barrierless” Misfit Dislocation Nucleation in SiGe/Si Strained Layer Epitaxy

1992 ◽  
Vol 263 ◽  
Author(s):  
D.D. Perovic ◽  
D.C. Houghton

ABSTRACTThe study of the critical thickness/strain phenomenon inherent in metastable, layered heterostructures has led to the development of several models which describe elastic strain relaxation. Hitherto, the nucleation of misfit dislocations required for coherency breakdown is the least well understood aspect of strain relaxation, due to the paucity of experimental data. Moreover, existing theoretical calculations predict relatively large activation energy barriers (>10 eV) for misfit dislocation nucleation in relatively low misfit (<2%) systems. In this work it will be shown that the nucleation of misfit dislocations can occur spontaneously demonstrating a vanishingly small activation energy barrier. Specifically, experimental studies of a wide range of GexSi1−x/Si (x< 0.5) hetero-structures, grown by MBE and CVD techniques, have provided quantitative data from bulk specimens on the observed misfit dislocation nucleation rate and activation energy using large-area diagnostic techniques (eg. chemical etching/Nomarski microscopy). In parallel, the strained layer microstructure was studied in detail using crosssectional and plan-view electron microscopy in order to identify a new dislocation nucleation mechanism, the ‘double half-loop’ source. From the combined macroscopic and microscopic analyses, a theoretical treatment has been developed based on nucleation stress and energy criteria which predicts a “barrierless” nucleation process exists even at low misfits (< 1%). Accordingly, the observed misfit dislocation nucleation event has been found both experimentally and theoretically to be rate-controlled solely by Peierls barrier dependent, glide-activated processes with activation energies of ∼2 eV.

1990 ◽  
Vol 198 ◽  
Author(s):  
D.C. Houghton ◽  
N.L. Rowell

ABSTRACTThe thermal constraints for device processing imposed by strain relaxation have been determined for a wide range of Si-Ge strained heterostructures. Misfit dislocation densities and glide velocities in uncapped Sil-xGex alloy layers, Sil-xGex single and multiple quantum wells have been measured using defect etching and TEM for a range of anneal temperatures (450°C-1000°C) and anneal times (5s-2000s). The decay of an intense photoluminescence peak (∼ 10% internal quantum efficiency ) from buried Si1-xGex strained layers has been correlated with the generation of misfit dislocations in adjacent Sil-xGex /Si interfaces. The misfit dislocation nucleation rate and glide velocity for all geometries and alloy compositions (0<x<0.25) were found to be thermally activated processes with activation energies of (2.5±0.2)eV and (2.3-0.65x)eV, respectively. The time-temperature regime available for thermal processing is mapped out as a function of dislocation density using a new kinetic model.


1990 ◽  
Vol 188 ◽  
Author(s):  
W. D. Nix ◽  
D. B. Noble ◽  
J. F. Turlo

ABSTRACTThe mechanisms and kinetics of forming misfit dislocations in heteroepitaxial films are studied. The critical thickness for misfit dislocation formation can be found by considering the incremental extension of a misfit dislocation by the movement of a “threading” dislocation segment that extends from the film/substrate interface to the free surface of the film. This same mechanism allows one to examine the kinetics of dislocation motion and to illuminate the importance of dislocation nucleation and multiplication in strain relaxation. The effects of unstrained epitaxial capping layers on these processes are also considered. The major effects of such capping layers are to inhibit dislocation nucleation and multiplication. The effect of the capping layer on the velocity of the “threading” dislocation is shown to be small by comparison.A new substrate curvature technique for measuring the strain and studying the kinetics of strain relaxation in heteroepitaxial films is also briefly described.


1989 ◽  
Vol 148 ◽  
Author(s):  
R. Hull ◽  
J.C. Bean

ABSTRACTBy analyzing in-situ strain relaxation measurements of GexSi1-x/Si(100) epitaxy in a Transmission Electron Microscope, we are able to quantify the fundamental parameters which describe strain energy relaxation via misfit dislocation introduction. Quantitative descriptions of misfit dislocation nucleation, propagation and interaction processes are derived. The numerical parameters obtained from these experiments are then incorporated into a predictive theoretical model of strain relaxation whichrelies only upon experimentally measured quantities. Good agreement between experiment and theory is obtained over a wide range of data.


1999 ◽  
Vol 570 ◽  
Author(s):  
J. Leininger ◽  
G. D. U'ren ◽  
M. S. Goorsky

ABSTRACTWe addressed the initial strain relaxation of symmetric 95 Å period Si0.91Ge0.09/Si heterostructures grown by ultra-high vacuum chemical vapor deposition on vicinal substrates miscut 2.04° from (001) in a direction 36° from a [110]. Double-axis x-ray topography revealed misfit-dislocation sources in the as-grown samples with an average density of about 60 cm−2, although the distribution of these sites was not homogeneous. The progression of dislocation nucleation and growth was observed during subsequent rapid thermal annealing (800°C, 20s-320s). Physical heterogeneities were identified as dislocation sources, and they gave rise to orthogonal misfit dislocation bundles, which on a macroscopic scale resemble crosses. Upon longer annealing, a more homogeneous distribution of defects was observed without measurable relaxation. These original defects did propagate; however, they did not spur a cross-slip multiplication sequence.


1993 ◽  
Vol 319 ◽  
Author(s):  
X. J. Ning ◽  
P. Pirouz

AbstractDespite tremendous activity during the last few decades in the study of strain relaxation in thin films grown on substrates of a dissimilar material, there are still a number of problems which are unresolved. One of these is the nature of misfit dislocations forming at the film/substrate interface: depending on the misfit, the dislocations constituting the interfacial network have predominantly either in-plane or inclined Burgers vectors. While, the mechanisms of formation of misfit dislocations with inclined Burgers vectors are reasonably well understood, this is not the case for in-plane misfit dislocations whose formation mechanism is still controversial. In this paper, misfit dislocations generated to relax the strains caused by diffusion of boron into silicon have been investigated by plan-view and crosssectional transmission electron microscopy. The study of different stages of boron diffusion shows that, as in the classical model of Matthews, dislocation loops are initially generated at the epilayer surface. Subsequently the threading segments expand laterally and lay down a segment of misfit dislocation at the diffuse interface. The Burgers vector of the dislocation loop is inclined with respect to the interface and thus the initial misfit dislocations are not very efficient. However, as the diffusion proceeds, non-parallel dislocations interact and give rise to product segments that have parallel Burgers vectors. Based on the observations, a model is presented to elucidate the details of these interactions and the formation of more efficient misfit dislocations from the less-efficient inclined ones.


1991 ◽  
Vol 239 ◽  
Author(s):  
R. Hull ◽  
J. C. Bean ◽  
F. Ross ◽  
D. Bahnck ◽  
L. J. Pencolas

ABSTRACTThe geometries, microstructures, energetics and kinetics of misfit dislocations as functions of surface orientation and the magnitude of strain/stress are investigated experimentally and theoretically. Examples are drawn from (100), (110) and (111) surfaces and from the GexSi1–x/Si and InxGa1–x/GaAs systems. It is shown that the misfit dislocation geometries and microstructures at lattice mismatch stresses < - 1GPa may in general be predicted by operation of the minimum magnitude Burgers vector slipping on the widest spaced planes. At stresses of the order several GPa, however, new dislocation systems may become operative with either modified Burgers vectors or slip systems. Dissociation of totál misfit dislocations into partial dislocations is found to play a crucial role in strain relaxation, on surfaces other than (100) under compressive stress.


2001 ◽  
Vol 673 ◽  
Author(s):  
Y.W. Zhang ◽  
T.C. Wang ◽  
S.J. Chua

ABSTRACTA kinetic model is presented to simulate the strain relaxation in the GexSi1−x/Si(100) systems. In the model, the nucleation, propagation and annihilation of threading dislocations, the interaction between threading dislocations and misfit dislocations, and surface roughness are taken into account. The model reproduces a wide range of experimental results. The implications of its predictions on the threading dislocation reduction during the growth processes of the heteoepitaxial thin film systems are discussed.


1989 ◽  
Vol 160 ◽  
Author(s):  
David C. Paine ◽  
David J. Howard ◽  
Dawei Luo ◽  
Robert N. Sacks ◽  
Timothy C. Eschrich

AbstractIn this paper we report on the kinetics of strain relaxation in GaAs/InxGa1-xAs/GaAs/AlAs (0.05<x<0.22) layers grown by MBE on GaAs at 520°C. We have characterized the density of dislocations present due to strain relaxation during both film growth and processing by using a large area thinning technique which enables the observation of approximately 2 mm2 areas by plan-view TEM. The thickness of the InxGa1-xAs layers studied was 36.4 nm and four compositions were chosen so that the critical thickness predicted by strain energy considerations was exceeded. Due, however, to sluggish dislocation nucleation and glide kinetics at the deposition temperature, the as-grown misfit dislocation densities were well below the predicted level for fully relaxed films. We have studied the rate at which these metastable strained films relax as a function of post-growth annealing time and temperature.


1991 ◽  
Vol 220 ◽  
Author(s):  
Werner Wegscheider ◽  
Karl Eberl ◽  
Gerhard Abstreiter ◽  
Hans Cerva ◽  
Helmut Oppolzer

ABSTRACTOptimization of growth parameters of short period Si/Ge superlattices (SLs) has been achieved via in situ low-energy electron diffraction (LEED) and Auger electron spectroscopy (AES) measurements during homo- and heteroepitaxy on Si (001) and Ge (001) substrates. Transmission electron microscopy (TEM) reveals that pseudomorphic SimGe12-m (m = 9 and 3 for growth on Si and Ge, respectively) SLs with extended planar layering can be prepared almost defect-free by a modified molecular beam epitaxy (MBE) technique. Whereas the SLs on Ge can be deposited at a constant substrate temperature, high-quality growth on Si demands for temperature variations of more than 100°C within one superlattice period. Strain relaxation of these SLs with increasing number of periods has been directly compared by means of TEM. For the compressively strained structures grown on Si we found misfit dislocations of the type 60° (a/2)<110>. Under opposite strain conditions i.e. for growth on Ge, strain relief occurs only by microtwin formation through successive glide of 90° (a/6)<211> Shockley partial dislocations. This is consistent with a calculation of the activation energy for both cases based on a homogeneous dislocation nucleation model.


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