Strain Relaxation Via Interface Nucleation of Misfit Dislocations in Intermixing Layers

1992 ◽  
Vol 263 ◽  
Author(s):  
Hyo-Hoon Park ◽  
Jung Kee Lee ◽  
El-Hang Lee ◽  
Jeong Yong Lee ◽  
Soon-Ku Hong
Keyword(s):  
Electron Microscopy ◽  
Homogeneous Nucleation ◽  
Critical Thickness ◽  
Strain Relaxation ◽  
Relaxation Mechanism ◽  
Semiconductor Heterostructures ◽  
Misfit Dislocations ◽  
Partial Dislocations ◽  
Transmission Electron ◽  
Lattice Matched

ABSTRACTThe strain relaxation mechanism via the homogeneous nucleation of misfit dislocations from interface during interdiffusion in lattice-matched semiconductor heterostructures has been investigated. Transmission electron microscopy studies in intermixed GaInAsP/InP heterostructures revealed that the critical interdiffusion depth for the nucleation of 90° 1/6<112> partial dislocations from a tensile interface is much shallower than that of 60° 1/2<110> perfect dislocations from a compressive interface. A critical thickness model for the interface nucleation of these dislocations is developed as a modification of the classical surface nucleation'model.

Transmission electron microscopy of misfit dislocation and strain relaxation in lattice mismatched III-V heterostructures versus substrate surface treatment

2011 ◽  
Vol 1324 ◽  
Author(s):  
Y. Wang ◽  
P. Ruterana ◽  
L. Desplanque ◽  
S. El Kazzi ◽  
X. Wallart
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Surface Treatment ◽  
Substrate Surface ◽  
Strain Relaxation ◽  
Dislocation Core ◽  
Misfit Dislocations ◽  
Heteroepitaxial Growth ◽  
Transmission Electron ◽  
Growth Initiation

ABSTRACTHigh resolution transmission electron microscopy in combination with geometric phase analysis is used to investigate the interface misfit dislocations, strain relaxation, and dislocation core behavior versus the surface treatment of the GaAs for the heteroepitaxial growth of GaSb. It is pointed out that Sb-rich growth initiation promotes the formation of a high quality network of Lomer misfit dislocations that are more efficient for strain relaxation.

Mechanisms of misfit strain relaxation in epitaxially grown BLT (Bi4-xLaxTi3O12, x = 0.75) thin films

2003 ◽  
Vol 779 ◽  
Author(s):  
Hyung Seok Kim ◽  
Sang Ho Oh ◽  
Ju Hyung Suh ◽  
Chan Gyung Park
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Strain Relaxation ◽  
Lattice Misfit ◽  
Misfit Strain ◽  
Misfit Dislocations ◽  
Transmission Electron ◽  
Means Of Transmission ◽  
20 Nm

AbstractMechanisms of misfit strain relaxation in epitaxially grown Bi4-xLaxTi3O12 (BLT) thin films deposited on SrTiO3 (STO) and LaAlO3 (LAO) substrates have been investigated by means of transmission electron microscopy (TEM). The misfit strain of 20 nm thick BLT films grown on STO substrate was relaxed by forming misfit dislocations at the interface. However, cracks were observed in 100 nm thick BLT films grown on the same STO. It was confirmed that cracks were formed because of high misfit strain accumulated with increasing the thickness of BLT, that was not sufficiently relaxed by misfit dislocations. In the case of the BLT film grown on LAO substrate, the magnitude of lattice misfit between BLT and LAO was very small (~1/10) in comparison with the case of the BLT grown on STO. The relatively small misfit strain formed in layered structure of the BLT films on LAO, therefore, was easily relaxed by distorting the film, rather than forming misfit dislocations or cracks, resulting in misorientation regions in the BLT film.

A Comparison of the Structural Quality of High-In Content InGaAsN Films Grown on InGaAs Pseudosubstrate and on GaAs Substrate

2007 ◽  
Vol 31 ◽  
pp. 221-223
Author(s):  
S. Sanorpim ◽  
P. Kongjaeng ◽  
R. Katayama ◽  
Kentaro Onabe
Keyword(s):  
Electron Microscopy ◽  
Gaas Substrate ◽  
Misfit Strain ◽  
The Other ◽  
Buffer Layers ◽  
Structural Quality ◽  
Misfit Dislocations ◽  
Transmission Electron ◽  
Lattice Matched

The use of an InGaAs buffer layer was applied to the growth of thick InxGa1-xAs1-yNy layers with higher In contents (x > 30%). In order to obtain the lattice-matched InGaAsN layer having the bandgap of 1.0 eV, the In0.2Ga0.8As was chosen. In this work, the In0.3Ga0.7As0.98N0.02 layers were successfully grown on closely lattice-matched In0.2Ga0.8As buffer layers (InGaAsN/InGaAs). Structural quality of such layers is discussed in comparison with those of the In0.3Ga0.7As0.98N0.02 layers grown directly on the GaAs substrate (InGaAsN/GaAs). Based on the results of transmission electron microscopy, the misfit dislocations (MDs), which are located near the InGaAsN/GaAs heteroepitaxial interface, are visible by their strain contrast. On the other hand, no generation of the MDs is evidenced in the InGaAsN layer grown on the In0.2Ga0.8As pseudosubstrate. Our results demonstrate that a reduction of misfit strain though the use of the pseudosubstrate made possible the growth of high In-content InGaAsN layers with higher crystal quality to extend the wavelength of InGaAsN material.

Comparison of Growth and Strain Relaxation of Si/Ge Superlattices Under Compressive and Tensile Strain Field

1991 ◽  
Vol 220 ◽  
Author(s):  
Werner Wegscheider ◽  
Karl Eberl ◽  
Gerhard Abstreiter ◽  
Hans Cerva ◽  
Helmut Oppolzer
Keyword(s):  
Growth Parameters ◽  
Strain Relaxation ◽  
Dislocation Nucleation ◽  
Misfit Dislocations ◽  
Partial Dislocations ◽  
Transmission Electron ◽  
Short Period ◽  
Low Energy Electron ◽  
Superlattice Period

ABSTRACTOptimization of growth parameters of short period Si/Ge superlattices (SLs) has been achieved via in situ low-energy electron diffraction (LEED) and Auger electron spectroscopy (AES) measurements during homo- and heteroepitaxy on Si (001) and Ge (001) substrates. Transmission electron microscopy (TEM) reveals that pseudomorphic SimGe12-m (m = 9 and 3 for growth on Si and Ge, respectively) SLs with extended planar layering can be prepared almost defect-free by a modified molecular beam epitaxy (MBE) technique. Whereas the SLs on Ge can be deposited at a constant substrate temperature, high-quality growth on Si demands for temperature variations of more than 100°C within one superlattice period. Strain relaxation of these SLs with increasing number of periods has been directly compared by means of TEM. For the compressively strained structures grown on Si we found misfit dislocations of the type 60° (a/2)<110>. Under opposite strain conditions i.e. for growth on Ge, strain relief occurs only by microtwin formation through successive glide of 90° (a/6)<211> Shockley partial dislocations. This is consistent with a calculation of the activation energy for both cases based on a homogeneous dislocation nucleation model.

Si1-xGex Critical Thickness for Surface Wave Generation During UHV-CVD Growth at 525°C

1995 ◽  
Vol 399 ◽  
Author(s):  
H. Lafontaine ◽  
D.C. Houghton ◽  
B. Bahierathan ◽  
D.D. Perovic ◽  
J.-M. Baribeau
Keyword(s):  
Electron Microscopy ◽  
Surface Waves ◽  
Critical Thickness ◽  
Critical Value ◽  
Misfit Dislocations ◽  
Cross Sectional ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Cvd Growth

ABSTRACTSeveral Si1-xGex/Si heterostructures were grown at 525°C using a commercially available UHV-CVD reactor. Layers with a germanium fraction ranging from 0.15 to 0.5 were examined by means of cross-sectional transmission electron microscopy and atomic force microscopy. Surface waves were found in layers with a thickness above a critical value which decreases rapidly as the Ge fraction is increased. Both experimental and modeling results show that surface waves are generated before misfit dislocations for Ge fractions above 0.3.

Strain Relaxation in GaAs on Si by Two Groups of Misfit Dislocations

1995 ◽  
Vol 399 ◽  
Author(s):  
M. Tamura ◽  
T. Saitoh ◽  
T. Yodo
Keyword(s):  
Strain Relaxation ◽  
Lattice Misfit ◽  
Misfit Dislocations ◽  
Cross Sectional ◽  
Plan View ◽  
Partial Dislocations ◽  
Group I ◽  
Transmission Electron ◽  
Before And After ◽  
Gaas Films

ABSTRACTHigh-resolution cross-sectional and conventional plan-view transmission electron microscope observations have been carried out for molecular beam epitaxially grown GaAs films on vicinal Si (001) as a function of film thicknesses and observation directions between two orthogonal <110> directions before and after annealing. Two groups of misfit dislocations are characterized by analyzing whether their extra half planes exist in the film and the substrate side. The group I misfit dislocations due to a stress caused by a lattice misfit between GaAs and Si consist of partial and, 60° and 90° complete dislocations in an as-grown state. After annealing partial dislocations almost disappear and 90° perfect dislocations are predominantly observed. The group II misfit dislocations due to a thermal-expansion misfit-induced stress are all of the 60° type complete dislocations, independent of film thickness and annealing.

scholarly journals Reorientation of Misfit Dislocations During Annealing in InGaAs/GaAs(001) Interfaces

1993 ◽  
Vol 308 ◽  
Author(s):  
Y. Chen ◽  
Z. Liliental-Weber ◽  
J. Washburn ◽  
J.F. Klem ◽  
J.Y. Tsao
Keyword(s):  
Strain Relaxation ◽  
Dislocation Line ◽  
Line Tension ◽  
Misfit Strain ◽  
Relaxation Mechanism ◽  
Misfit Dislocations ◽  
Burgers Vector ◽  
Transmission Electron ◽  
Edge Component ◽  
Interfacial Plane

ABSTRACTTransmission electron microscopy is applied to investigate the effect of post-annealing on misfit dislocations in an In0.2Ga0.8As/GaAs(001) heterostructure. An orthogonal array of 60º dislocations along [110] and [110] directions was observed in the interfaces of the samples grown by MBE at 520 ºC. When the as-grown samples were annealed at temperatures ranging from 600 to 800 ºC, the 60º dislocations were gradually reoriented by dislocation reactions occurring at the 90º intersections followed by nonconservative motion driven by dislocation line tension and the residual elastic misfit strain. The final result of this process was a dislocation array lying along [100] and [010] directions. The reoriented u=<100> dislocation has a Burgers vector , which is the same as that of 60º dislocation, but the edge component of its Burgers vector in the (001) interfacial plane is larger than that of 60º dislocation by a factor of , resulting in a greater contribution to elastic strain relaxation. This nonconservative reorientation of 60º dislocations to form the u=<100> dislocations represents a new strain relaxation mechanism in diamond or zinc blende semiconductor heterostructures.

Partial Dislocations and Critical Thicknesses for Strained Layer Relaxation

1992 ◽  
Vol 263 ◽  
Author(s):  
D. M. Hwang ◽  
R. Bhat ◽  
S. A. Schwarz ◽  
C. Y. Chen
Keyword(s):  
Electron Microscopy ◽  
Energy Minimization ◽  
Critical Thickness ◽  
Stacking Faults ◽  
Standard Free Energy ◽  
Strained Layers ◽  
Partial Dislocations ◽  
Transmission Electron ◽  
Perfect Dislocation ◽  
Fcc Structure

ABSTRACTPartial dislocations and their associated stacking faults are identified as the primary defects responsible for the initial relaxation of tensile-strained layers of fcc structure. The critical thickness for the formation of 90° partial dislocations at the strained interface is almost a factor of two smaller than that predicted for the formation of 60° perfect dislocation. Microstructures revealed by transmission electron microscopy from strained layers of various lattice mismatches and thicknesses agree with the prediction of the standard free-energy minimization model.

Formation of Stacking Faults and Misfit Dislocations During Zn Diffusion-Enhanced Intermixing of a GaInAsP/InP Heterostructure

1990 ◽  
Vol 202 ◽  
Author(s):  
Hyo-Hoon Park ◽  
Eun Soo Nam ◽  
Yong Tak Lee ◽  
El-Hang Lee ◽  
Jeong Yong Lee ◽  
...  
Keyword(s):  
Electron Spectroscopy ◽  
Stacking Faults ◽  
Interfacial Stress ◽  
Misfit Dislocations ◽  
Zn Diffusion ◽  
Partial Dislocations ◽  
Compressive Stresses ◽  
Transmission Electron ◽  
Inp Substrate ◽  
Lattice Matched

ABSTRACTThe microstructural degradation of a lattice-matched Ga0.28 In0.72As0.61P0.39/InP heterointerface during atomic intermixing induced by Zn diffusion has been investigated using high-resolution transmission electron microscopy and Auger electron spectroscopy. The localized interfacial stress caused by intermixing appears to create stacking faults in the Ga-mixed InP substrate, and dislocation tangles in the In-mixed GalnAsP layer. The results are attributed to the contrasted effect of tensile and compressive stresses upon the nucleation of partial dislocations from both sides of the intermixed interface. A qualitative model is proposed for the homogeneous nucleation of misfit dislocations from the locally stressed interface.

scholarly journals Pinholes, Dislocations and Strain Relaxation in InGaN

1998 ◽  
Vol 3 ◽  
Author(s):  
B. Jahnen ◽  
M. Albrecht ◽  
W. Dorsch ◽  
S. Christiansen ◽  
H. P. Strunk ◽  
...  
Keyword(s):  
Critical Thickness ◽  
Strain Relaxation ◽  
Threading Dislocations ◽  
Misfit Dislocations ◽  
Slip Systems ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Wurtzite Lattice ◽  
Means Of Transmission

We analyse by means of transmission electron microscopy (TEM) and atomic force microscopy (AFM) the strain relaxation mechanisms in InGaN layers on GaN as dependent on the In content. At the experimentally given thickness of 100 nm, the layers remain coherently strained, up to an In concentration of 14 %. We show that part of the strain is reduced elastically by formation of hexagonally facetted pinholes. First misfit dislocations are observed to form at pinholes that reach the InGaN/GaN interface. We discuss these results in the framework of the Matthews-Blakeslee model for the critical thickness considering the Peierls force for glide of threading dislocations in the different slip systems of the wurtzite lattice.

Sign in / Sign up

Export Citation Format

Share Document