Theoretical Calculation for the Young's Modulus of Poly-Si and a-Si Films

1992 ◽  
Vol 276 ◽  
Author(s):  
Shuwen Guo ◽  
Daowen Zou ◽  
Weiyuan Wang
Keyword(s):  
Experimental Data ◽  
Thin Films ◽  
Grain Size ◽  
Grain Boundary ◽  
Theoretical Calculation ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Boundary Effects ◽  
Wide Range ◽  
Si Films

ABSTRACTA newly theoretical calculation for the Young's modulus Ey of poly-Si and a-Si thin films based on the combination of grain and grain boundary effects as well as the dependance of crystalline orientations is presented. The calculated results are in agreement with the experimental results in a wide range of grain size and hydrogen concentrations published in the literatures. The reason for aberration among experimental data of poly-Si and a-Si films caused by different hydrogen concentrations, texture and grain size has been discussed. The results offer a better understanding of. the effects of film structures on elastic properties of poly-Si and a-Si films.

Degradation of Rocks, Through Cracking Caused by Differential Thermal Expansion, in Relation to Nuclear Waste Repositories

1981 ◽  
Vol 6 ◽  
Author(s):  
J.R. Mclaren ◽  
R.W. Davidge ◽  
I. Titchell ◽  
K. Sincock ◽  
A. Bromley
Keyword(s):  
Thermal Expansion ◽  
Grain Boundary ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Crack Density ◽  
Granitic Rocks ◽  
Multiphase Materials ◽  
Thermal Expansion Behaviour ◽  
Waste Repositories ◽  
Expansion Behaviour

ABSTRACTHeating to temperatures up to 500°C, gives a reduction in Young's modulus and increase in permeability of granitic rocks and it is likely that a major reason is grain boundary cracking. The cracking of grain boundary facets in polycrystalline multiphase materials showing anisotropic thermal expansion behaviour is controlled by several microstructural factors in addition to the intrinsic thermal and elastic properties. Of specific interest are the relative orientations of the two grains meeting at the facet, and the size of the facet; these factors thus introduce two statistical aspects to the problem and these are introduced to give quantitative data on crack density versus temperature. The theory is compared with experimental measurements of Young's modulus and permeability for various rocks as a function of temperature. There is good qualitative agreement, and the additional (mainly microstructural) data required for a quantitative comparison are defined.

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

scholarly journals Hardness, Young’s Modulus and Elastic Recovery in Magnetron Sputtered Amorphous AlMgB14 Films

Crystals ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 823
Author(s):  
Alexander M. Grishin
Keyword(s):  
Young’S Modulus ◽  
Indentation Size Effect ◽  
Young's Modulus ◽  
Elastic Recovery ◽  
Rf Power ◽  
Magnesium Boride ◽  
Wide Range ◽  
Aluminum Magnesium Boride ◽  
Optical And Mechanical Properties ◽  
Diamond Probe

We report optical and mechanical properties of hard aluminum magnesium boride films magnetron sputtered from a stoichiometric AlMgB14 ceramic target onto Corning® 1737 Glass and Si (100) wafers. High target sputtering rf-power and sufficiently short target-to-substrate distance appeared to be critical processing conditions. Amorphous AlMgB14 films demonstrate very strong indentation size effect (ISE): exceptionally high nanohardness H = 88 GPa and elastic Young’s modulus E* = 517 GPa at 26 nm of the diamond probe penetration depth and almost constant values, respectively, of about 35 GPa and 275 GPa starting at depths of about 2–3% of films’ thickness. For comparative analysis of elastic strain to failure index  H/E*, resistance to plastic deformation ratio H3/E*2 and elastic recovery ratio We were obtained in nanoindentation tests performed in a wide range of loading forces from 0.5 to 40 mN. High authentic numerical values of H = 50 GPa and E* = 340 GPa correlate with as low as only 10% of total energy dissipating through the plastic deformations.

Microbridge Testing of Thin Films Under Small Deformation

1999 ◽  
Vol 594 ◽  
Author(s):  
T. Y. Zhang ◽  
Y. J. Su ◽  
C. F. Qian ◽  
M. H. Zhao ◽  
L. Q. Chen
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Silicon Nitride ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Chemical Vapor ◽  
Small Deformation ◽  
Nitride Film ◽  
Silicon Nitride Film ◽  
Pressure Chemical

AbstractThe present work proposes a novel microbridge testing method to simultaneously evaluate the Young's modulus, residual stress of thin films under small deformation. Theoretic analysis and finite element calculation are conducted on microbridge deformation to provide a closed formula of deflection versus load, considering both substrate deformation and residual stress in the film. Silicon nitride films fabricated by low pressure chemical vapor deposition on silicon substrates are tested to demonstrate the proposed method. The results show that the Young's modulus and residual stress for the annealed silicon nitride film are respectively 202 GPa and 334.9 MPa.

Size- and temperature-dependent Young's modulus and size-dependent thermal expansion coefficient of thin films

2016 ◽  
Vol 18 (31) ◽  
pp. 21508-21517 ◽  
Author(s):  
Xiao-Ye Zhou ◽  
Bao-Ling Huang ◽  
Tong-Yi Zhang
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Material Properties ◽  
Essential Role ◽  
Young's Modulus ◽  
Temperature Dependent ◽  
Size Dependent

Surfaces of nanomaterials play an essential role in size-dependent material properties.

scholarly journals Measurment of Young's Modulus and Stress Analysis of Magnetic Thin Films.

1994 ◽  
Vol 60 (572) ◽  
pp. 1108-1113
Author(s):  
Hidetoshi Yanai ◽  
Nobuyuki Kishine ◽  
Yukari Komaba ◽  
Yukitaka Murakami
Keyword(s):  
Thin Films ◽  
Stress Analysis ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Magnetic Thin Films
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