Degradation of Rocks, Through Cracking Caused by Differential Thermal Expansion, in Relation to Nuclear Waste Repositories

1981 ◽  
Vol 6 ◽  
Author(s):  
J.R. Mclaren ◽  
R.W. Davidge ◽  
I. Titchell ◽  
K. Sincock ◽  
A. Bromley
Keyword(s):  
Thermal Expansion ◽  
Grain Boundary ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Crack Density ◽  
Granitic Rocks ◽  
Multiphase Materials ◽  
Thermal Expansion Behaviour ◽  
Waste Repositories ◽  
Expansion Behaviour

ABSTRACTHeating to temperatures up to 500°C, gives a reduction in Young's modulus and increase in permeability of granitic rocks and it is likely that a major reason is grain boundary cracking. The cracking of grain boundary facets in polycrystalline multiphase materials showing anisotropic thermal expansion behaviour is controlled by several microstructural factors in addition to the intrinsic thermal and elastic properties. Of specific interest are the relative orientations of the two grains meeting at the facet, and the size of the facet; these factors thus introduce two statistical aspects to the problem and these are introduced to give quantitative data on crack density versus temperature. The theory is compared with experimental measurements of Young's modulus and permeability for various rocks as a function of temperature. There is good qualitative agreement, and the additional (mainly microstructural) data required for a quantitative comparison are defined.

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

scholarly journals Organizing Cells Within Non-Periodic Microarchitectured Materials That Achieve Graded Thermal Expansions

2015 ◽  
Author(s):  
Jonathan B. Hopkins ◽  
Lucas A. Shaw ◽  
Todd H. Weisgraber ◽  
George R. Farquar ◽  
Christopher D. Harvey ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Element Analysis ◽  
Thermal Expansion Coefficients ◽  
Large Lattice ◽  
Unit Cells ◽  
Expansion Coefficients ◽  
Bulk Behavior

The aim of this paper is to introduce an approach for optimally organizing a variety of different unit cell designs within a large lattice such that the bulk behavior of the lattice exhibits a desired Young’s modulus with a graded change in thermal expansion over its geometry. This lattice, called a graded microarchitectured material, can be sandwiched between two other materials with different thermal expansion coefficients to accommodate their different expansions or contractions caused by changing temperature while achieving a desired uniform stiffness. First, this paper provides the theory necessary to calculate the thermal expansion and Young’s modulus of large multi-material lattices that consist of periodic (i.e., repeating) unit cells of the same design. Then it introduces the theory for calculating the graded thermal expansions of a large multimaterial lattice that consists of non-periodic unit cells of different designs. An approach is then provided for optimally designing and organizing different unit cells within a lattice such that both of its ends achieve the same thermal expansion as the two materials between which the lattice is sandwiched. A MATLAB tool is used to generate images of the undeformed and deformed lattices to verify their behavior and various examples are provided as case studies. The theory provided is also verified and validated using finite element analysis and experimentation.

The Thermal Expansion Behaviour of Sulphur Doped GaAs Crystals

1991 ◽  
Vol 126 (1) ◽  
pp. K43-K47 ◽  
Author(s):  
J. Bak-Misiuk ◽  
J. Köhler ◽  
U. Pietsch
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Behaviour ◽  
Expansion Behaviour

Determination of Poisson's Ratio of Thin low-k Films using Bidirectional Thermal Expansion Measurement

2006 ◽  
Vol 914 ◽  
Author(s):  
Jiping Ye ◽  
Satoshi Shimizu ◽  
Shigeo Sato ◽  
Nobuo Kojima ◽  
Junnji Noro
Keyword(s):  
Thermal Expansion ◽  
Temperature Gradient ◽  
Young’S Modulus ◽  
Poisson’S Ratio ◽  
Silicon Oxide ◽  
Young's Modulus ◽  
Polymer Materials ◽  
Poisson's Ratio ◽  
Thermal Expansion Measurement ◽  
Low K

AbstractA recently developed bidirectional thermal expansion measurement (BTEM) method was applied to different types of low-k films to substantiate the reliability of the Poisson's ratio found with this technique and thereby to corroborate its practical utility. In this work, the Poisson's ratio was determined by obtaining the temperature gradient of the biaxial thermal stress from substrate curvature measurements, the temperature gradient of the whole thermal expansion strain along the film thickness from x-ray reflectivity (XRR) measurements, and reduced modulus of the film from nanoindentation measurements. For silicon oxide-based SiOC film having a thickness of 382.5 nm, the Poisson's ratio, Young's modulus and thermal extension coefficient (TEC) were determined to be Vf = 0.26, αf =21 ppm/K and Ef =9,7 GPa. These data are close to the levels of metals and polymers rather than the levels of fused silicon oxide, which is characterized by Vf = 0.17 and Er = 69.6 GPa. The alkyl component in the silicon oxide-based framework is thought to act as an agent in reducing the modulus and elevating the Poisson's ratio in SiOC low-k materials. In the case of an organic polymer SiLK film with a thickness of 501.5 nm, the Poisson's ratio, Young's modulus and TEC were determined to be Vf = 0.39, αf =74 ppm/K and Er =3.1 GPa, which are in the typical range of V= 0.34~0.47 with E =1.0~10 GPa for polymer materials. From the viewpoint of the relationship between the Poisson's ratio and Young's modulus as classified by different material types, the Poisson's ratios found for the silicon oxide-based SiOC and organic SiLK films are reasonable values, thereby confirming that BTEM is a reliable and effective method for evaluating the Poisson's ratio of thin films.

Size- and temperature-dependent Young's modulus and size-dependent thermal expansion coefficient of thin films

2016 ◽  
Vol 18 (31) ◽  
pp. 21508-21517 ◽  
Author(s):  
Xiao-Ye Zhou ◽  
Bao-Ling Huang ◽  
Tong-Yi Zhang
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Material Properties ◽  
Essential Role ◽  
Young's Modulus ◽  
Temperature Dependent ◽  
Size Dependent

Surfaces of nanomaterials play an essential role in size-dependent material properties.

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