scholarly journals Cross-Sectional TEM Studies of DIGM in Irradiated Au-Cu Bilayers

1992 ◽  
Vol 279 ◽  
Author(s):  
Yuzun Gao ◽  
Dale E. Alexander ◽  
L. E. Rehn
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Grain Boundary ◽  
Energy Dispersive Spectroscopy ◽  
Boundary Migration ◽  
Grain Boundary Migration ◽  
Cross Sectional ◽  
X Ray ◽  
Small Probe ◽  
Transmission Electron

ABSTRACTCross-sectional transmission electron microscopy was used to study diffusion-induced grain boundary migration (DIGM) in irradiated and annealed Au/Cu bilayers. Using this technique, in combination with small probe X-ray energy dispersive spectroscopy, DIGM alloyed zones in Au were identified in an irradiated sample.

scholarly journals Evidence of Stress Development as a Source of Driving Force for Grain-Boundary Migration in a Ni Bicrystalline TEM Specimen

Materials ◽  
2020 ◽  
Vol 13 (2) ◽  
pp. 360
Author(s):  
Sung Bo Lee ◽  
Jinwook Jung ◽  
Heung Nam Han
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Grain Boundary ◽  
Focused Ion Beam ◽  
Boundary Migration ◽  
Ion Beam ◽  
Grain Boundary Migration ◽  
Migration Behavior ◽  
Stress Development ◽  
Transmission Electron

In a previous study, using high-resolution transmission electron microscopy (HRTEM), we examined grain-boundary migration behavior in a Ni bicrystal. A specimen for transmission electron microscopy (TEM) was prepared using focused ion beam. The Ni lamella in the specimen was composed of two grains with surface normal directions of [1 0 0] and [1 1 0]. As the lamella was heated to 600 °C in a TEM, it was subjected to compressive stresses. The stress state of the Ni lamella approximated to the isostress condition, which was confirmed by a finite element method. However, the stress development was not experimentally confirmed in the previous study. In the present study, we present an observation of stacking faults with a length of 40–70 nm at the grain boundary as direct evidence of the stress development.

Direct Deposition Reactions Between Nickel and Silicon Substrates

1993 ◽  
Vol 311 ◽  
Author(s):  
Lin Zhang ◽  
Douglas G. Ivey
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Silicon Substrates ◽  
Silicide Formation ◽  
Cross Sectional ◽  
Deposition Rates ◽  
Plan View ◽  
X Ray ◽  
Si Substrates ◽  
Transmission Electron

ABSTRACTSilicide formation through deposition of Ni onto hot Si substrates has been investigated. Ni was deposited onto <100> oriented Si wafers, which were heated up to 300°C, by e-beam evaporation under a vacuum of <2x10-6 Torr. The deposition rates were varied from 0.1 nm/s to 6 nm/s. The samples were then examined by both cross sectional and plan view transmission electron microscopy (TEM), energy dispersive x-ray spectroscopy and electron diffraction. The experimental results are discussed in terms of a new kinetic model.

Effect of Ge-rich Si1−zGez Segregation on the Morphological Stability of NiSi1−uGeu Film Formed on Strained (001) Si0.8Ge0.2 Epilayer

2004 ◽  
Vol 810 ◽  
Author(s):  
H.B. Yao ◽  
D.Z. Chi ◽  
S. Tripathy ◽  
S.Y. Chow ◽  
W.D. Wang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Grain Boundary ◽  
Surface Morphology ◽  
Morphological Stability ◽  
Triple Junctions ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Segregation Process

ABSTRACTThe germanosilicidation of Ni on strained (001) Si0.8Ge0.2, particularly Ge segregation, grain boundary grooving, and surface morphology, during rapid thermal annealing (RTA) was studied. High-resolution cross-sectional transmission electron microscopy (HRXTEM) suggested that Ge-rich Si1−zGez segregation takes place preferentially at the germanosilicide/Si1−xGex interface, more specifically at the triple junctions between two adjacent NiSi1−uGeu grains and the underlying epi Si1−xGex, and it is accompanied with thermal grooving process. The segregation process accelerates the thermal grooving of NiSi1−uGeu grain boundaries at the interface. The segregation-accelerated grain boundary grooving has significant effect on the surface morphology of NiSi1−uGeu films in Ni-SiGe system.

Cross-Sectional TEM Study Of Phase Separation In Reaction Of Ni-Ta Films With GaAs

1985 ◽  
Vol 54 ◽  
Author(s):  
A. Lahav ◽  
M. Eizenberg ◽  
Y. Komem
Keyword(s):  
Electron Microscopy ◽  
Heat Treatment ◽  
Transmission Electron Microscopy ◽  
Phase Separation ◽  
Gaas Substrate ◽  
Auger Spectroscopy ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron

ABSTRACTThe reaction between Ni60Ta40 amorphous alloy and (001) GaAs was studied by cross-sectional transmission electron microscopy, Auger spectroscopy, and x-ray diffraction. At 400°C formation of Ni GaAs at the interface with GaAs was observed. After heat treatment at 600°C in vacuum a layered structure of TaAs/NiGa/GaAs has been formed. The NiGa layer has epitaxial relations to the GaAs substrate. The vertical phase separation can be explained by opposite diffusion directions of nickel and arsenic atoms.

scholarly journals Structural Property Study for GeSn Thin Films

Materials ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 3645
Author(s):  
Liyao Zhang ◽  
Yuxin Song ◽  
Nils von den Driesch ◽  
Zhenpu Zhang ◽  
Dan Buca ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Molecular Beam ◽  
Chemical Vapor ◽  
Threading Dislocations ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron

The structural properties of GeSn thin films with different Sn concentrations and thicknesses grown on Ge (001) by molecular beam epitaxy (MBE) and on Ge-buffered Si (001) wafers by chemical vapor deposition (CVD) were analyzed through high resolution X-ray diffraction and cross-sectional transmission electron microscopy. Two-dimensional reciprocal space maps around the asymmetric (224) reflection were collected by X-ray diffraction for both the whole structures and the GeSn epilayers. The broadenings of the features of the GeSn epilayers with different relaxations in the ω direction, along the ω-2θ direction and parallel to the surface were investigated. The dislocations were identified by transmission electron microscopy. Threading dislocations were found in MBE grown GeSn layers, but not in the CVD grown ones. The point defects and dislocations were two possible reasons for the poor optical properties in the GeSn alloys grown by MBE.

Solid-state reaction of Ru powder in molten AlxBi1−x

1990 ◽  
Vol 5 (4) ◽  
pp. 746-753 ◽  
Author(s):  
R. W. Johnson ◽  
C. M. Garland
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Solid State ◽  
Alloy System ◽  
Reaction Cross ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron ◽  
Metal Solvent

We describe a low-temperature solid-state interdiffusion technique that allows reaction between spatially separated reacting species and its application in the Al–Ru alloy system. This technique uses a liquid-metal solvent (Bi) as a medium for the transfer of Al to the surface of Ru powder where reaction occurs with the formation of nanocrystalline AlxRu1−x product phases. X-ray diffraction measurements are used to follow the time and temperature dependence of the reaction. Cross-sectional transmission electron microscopy allows direct imaging of the growth and morphology of the AlxRu1−x product phases.

The Formation Mechanism of Carrot Defects in SiC Epifilms

2006 ◽  
Vol 911 ◽  
Author(s):  
Hui Chen ◽  
Guan Wang ◽  
Yi Chen ◽  
Xiaoting Jia ◽  
Jie Bai ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Mechanism Of Formation ◽  
Cross Sectional ◽  
Screw Dislocations ◽  
X Ray ◽  
Transmission Electron ◽  
Sic Wafer ◽  
Scanning Electron

AbstractCarrot-like defects in a 7&#61616; off-cut (from [0001] toward <1-210> direction) 4H-SiC wafer with a 36μm thick 4H-SiC epilayer have been investigated using Nomarski optical microscopy, synchrotron white beam x-ray topography (SWBXT), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). X-ray topographs confirm that threading screw dislocations are often associated with the carrots. Cross-sectional TEM observation confirms that a prismatic stacking fault exists below the carrot. This fault was found to show contrast in all observed diffraction geometries except for g=0004. A model for the mechanism of formation of this type of defect during epitaxial growth is proposed.

Microstructure - Roughness Interelation in Ru/C and Ru/B4C X-RAY Multilayers

1992 ◽  
Vol 280 ◽  
Author(s):  
Tai D. Nguyen ◽  
Ronald Gronsky ◽  
Jeffrey B. Kortricht
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Diffuse Component ◽  
Interfacial Roughness ◽  
Cross Sectional ◽  
X Ray ◽  
Specular Scattering ◽  
Transmission Electron ◽  
Hrtem Observation

ABSTRACTX-ray specular and non-specular scattering, and high-resolution transmission electron microscopy (HRTEM) were performed to study the evolution of the microstructures and interfacial roughness in Ru/C and RU/B4C multilayers upon annealing. The microstructure of the approximately 1.4 nm thick Ru layers in the as-prepared 3.5 nm period multilayers is predominantly amorphous. The Ru layers in the Ru/B4C multilayer show RuB2nano-crystallites after annealing at 600°C for one hour, while those in the Ru/C multilayer crystallize to form hexagonal Ru crystallites. Cross-sectional HRTEM of the annealed Ru/C multilayer also shows agglomeration of the Ru layers. Non-specular measurements of the Ru/C multilayers indicate an enhanced uncorrelated roughness upon annealing. The diffuse component in the as-prepared and annealed RU/B4C multilayers shows insignificant changes. The increase in interfacial roughness in the Ru/C multilayer results from agglomeration of the Ru after annealing, consistent with HRTEM observation.

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