CoSi2/Si(111) Interface Structure and its Influence on the Schottky Barrier

1993 ◽  
Vol 320 ◽  
Author(s):  
J. P. Sullivan ◽  
W. R. Graham ◽  
F. Schrey ◽  
D. J. Eaglesham ◽  
R. Kola ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Film Growth ◽  
High Vacuum ◽  
Growth Conditions ◽  
Interface Structure ◽  
Ultra High Vacuum ◽  
Plan View ◽  
Barrier Heights ◽  
Interface Reconstruction ◽  
P Type

ABSTRACTThe interface structure and Schottky barrier height Of CoSi2/Si(111) interfaces may be controlled by manipulating the thin film growth conditions. Single crystal CoSi2 films on Si(111) were prepared by ultra-high vacuum processing, analyzed electrically by currentvoltage techniques, and characterized structurally by plan-view and cross-section high resolution transmission electron microscopy (HRTEM) and transm-ission electron diffraction (TED). Interfaces exhibiting n-type barrier heights ranging from 0.27 to 0.69 eV, and p-type barrier heights ranging from 0.43 eV to over 0.71 eV were prepared -by varying the processing conditions. HRTI3M and TED revealed the existence of a √3 × √3 interface reconstruction for the low barrier n-type/high barrier p-type samples. Possible models of the interface reconstruction are discussed.

Negative Electron Affinity Effects And Schottky Barrier Height Measurements Of Metals On Diamond (100) Surfaces

1995 ◽  
Vol 416 ◽  
Author(s):  
P. K. Baumann ◽  
R. J. Nemanich
Keyword(s):  
Schottky Barrier ◽  
Electron Affinity ◽  
Metal Layer ◽  
High Vacuum ◽  
Ultra High Vacuum ◽  
Negative Electron Affinity ◽  
Barrier Heights ◽  
Diamond Crystals ◽  
Natural Type ◽  
Semiconducting Diamond

ABSTRACTIn this study copper and cobalt films have been deposited on natural type IIb single crystal semiconducting diamond (100) surfaces in ultra-high vacuum (UHV). Prior to metal deposition the diamond crystals have been cleaned by a 1150°C anneal in UHV. This treatment resulted in positive electron affinity surfaces. Upon deposition of 2Å of Cu or Co a negative electron affinity (NEA) was observed. Schottky barrier heights of 0.70 eV and 0.35 eV were found for Cu and Co respectively. In-situ Auger electron spectroscopy (AES) was employed to confirm the presence of a metal layer.

Formation of Ultra-Shallow Junctions in Silicon by Rapid Thermal Vapor Phase Doping in an Ultrahigh Vacuum Rapid Thermal Processing System

1995 ◽  
Vol 387 ◽  
Author(s):  
Patricia A. O'neil ◽  
Katherine E. Violeite ◽  
Mehmet C. Öztürk ◽  
Igor C. Ivanov
Keyword(s):  
Vapor Phase ◽  
Thermal Processing ◽  
High Vacuum ◽  
Rapid Thermal Processing ◽  
Processing System ◽  
Growth Conditions ◽  
Ultra High Vacuum ◽  
Ultra Shallow Junctions ◽  
P Type ◽  
Wafer Manufacturing

AbstractIn this work, we have studied the formation of ultra-shallow p-type junctions by rapid vapor phase doping. The doping process was performed in an ultra high vacuum rapid thermal processing system using 0.1 l/min of a B2H6/H2 mixture. The B2H6 content of the mixture was only. 500 ppm corresponding to a B2H6 flow of 50 μl/min. In contrast, previous work in conventional and rapid thermal processing systems used B2H6 flows as high as 0.1 l/min which tend to form either pure boron or boron silicide layers depending on the processing conditions. In this study we exposed 4″, (100) oriented, n- and p-type silicon wafers to the B2H6/H2 mixture for varying growth conditions. Boron junction profiles were obtained at temperatures ranging from 650°C to 850°C. Boron dose, peak concentration, and junction depth were found as a function of growth temperature and time. Our results show that ultra-shallow (≤ 500 Å) boron profiles with surface concentrations above 1020 cm−3 can be obtained in Si at temperatures as low as 650°C. Typical process times range from 15 to 90 seconds making the process a good candidate for single wafer manufacturing in rapid thermal processing systems.

Direct STEM ADF imaging of gold on silicon (111)

1989 ◽  
Vol 47 ◽  
pp. 472-473
Author(s):  
P. Xu ◽  
E. J. Kirkland ◽  
J. Silcox
Keyword(s):  
Film Growth ◽  
Heavy Atom ◽  
High Vacuum ◽  
Dark Field ◽  
Thin Metal Film ◽  
Base Pressure ◽  
Ultra High Vacuum ◽  
Specimen Preparation ◽  
Dark Field Imaging ◽  
Wide Range

Many studies of thin metal film growth and the formation of metal-semiconductor contacts have been performed using a wide range of experimental methods. STEM annular dark field imaging could be an important complement since it may allow direct imaging of a single heavy atom on a thin silicon substrate. This would enable studies of the local atomic arrangements and defects in the initial stage of metal silicide formation.Preliminary experiments were performed in an ultra-high vacuum VG HB501A STEM with a base pressure of 1 × 10-10 mbar. An antechamber directly attached to the microscope for specimen preparation has a base pressure of 2×l0-10 mbar. A thin single crystal membrane was fabricated by anodic etching and subsequent reactive etching. The specimen was cleaned by the Shiraki method and had a very thin oxide layer left on the surface. 5 Å of gold was deposited on the specimen at room temperature from a tungsten filament coil monitored by a quartz crystal monitor.

Modifications of a JEOL 2000EX TEM for insSitu surface studies

1993 ◽  
Vol 51 ◽  
pp. 640-641
Author(s):  
Michael T. Marshall ◽  
Xianghong Tong ◽  
J. Murray Gibson
Keyword(s):  
Electron Diffraction ◽  
Surface Science ◽  
Film Growth ◽  
High Vacuum ◽  
High Energy ◽  
Energy Electron ◽  
Ultra High Vacuum ◽  
Transmission Electron ◽  
Fundamental Insight

We have modified a JEOL 2000EX Transmission Electron Microscope (TEM) to allow in-situ ultra-high vacuum (UHV) surface science experiments as well as transmission electron diffraction and imaging. Our goal is to support research in the areas of in-situ film growth, oxidation, and etching on semiconducter surfaces and, hence, gain fundamental insight of the structural components involved with these processes. The large volume chamber needed for such experiments limits the resolution to about 30 Å, primarily due to electron optics. Figure 1 shows the standard JEOL 2000EX TEM. The UHV chamber in figure 2 replaces the specimen area of the TEM, as shown in figure 3. The chamber is outfitted with Low Energy Electron Diffraction (LEED), Auger Electron Spectroscopy (AES), Residual Gas Analyzer (RGA), gas dosing, and evaporation sources. Reflection Electron Microscopy (REM) is also possible. This instrument is referred to as SHEBA (Surface High-energy Electron Beam Apparatus).The UHV chamber measures 800 mm in diameter and 400 mm in height. JEOL provided adapter flanges for the column.

Studies of Ge/Si(100) and Observation of Atomic Steps on Si(100) using Biassed Secondary Electron Imaging in a UHV STEM

1990 ◽  
Vol 48 (1) ◽  
pp. 308-309
Author(s):  
Mohan Krishnamurthy ◽  
Jeff S. Drucker ◽  
John A. Venablest
Keyword(s):  
Secondary Electron ◽  
Critical Thickness ◽  
Surface Defects ◽  
Film Growth ◽  
Growth Parameters ◽  
High Vacuum ◽  
Ultra High Vacuum ◽  
Surface Steps ◽  
Epitaxial Crystal Growth ◽  
Electron Imaging

Secondary Electron Imaging (SEI) has become a useful mode of studying surfaces in SEM[1] and STEM[2,3] instruments. Samples have been biassed (b-SEI) to provide increased sensitivity to topographic and thin film deposits in ultra high vacuum (UHV)-SEM[1,4]; but this has not generally been done in previous STEM studies. The recently developed UHV-STEM ( codenamed MIDAS) at ASU has efficient collection of secondary electrons using a 'parallelizer' and full sample preparation system[5]. Here we report in-situ deposition and annealing studies on the Ge/Si(100) epitaxial system, and the observation of surface steps on vicinal Si(100) using b-SEI under UHV conditions in MIDAS.Epitaxial crystal growth has previously been studied using SEM and SAM based experiments [4]. The influence of surface defects such as steps on epitaxial growth requires study with high spatial resolution, which we report for the Ge/Si(100) system. Ge grows on Si(100) in the Stranski-Krastonov growth mode wherein it forms pseudomorphic layers for the first 3-4 ML (critical thickness) and beyond which it clusters into islands[6]. In the present experiment, Ge was deposited onto clean Si(100) substrates misoriented 1° and 5° toward <110>. This was done using a mini MBE Knudsen cell at base pressure ~ 5×10-11 mbar and at typical rates of 0.1ML/min (1ML =0.14nm). Depositions just above the critical thickness were done for substrates kept at room temperature, 375°C and 525°C. The R T deposits were annealed at 375°C and 525°C for various times. Detailed studies were done of the initial stages of clustering into very fine (∼1nm) Ge islands and their subsequent coarsening and facetting with longer anneals. From the particle size distributions as a function of time and temperature, useful film growth parameters have been obtained. Fig. 1 shows a b-SE image of Ge island size distribution for a R T deposit and anneal at 525°C. Fig.2(a) shows the distribution for a deposition at 375°C and Fig.2(b) shows at a higher magnification a large facetted island of Ge. Fig.3 shows a distribution of very fine islands from a 525°C deposition. A strong contrast is obtained from these islands which are at most a few ML thick and mottled structure can be seen in the background between the islands, especially in Fig.2(a) and Fig.3.

Laser cleaning of exfoliated graphene

2012 ◽  
Vol 1455 ◽  
Author(s):  
Oliver Ochedowski ◽  
Benedict Kleine Bußmann ◽  
Marika Schleberger
Keyword(s):  
Local Heating ◽  
High Vacuum ◽  
Ultra High Vacuum ◽  
Ambient Conditions ◽  
Kelvin Probe ◽  
Structural Modifications ◽  
Force Microscopy ◽  
Exfoliated Graphene ◽  
Atomic Force ◽  
P Type

ABSTRACTWe have employed atomic force and Kelvin-Probe force microscopy to study graphene sheets exfoliated on TiO2 under the influence of local heating achieved by laser irradiation. Exfoliation and irradiation took place under ambient conditions, the measurements were performed in ultra high vacuum. We show that after irradiation times of 6 min, an increase of the surface potential is observed which indicates a decrease of p-type carrier concentration. We attribute this effect to the removal of adsorbates like water and oxygen. After irradiation times of 12 min our topography images reveal severe structural modifications of graphene. These resemble the nanocrystallite network which form on graphene/SiO2 but after much longer irradiation times. From our results we propose that short laser heating at moderate powers might offer a way to clean graphene without inducing unwanted structural modifications.

Schottky Barrier Heights of Cr Contacts on n- and p-Type 6H-SiC

1997 ◽  
Vol 14 (6) ◽  
pp. 460-463 ◽  
Author(s):  
Zhang Yong-gang ◽  
Li Ai-zhen ◽  
A G Milnes
Keyword(s):  
Schottky Barrier ◽  
Barrier Heights ◽  
P Type

Carbon Incorporation in Gaas grown by UHVCVD Using Trimethylgallium and Arsine

1992 ◽  
Vol 281 ◽  
Author(s):  
Seong-Ju Park ◽  
Jeong-Rae Ro ◽  
Jae-Ki Sim ◽  
El-Hang Lee
Keyword(s):  
Growth Rates ◽  
Hole Concentration ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Chemical Beam Epitaxy ◽  
Hydrogen Atoms ◽  
Carbon Incorporation ◽  
Significant Drop ◽  
P Type

ABSTRACTWe present results of a study on the effect of unprecracked arsine(AsH3) and trimethylgallium(TMGa) on carbon incorporation in UHVCVD(Ultra High Vacuum Chemical Vapor Deposition) grown GaAs epilayers on GaAs(100). Three distinct temperature-dependent regions of growth rates were identified as growth temperature was increased from 570 to 690°C. The growth rates were also strongly dependent on V/III ratio in a range of 5 to 30, which clearly indicates that the growth rate is determined by the amount of arsenic adsorbed on the surface at low V/III ratio and adsorption of TMGa or decomposition process at high V/III ratio. Hall concentration measurements and low temperature photoluminescence data show that the films are all p-type and their impurity concentrations are reduced by two orders of magnitude compared to those of epilayers grown by CBE(Chemical Beam Epitaxy) which employs TMGa and arsenic(precracked arsines) as source materials. Our results indicate that the hydrogen atoms dissociated from adsorbed arsine may remove hydrocarbon species resulting in a significant drop in hole concentration.

Increased Schottky barrier heights for Au on n- and p-type GaN using cryogenic metal deposition

2006 ◽  
Vol 89 (12) ◽  
pp. 122106 ◽  
Author(s):  
Hung-Ta Wang ◽  
S. Jang ◽  
T. Anderson ◽  
J. J. Chen ◽  
B. S. Kang ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Metal Deposition ◽  
Barrier Heights ◽  
P Type
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