Contact Dependence of α-Sexithienyl Thin Film Transistor Characteristics

1995 ◽  
Vol 413 ◽  
Author(s):  
Y. Y. Lin ◽  
D. J. Gundlach ◽  
T. N. Jackson

ABSTRACTWe have fabricated thin film transistors (TFTs) using ca-sexithienyl (α-6T) as the active material and have investigated the dependence of transistor characteristics on the choice of source/drain contact metal. Using α-6T synthesized from terthiophene and purified by vacuum gradient sublimation, we have fabricated TFTs with material deposited by evaporation onto substrates held at both room and elevated temperature. We have studied devices fabricated by depositing the active material onto previously patterned source/drain contacts and also by depositing the source/drain contacts after the active layer deposition, in both cases with the gate contact and dielectric underneath the active material. For both device types we find a clear dependence on the choice of source/drain contact metal with correlation to the metal work function. For our devices the best performance is obtained using metals with largest work function (Pd, Pt, or Au), intermediate performance is obtained using a metal with somewhat smaller work function (Cr), and significantly degraded performance is obtained using a metal with relatively small work function (Al). Despite the apparent correlation to the metal work function, we cannot yet rule out oxidation or other chemical effects with the more reactive metals. We have also examined doping of the α-6T layer as a possible route to improved contacts and find that FeCI3 can be used to shift the threshold voltage of α-6T TFTs by more than 50 V.

2016 ◽  
Vol 49 (27) ◽  
pp. 275101 ◽  
Author(s):  
Mandeep Singh ◽  
Mohammad Yusuf Mulla ◽  
Maria Vittoria Santacroce ◽  
Maria Magliulo ◽  
Cinzia Di Franco ◽  
...  

Nano Futures ◽  
2021 ◽  
Author(s):  
Min-Won Kim ◽  
Ji-Hun Kim ◽  
Jun-Seong Park ◽  
Byoung-Seok Lee ◽  
Sangdong Yoo ◽  
...  

Abstract In a two-terminal-electrode vertical thyristor, the latch-up and latch-down voltages are decreased when the memory operation temperature of the memory cells increases, resulting in a severe reliability issue (i.e., thermal instability). This study fundamentally solves the thermal instability of a vertical-thyristor by achieving a cross-point memory-cell array using a vertical-thyristor with a structure of vertical n++-emitter, p+-base, n+-base, and p++-emitter. The vertical-thyristor using a Schottky contact metal emitter instead of an n++-Si emitter significantly improves the thermal stability between 293 and 373 K. Particularly, the improvement degree of the thermal stability is increased significantly with the use of the Schottky contact metal work function. Because the thermal instability (i.e., degree of latch-up voltage decrement vs. memory operation temperature) decreases with an increase in the Schottky contact metal work function, the dependency of the forward current density between the Schottky contact metal and p+-Si based on the memory operation temperature reduces with increase in the Schottky contact metal work function. Consequently, a higher Schottky contact metal work function produces a higher degree of improvement in the thermal stability, i.e., W (4.50 eV), Ti (4.33 eV), Ta (4.25 eV), and Al (4.12 eV). Further research on the fabrication process of a Schottky contact metal emitter vertical-thyristor is essential for the fabrication of a 3-D cross-point memory-cell.


Crystals ◽  
2019 ◽  
Vol 9 (11) ◽  
pp. 603
Author(s):  
Jang ◽  
Lee

In this short commentary, we discuss a fundamental reason why two different semiconductor technologies are needed for complementary thin-film transistor (TFT) operations. It is mainly related to an energy-level matching between the band edge of the semiconductor and the work-function energy of the metal, which is used for the source and drain electrodes. The reference energy level is determined by the energy range of work-functions of typical metals for the source and drain electrodes. With the exception of silicon, both the conduction band edge (EC) and valence band edge (EV) of a single organic or inorganic material are unlikely to match the metal work-function energy whose range is typically from –4 to –6 eV. For example, typical inorganic materials, e.g., Zn–O, have the EC of around –4.5 eV (i.e., electron affinity), so the conduction band edge is within the range of the metal work-function energy, suggesting its suitability for n-channel TFTs. On the other hand, p-type inorganic materials, such as Cu–O, have an EV of around –5.5 eV, so the valence band edge is aligned with metal work-function energy, thus the usage for p-channel TFTs. In the case of p-type and n-type organic materials, their highest occupied molecular orbital (HOMO) and lowest occupied molecular orbital (LUMO) should be aligned with metal work-function energy. For example, p-type organic material, e.g., pentacene, has a HOMO level around –5 eV, which is within the range of the metal work-function energy, implying usage for p-channel TFTs. However, its LUMO level is around –3 eV, not being aligned with the metals’ work-function energy. So it is hard to use pentacene for n-channel TFTs. Along with this, n-type organic materials (e.g., C60) should have HOMO levels within the typical metals’ work-function energy for the usage of n-channel TFT. To support this, we provide a qualitative and comparative study on electronic material properties, such as the electron affinity and band-gap of representative organic and inorganic materials, and the work-function energy of typical metals.


Author(s):  
Seung-Hwan Lee ◽  
Hyun-Jun Jeong ◽  
Ki-Lim Han ◽  
GeonHo Beak ◽  
Jin-Seong Park

Indium oxide and indicone hybrid films consisting of indium oxide and organic aromatic linker are grown by molecular layer deposition (MLD) using bis(trimethylsilyl)amido-diethyl Indium (INCA-1) as the indium precursor, hydrogen...


2011 ◽  
Vol 26 (8) ◽  
pp. 085007 ◽  
Author(s):  
Byeong-Yun Oh ◽  
Young-Hwan Kim ◽  
Hee-Jun Lee ◽  
Byoung-Yong Kim ◽  
Hong-Gyu Park ◽  
...  

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