Properties of H, O and C in GaN

1996 ◽  
Vol 421 ◽  
Author(s):  
S. J. Pearton ◽  
C. R. Abernathy ◽  
J. W. Lee ◽  
C. B. Vartuli ◽  
J. D. MacKenzie ◽  
...  

AbstractThe electrical properties of the light ion impurities H, O and C in GaN have been examined in both as-grown and implanted material. H is found to efficiently passivate acceptors such as Mg, Ca and C. Reactivation occurs at ≥450°C and is enhanced by minority carrier injection. The hydrogen does not leave the GaN crystal until >800°C, and its diffusivity is relatively high (˜10−11cm2/s) even at low temperatures (<200°C) during injection by wet etching, boiling in water or plasma exposure. Oxygen shows a low donor activation efficiency when implanted into GaN, with an ionization level of 30 - 40 meV. It is essentially immobile up to 1100°C. Carbon can produce low p-type levels (3×1017cm−3) in GaN during MOMBE, although there is some evidence it may also create n-type conduction in other nitrides.

Nanomaterials ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 508 ◽  
Author(s):  
Stanislav Tiagulskyi ◽  
Roman Yatskiv ◽  
Hana Faitová ◽  
Šárka Kučerová ◽  
David Roesel ◽  
...  

We study the effect of thermal annealing on the electrical properties of the nanoscale p-n heterojunctions based on single n-type ZnO nanorods on p-type GaN substrates. The ZnO nanorods are prepared by chemical bath deposition on both plain GaN substrates and on the substrates locally patterned by focused ion beam lithography. Electrical properties of single nanorod heterojunctions are measured with a nanoprobe in the vacuum chamber of a scanning electron microscope. The focused ion beam lithography provides a uniform nucleation of ZnO, which results in a uniform growth of ZnO nanorods. The specific configuration of the interface between the ZnO nanorods and GaN substrate created by the focused ion beam suppresses the surface leakage current and improves the current-voltage characteristics. Further improvement of the electrical characteristics is achieved by annealing of the structures in nitrogen, which limits the defect-mediated leakage current and increases the carrier injection efficiency.


2017 ◽  
Vol 55 (6) ◽  
pp. 2283-2290
Author(s):  
Mohamed Errai ◽  
Abdelhamid El kaaouachi ◽  
Hassan El idrissi ◽  
Asmae Chakhmane

2011 ◽  
Vol 675-677 ◽  
pp. 101-104
Author(s):  
Qi Zhi Xing ◽  
Wei Dong ◽  
Shu Ang Shi ◽  
Guo Bin Li ◽  
Yi Tan

Multi-crystalline silicon ingots were prepared by directional solidification using vacuum induction melting furnace. The content of aluminum and iron deeply decreased in the columnar crystal region of the multi-crystalline silicon ingots. The columnar crystal growth broke off corresponded to the iron contents sharply increased. The height of columnar crystal in the silicon ingots related to the pulling rates had been clarified by the constitutional supercooling theory. The maximum of the resistivity and the minority carrier lifetime closed to the transition zone where the conductive type changed from p-type to n-type in silicon ingots. Further analysis suggested that the electrical properties were related to the contents of shallow level impurities aluminum, boron and phosphorus.


2010 ◽  
Vol 49 (9) ◽  
pp. 091302 ◽  
Author(s):  
Orhan Özdemir ◽  
U. Deneb Yilmazer ◽  
Beyhan Tatar ◽  
Mustafa Ürgen ◽  
Kubilay Kutlu

1965 ◽  
Vol 8 (3) ◽  
pp. K159-K162 ◽  
Author(s):  
F. P. Kesamanly ◽  
D. N. Nasledov ◽  
Yu. V. Rud

1990 ◽  
Vol 184 ◽  
Author(s):  
A. J. Tavendale ◽  
S. J. Pearton ◽  
A. A. Williams ◽  
D. Alexiev

ABSTRACTWe detail experiments showing that acceptor passivation by atomic hydrogen in p-type GaAs is unstable to either illumination, forward bias annealing or reverse bias annealing. The long-term stability of operation of devices employing hydrogen in or near the active region of FETs or quantum-well lasers is therefore questionable. The systematics of acceptor reactivation during minority carrier injection or reverse bias annealing are presented.


1992 ◽  
Vol 242 ◽  
Author(s):  
I. Akasaki ◽  
H. Amano

ABSTRACTThe method for controlling the electrical properties of n-type GaN and AIGaN have been established. Both GaN and AIGaN films having p - type conduction have been realized for the first time. High quality AIGaN/GaN mu I t i-he t er ostrueture showing clear quantum size effect has been fabricated. P-n junction type UV/blue LED with double he t e ros t rue ture have been developed for the first time.


1985 ◽  
Vol 63 (6) ◽  
pp. 723-726
Author(s):  
N. Garry Tarr

The fabrication of junctions with very low minority-carrier injection ratios and reasonably good diode characteristics on p-type silicon is reported. These junctions were formed by growing an ultrathin oxide layer on a monocrystalline substrate, depositing polysilicon heavily doped in situ with phosphorus over the oxide, overlaying the polysilicon with aluminum, and then annealing the resulting sandwich structure at temperatures in the range 400–450 °C. The junctions can exhibit leakage current densities below 10−6 A∙cm−2 at moderate reverse bias and reverse breakdown voltages in excess of 20 V. The absence of minority-carrier injection has been demonstrated by diode reverse recovery transient measurements and by the fabrication of bipolar transistors employing these junctions as emitters.


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