Lattice-Matched InAsN(X=0.38) on GaAs Grown by Molecular Beam Epitaxy

1996 ◽  
Vol 423 ◽  
Author(s):  
Y. C. Kao ◽  
T. P. E. Broekaert ◽  
H. Y. Liu ◽  
S. Tang ◽  
I. H. Ho ◽  
...  

AbstractIn this paper, we report the MBE growth of high nitrogen content lattice-matched InAs1−xNx (x=0.38) single crystal epitaxial films on GaAs. The nitrogen incorporation is about an order higher than previously reported on other mixed group V nitride alloys. These data are consistent with a nitrogen solubility limit calculation in various III-V binary alloys, which predicts orders of magnitude higher nitrogen incorporation in InAs than any other alloys. InAsN growths were obtained using a modified ECR-MBE system with atomic-nitrogen generated by an ECR plasma source. Improved crystal quality was obtained using a “template” growth technique. An x-ray linewidth of 270 arc-s was achieved on a 0.4 μm thick InAs0.62N0.38/GaAs multi-layer structure. Hall effect data show these InAsN films are semi-metallic.

Author(s):  
Bedwyr Humphreys ◽  
Matthew Govett

A room temperature (RT) plasma etch process has been developed to non-selectively etch GaN/InGaN/AlGaN structures, grown on sapphire substrates, using an electron cyclotron resonance (ECR) plasma source with RIE enhancement. The process chemistry chosen was Cl2/CH4 based in order to facilitate the formation of volatile etch by-products, typically to form group III halides and group V hydrides, although indium is more likely to form an organo-metallic compound as opposed to a chloride. A characteristic of this process is the very smooth sidewall features obtained and the controllability of the etch profile via ECR power, table bias and/or gas flow ratio. Typical results obtained using a RT process were etch rate above 100 nm/min., selectivity to resist mask above 30:1 and smooth anisotropic profile at low ion-energies (below 100 eV). The process etch rate showed a characteristic increase with increasing table bias (above 130 nm/min.) with only small changes in the relative etch rate of each compound (i.e. selectivity maintained at roughly 1:1), however, this etch does rely upon competing etching and deposition mechanisms and thus too large a variation in one parameter without a corresponding compensation with another leads to a rough surface and a more selective etch. The process has also been demonstrated using a metal mask (e.g. Ni) and present work is progressing onto other gas combinations and the use of high temperature electrodes.


2000 ◽  
Vol 5 (S1) ◽  
pp. 474-480 ◽  
Author(s):  
Sylvia G. Spruytte ◽  
Christopher W. Coldren ◽  
Ann F. Marshall ◽  
Michael C. Larson ◽  
James S. Harris

Nitride-Arsenide materials were grown by molecular beam epitaxy (MBE) using a radio frequency (rf) nitrogen plasma. The plasma conditions that maximize the amount of atomic nitrogen versus molecular nitrogen were determined using the emission spectrum of the plasma. Under constant plasma source conditions and varying group III flux, the nitrogen concentration in the film is inversely proportional to the group III flux (i. e. the nitrogen sticking coefficient is unity). The relationship between nitrogen concentration in the film and lattice parameter of the film is not linear for nitrogen concentrations above 2.9 mole % GaN, indicating that some nitrogen is incorporated on other locations than the group V lattice sites. For films with these higher nitrogen concentrations, XPS indicates that the nitrogen exists in two configurations: a Gallium-Nitrogen bond and another type of nitrogen complex in which nitrogen is less strongly bonded to Gallium atoms. Annealing removes this nitrogen complex and allows some of the nitrogen to diffuse out of the film. Annealing also improves the crystal quality of GaAsN quantum wells.


1997 ◽  
Vol 175-176 ◽  
pp. 844-848 ◽  
Author(s):  
Makoto Kudo ◽  
Tomoyoshi Mishima
Keyword(s):  
Si Doped ◽  

1989 ◽  
Vol 160 ◽  
Author(s):  
G. Bai ◽  
M-A. Nicolet ◽  
S.-J. Kim ◽  
R.G. Sobers ◽  
J.W. Lee ◽  
...  

AbstractSingle layers of ~ 0.5µm thick InuGa1-uAs1-vPv (0.52 < u < 0.63 and 0.03 < v < 0.16) were grown epitaxially on InP(100) substrates by liquid phase epitaxy at ~ 630°C. The compositions of the films were chosen to yield a constant banndgap of ~ 0.8 eV (λ = 1.55 µm) at room temperature. The lattice mismatch at room temperature between the epitaxial film and the substrate varies from - 4 × 10-3 to + 4 × 10-3. The strain in the films was characterized in air by x-ray double crystal diffractometry with a controllable heating stage from 23°C to ~ 700°C. All the samples have an almost coherent interfaces from 23°C to about ~ 330°C with the lattice mismatch accomodated mainly by the tetragonal distortion of the epitaxial films. In this temperature range, the x-ray strain in the growth direction increases linearly with temperature at a rate of (2.0 ± 0.4) × 10-6/°C and the strain state of the films is reversible. Once the samples are heated above ~ 300°C, a significant irreversible deterioration of the epitaxial films sets in.


2001 ◽  
Vol 16 (5) ◽  
pp. 413-419 ◽  
Author(s):  
A E Zhukov ◽  
R Zhao ◽  
P Specht ◽  
V M Ustinov ◽  
A Anders ◽  
...  
Keyword(s):  

1996 ◽  
Vol 449 ◽  
Author(s):  
I. H. Ho ◽  
G.B. Stringfellow

ABSTRACTA model based on the valence-force-field (VFF) model has been developed specifically for the calculation of the irascibility gaps in III-V nitride alloys. In the dilute limit, this model allows the relaxation of the atoms on both sublattices. It was found that the energy due to bond stretching and bond bending was lowered and the solubility limit was increased substantially when both sublattices were allowed to relax to distances as large as the sixth nearest neighbor positions. Using this model, the equilibrium mole fraction of N in GaP was calculated to be 6×l0−7 at 700°C. This is slightly higher than the calculated results from the semi-empirical delta lattice parameter (DLP) model. Both the temperature dependence and the absolute values of the calculated solubility agree closely with the experimental data. The solubility is more than three orders of magnitude larger than the result obtained using the VFF model with the group V atom positions given by the virtual crystal approximation, i.e., with relaxation of only the first neighbor bonds. Other nitride systems, such as GaAsN, AlPN, AlAsN, InPN, and InAsN were investigated as well. The equilibrium mole fractions of nitrogen in InP and InAs are the highest, which agrees well with recent experimental data where high N concentrations have been produced in InAsN alloys. Calculations were also performed for the alloy systems with mixing on the group III sublattice that are so important for device applications. Allowing relaxation to the 3rd nearest neighbor gives an In solubility in GaN at 800°C of less than 6%. Again, this is in agreement with the results of the DLP model calculation. This result may partially explain the difficulties experienced with the growth of these alloys. Indeed, evidence of solid immiscibility has recently been reported. A significant miscibility gap was also calculated for the AlInN system, but the AlGaN system is completely miscible.


2002 ◽  
Vol 727 ◽  
Author(s):  
Yeonjoon Park ◽  
Rian Zhao ◽  
Petra Specht ◽  
Eicke R. Weber

AbstractWe used a high current density focused electron beam to modify a GaAs substrate. To avoid any oxidation or carbon contamination problem, an in-situ electron gun, combined with III-V molecular beam epitaxy (MBE) machine, was used. By changing the substrate temperature and the electron beam dwell time on each spot, different sizes of thermal irradiation marks were created. Fabricated spot-diameters in the sub-micrometer range suggest the possible utilization of this process for novel applications with the MBE growth technique.


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