Effect of Si Doping on The Structure of Gan

1996 ◽  
Vol 423 ◽  
Author(s):  
Zuzanna Liliental-Weber ◽  
S. Ruvimov ◽  
T. Suski ◽  
J. W. Ager ◽  
W. Swider ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Dopant Concentration ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Silicon Doping ◽  
Defect Reduction ◽  
Si Doping ◽  
Transmission Electron ◽  
Metal Organic

AbstractThe influence of Si doping on the structure of GaN grown by metal-organic chemicalvapor deposition (MOCVD) has been studied using transmission electron microscopy (TEM), x-ray diffraction and Raman spectroscopy. Undoped and low Si doped samples were compared with samples of increased dopant concentration. In addition, defect reduction due to different buffer layers (AIN and GaN) is discussed. Silicon doping improves surface morphology and influences threading dislocation arrangement. High doping leads to a more random distribution of dislocations. Based on this study it appears (for the same dopant concentration) that an AIN buffer layer can significantly reduce the number of threading dislocations, leaving the samples more strained. However, no significant reduction of threading dislocations could be observed in the samples with GaN buffer layer. These samples are the least strained.

Annihilation of Threading Dislocations in Regrown GaN on Electrochemically Etched Nanoporous GaN Template with Optimization of Buffer Layer Growth

2007 ◽  
Vol 31 ◽  
pp. 227-229
Author(s):  
C.B. Soh ◽  
H. Hartono ◽  
S.Y. Chow ◽  
Soo Jin Chua
Keyword(s):  
Electron Microscopy ◽  
Buffer Layer ◽  
Electrochemical Etching ◽  
Layer Growth ◽  
Device Fabrication ◽  
Buffer Layers ◽  
Threading Dislocations ◽  
High Quality ◽  
Transmission Electron ◽  
Gan Buffer Layer

Nanoporous GaN template has been fabricated by electrochemical etching to give hexagonal pits with nano-scale pores of size 20-50 nm in the underlying grains. Electrochemical etching at The effect of GaN buffer layer grown at various temperatures from 650°C to 1015°C on these as-fabricated nano-pores templates are investigated by transmission electron microscopy. The buffer layer grown at the optimized temperature of 850°C partially fill up the pores and voids with annihilation of threading dislocations, serving as an excellent template for high-quality GaN growth. This phenomenon is, however not observed for the samples grown with other temperature buffer layers. The PL spectrum for the regrowth GaN on nanoporous GaN template also shows an enhancement of PL intensity for GaN peak compared to as-grown GaN template, which is indicative of its higher crystal quality. This makes it as a suitable template for subsequent device fabrication.

Stress and Microstructure Evolution in Compositionally Graded Al1-xGaxN Buffer Layers for GaN Growth on Si

2005 ◽  
Vol 892 ◽  
Author(s):  
Xiaojun Weng ◽  
Srinivasan Raghavan ◽  
Elizabeth C Dickey ◽  
Joan M Redwing
Keyword(s):  
Buffer Layer ◽  
Compressive Stress ◽  
Microstructure Evolution ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Cross Sectional ◽  
Si Substrates ◽  
Transmission Electron ◽  
Dislocation Annihilation

AbstractWe have studied the evolution of stress and microstructure of compositionally graded Al1-xGaxN (0 ≤ x ≤1) buffer layers on (111) Si substrates with varying thicknesses. In-situ stress measurements reveal a tensile-to-compressive stress transition that occurs near the half-thickness in each buffer layer. Cross-sectional transmission electron microscopy (TEM) shows a significant reduction in threading dislocation (TD) density in the top half of the buffer layer, suggesting that the compressive stress enhances the threading dislocation annihilation. The composition of the buffer layers varies linearly with thickness, as determined by X-ray energy dispersive spectrometry (XEDS). The composition grading-induced compressive stress offsets the tensile stress introduced by microstructure evolution, thus yielding a tensile-to-compressive stress transition at x ≈ 0.5.

Threading Dislocations in S-Graded ZnSxSe1-x/GaAs (001) Metamorphic Buffer Layers

2014 ◽  
Vol 23 (01n02) ◽  
pp. 1420005 ◽  
Author(s):  
Tedi Kujofsa ◽  
John E. Ayers
Keyword(s):  
Dislocation Density ◽  
Buffer Layer ◽  
Lattice Relaxation ◽  
Buffer Layers ◽  
Cumulative Distribution ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Modeling Studies ◽  
Threading Dislocation Density ◽  
Dislocation Behavior

Metamorphic semiconductor devices are commonly fabricated with linearly-graded buffer layers, but equilibrium modeling studies suggest that S-graded buffers, following a normal cumulative distribution function, may enable lower threading defect densities. The present work involves a study of threading dislocation density behavior in S-graded ZnS x Se 1-x buffer layers for metamorphic devices on mismatched GaAs (001) substrates using a kinetic model for lattice relaxation and misfit-threading dislocation interactions. The results indicate that optimization of an S-graded buffer layer to minimize the surface threading dislocation density requires adjustment of the standard deviation parameter and cannot be achieved by varying the buffer thickness alone. Furthermore, it is possible to tailor the design of the S-graded buffer layer in such a way that the density of mobile threading dislocations at the surface vanishes. Nonetheless, the threading dislocation behavior in these heterostructures is quite complex, and a full understanding of their behavior will require further experimental and modeling studies.

Evidence of the De-multiplication Interactions Between Threading Dislocations in GaN Films Grown on (0001) Sapphire Substrates

2007 ◽  
Vol 994 ◽  
Author(s):  
Cheng-Liang Wang ◽  
Jyh-Rong Gong
Keyword(s):  
Type A ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Organometallic Vapor Phase Epitaxy ◽  
Reduced Pressure ◽  
Sapphire Substrates ◽  
Multiplication Process ◽  
Transmission Electron ◽  
Type C

AbstractWe report the observation of threading dislocation de-multiplication process by transmission electron microscopy (TEM). The GaN films used in this study were grown on (0001) sapphire substrates with LT-GaN buffer layers by reduced pressure organometallic vapor phase epitaxy. By using g · Db = 0 invisibility criterion, it was found that some of TDs were de-multiplicated by interactions among themselves. In particular, type a+c TDs were found to nucleate through the interactions between type a and type c TDs in GaN near the GaN/sapphire interface so that the de-multiplication of TDs in GaN films was achieved.

TEM investigation of defect reduction and etch pit formation in GaN

2003 ◽  
Vol 798 ◽  
Author(s):  
Angelika Vennemann ◽  
Jens Dennemarck ◽  
Roland Kröger ◽  
Tim Böttcher ◽  
Detlef Hommel ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Dislocation Density ◽  
Line Tension ◽  
Threading Dislocations ◽  
Dislocation Loops ◽  
Etch Pits ◽  
Defect Reduction ◽  
Transmission Electron ◽  
Order Of Magnitude ◽  
Edge Dislocations

ABSTRACTGaN samples of this study were chemically wet etched to gain easier access to the dislocation sturcture. The scanning electron microscopy and transmission electron microscopy investigations revealed four different types of etch pits. After brief etching, several dislocations with screw component showed large etch pits, which may be correlated with the core of the screw dislocation. By means of SiNx micromasking the dislocation density could be reduced by more than one order of magnitude. The reduction of threading dislocations in the SiNx region in GaN grown on 〈0001〉 sapphire is due to bending of the threading dislocations into the {0001} plane, such that they form dislocation loops if they meet dislocations with opposite Burgers vectors. Accordingly, the achievable reduction of the dislocation density is limited by the probability that these dislocations interact. Edge dislocations bend more easily on account of their low line tension. This results in a preferential bending and reduction of dislocations with edge character.

Defect Reduction in GaAs Epilayers on Si Substrates Using Strained Layer Superlattices

1987 ◽  
Vol 91 ◽  
Author(s):  
N. El-Masry ◽  
N. Hamaguchi ◽  
J.C.L. Tarn ◽  
N. Karam ◽  
T.P. Humphreys ◽  
...  
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Buffer Layers ◽  
Threading Dislocations ◽  
Defect Reduction ◽  
Strained Layer ◽  
Si Substrates ◽  
Density Of Dislocations ◽  
Strained Layer Superlattice ◽  
Strained Layer Superlattices

ABSTRACTInxGa11-xAs-GaAsl-yPy strained layer superlattice buffer layers have been used to reduce threading dislocations in GaAs grown on Si substrates. However, for an initially high density of dislocations, the strained layer superlattice is not an effective filtering system. Consequently, the emergence of dislocations from the SLS propagate upwards into the GaAs epilayer. However, by employing thermal annealing or rapid thermal annealing, the number of dislocation impinging on the SLS can be significantly reduced. Indeed, this treatment greatly enhances the efficiency and usefulness of the SLS in reducing the number of threading dislocations.

Defect Reduction in Cd1-xZnxTe Epilayers on GaAs Substrates

1994 ◽  
Vol 299 ◽  
Author(s):  
Saket Chadda ◽  
Kevin Malloy ◽  
John Reno
Keyword(s):  
Threading Dislocation ◽  
Full Width ◽  
X Ray Diffraction ◽  
Defect Reduction ◽  
X Ray ◽  
Gaas Substrates ◽  
Transmission Electron ◽  
Threading Dislocation Density ◽  
Optimum Period ◽  
Bulk Alloys

AbstractCd0.91Zn0.09Te/CdTe multilayers of various period thicknesses were inserted into Cd0.955Zn0.045Te bulk alloys grown on (001) GaAs. The net strain of the multilayer on the underlying Cd0.955Zn0.045Te was designed to be zero. X-ray diffraction full width at half maximum (FWHM) was used as a means to optimize the period thickness of the multilayer. Transmission electron microscopy of the optimum period thickness samples demonstrated four orders of magnitude decrease in the threading dislocation density. Mechanism of bending by equi-strained multilayers is discussed.

Epitaxial GaN Layer Growth Using Nitrogen Enriched TiN Buffer Layers

2006 ◽  
Vol 916 ◽  
Author(s):  
Kazuhiro Ito ◽  
Yu Uchida ◽  
Sang-jin Lee ◽  
Susumu Tsukimoto ◽  
Yuhei Ikemoto ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Light Emission ◽  
Chemical Vapor ◽  
Nucleation Site ◽  
Layer Growth ◽  
Buffer Layers ◽  
Organic Chemical ◽  
Nitrogen Enrichment ◽  
Threading Dislocation ◽  
Sapphire Substrates

AbstractAbout 20 years ago, the discovery of an AlN buffer layer lead to the breakthrough in epitaxial growth of GaN layers with mirror-like surface, using a metal organic chemical vapor deposition (MOCVD) technique on sapphire substrates. Since then, extensive efforts have been continued to develop a conductive buffer layer/substrate for MOCVD-grown GaN layers to improve light emission of GaN light-emitting diodes. In the present study, we produced MOCVD-grown, continuous, flat epitaxial GaN layers on nitrogen enriched TiN buffer layers with the upper limit of the nitrogen content of TiN deposited at room temperature (RT) on sapphire substrates. It was concluded that the nitrogen enrichment would reduce significantly the TiN/GaN interfacial energy. The RT deposition of the TiN buffer layers suppresses their grain growth during the nitrogen enrichment and the grain size refining must increase nucleation site of GaN. In addition, threading dislocation density in the GaN layers grown on TiN was much lower than that in the GaN layers grown on AlN.

InAs Quantum Dots Grown on an AlGaAsSb Strain-Relief Buffer

2000 ◽  
Vol 642 ◽  
Author(s):  
A.L. Gray ◽  
L. R. Dawson ◽  
Y. Lin ◽  
A. Stintz ◽  
Y.-C. Xin ◽  
...  
Keyword(s):  
Quantum Dots ◽  
Cross Section ◽  
Gaas Substrate ◽  
Buffer Layers ◽  
Threading Dislocations ◽  
X Ray Diffraction ◽  
Strain Relief ◽  
Inas Quantum Dots ◽  
X Ray ◽  
Transmission Electron

ABSTRACTAn In(Ga)As-based self-assembled quantum dot laser test structure grown on strain-relief Al0.5Ga0.5As1-ySby strain-relief buffer layers (0≤y ≤ 0.24) on a GaAs substrate is investigated in an effort to increase dot size and therefore extend the emission wavelength over conventional InAs quantum dots on GaAs platforms. Cross-section transmission electron microscopy, and high-resolution x-ray diffraction are used to monitor the dislocation filtering process and morphology in the buffer layers. Results show that the buffer layers act as an efficient dislocation filter by drastically reducing threading dislocations, thus providing a relaxed, low dislocation, compositionally modulated Al0.5Ga0.5Sb0.24As0.76 substrate for large (500Å height x 300Å width) defect -free InAs quantum dots. Photoluminescence shows a ground-state emission of the InAs quantum dots at 1.45 μm.

Equilibrium Lattice Relaxation and Misfit Dislocations in Continuously- and Step-Graded InxGa1-xAs/GaAs (001) and GaAs1-yPy/GaAs (001) Metamorphic Buffer Layers

2015 ◽  
Vol 24 (03n04) ◽  
pp. 1520009 ◽  
Author(s):  
Tedi Kujofsa ◽  
John E. Ayers
Keyword(s):  
Dislocation Density ◽  
Buffer Layer ◽  
Minimum Energy ◽  
Lattice Relaxation ◽  
Structure Type ◽  
Elastic Stiffness ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Misfit Dislocations ◽  
Metamorphic Buffer

The inclusion of metamorphic buffer layers (MBL) in the design of lattice-mismatched semiconductor heterostructures is important in enhancing reliability and performance of optical and electronic devices. These metamorphic buffer layers usually employ linear grading of composition, and materials including InxGa1-xAs and GaAs1-yPy have been used. Non-uniform and continuously graded profiles are beneficial for the design of partially-relaxed buffer layers because they reduce the threading dislocation density by allowing the distribution of the misfit dislocations throughout the metamorphic buffer layer, rather than concentrating them at the interface where substrate defects and tangling can pin dislocations or otherwise reduce their mobility as in the case of uniform compositional growth. In this work we considered heterostructures involving a linearly-graded (type A) or step-graded (type B) buffer layer grown on a GaAs (001) substrate. For each structure type we present minimum energy calculations and compare the cases of cation (Group III) and anion (Group V) grading. In addition, we studied the (i) average and surface in-plane strain and (ii) average misfit dislocation density for heterostructures with various thickness and compositional profile. Moreover, we show that differences in the elastic stiffness constants give rise to significantly different behavior in these two commonly-used buffer layer systems.

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