Evidence of the De-multiplication Interactions Between Threading Dislocations in GaN Films Grown on (0001) Sapphire Substrates

2007 ◽  
Vol 994 ◽  
Author(s):  
Cheng-Liang Wang ◽  
Jyh-Rong Gong
Keyword(s):  
Type A ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Organometallic Vapor Phase Epitaxy ◽  
Reduced Pressure ◽  
Sapphire Substrates ◽  
Multiplication Process ◽  
Transmission Electron ◽  
Type C

AbstractWe report the observation of threading dislocation de-multiplication process by transmission electron microscopy (TEM). The GaN films used in this study were grown on (0001) sapphire substrates with LT-GaN buffer layers by reduced pressure organometallic vapor phase epitaxy. By using g · Db = 0 invisibility criterion, it was found that some of TDs were de-multiplicated by interactions among themselves. In particular, type a+c TDs were found to nucleate through the interactions between type a and type c TDs in GaN near the GaN/sapphire interface so that the de-multiplication of TDs in GaN films was achieved.

Effect of Si Doping on The Structure of Gan

1996 ◽  
Vol 423 ◽  
Author(s):  
Zuzanna Liliental-Weber ◽  
S. Ruvimov ◽  
T. Suski ◽  
J. W. Ager ◽  
W. Swider ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Dopant Concentration ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Silicon Doping ◽  
Defect Reduction ◽  
Si Doping ◽  
Transmission Electron ◽  
Metal Organic

AbstractThe influence of Si doping on the structure of GaN grown by metal-organic chemicalvapor deposition (MOCVD) has been studied using transmission electron microscopy (TEM), x-ray diffraction and Raman spectroscopy. Undoped and low Si doped samples were compared with samples of increased dopant concentration. In addition, defect reduction due to different buffer layers (AIN and GaN) is discussed. Silicon doping improves surface morphology and influences threading dislocation arrangement. High doping leads to a more random distribution of dislocations. Based on this study it appears (for the same dopant concentration) that an AIN buffer layer can significantly reduce the number of threading dislocations, leaving the samples more strained. However, no significant reduction of threading dislocations could be observed in the samples with GaN buffer layer. These samples are the least strained.

High Quality AlN Layer Grown on Patterned Sapphire Substrates by Hydride Vapor-Phase Epitaxy: A Route for Cost Efficient AlN Templates for Deep Ultraviolet Light Devices

2021 ◽  
Vol 21 (9) ◽  
pp. 4881-4885
Author(s):  
Seung-Jae Lee ◽  
Seong-Ran Jeon ◽  
Young Ho Song ◽  
Young-Jun Choi ◽  
Hae-Gon Oh ◽  
...  
Keyword(s):  
Vapor Phase ◽  
Vapor Phase Epitaxy ◽  
Hydride Vapor Phase Epitaxy ◽  
Threading Dislocation ◽  
Sapphire Substrates ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Order Of Magnitude ◽  
Cost Efficient ◽  
Patterned Sapphire Substrates

We report the characteristics of AlN epilayers grown directly on cylindrical-patterned sapphire substrates (CPSS) by hydride vapor-phase epitaxy (HVPE). To evaluate the effect of CPSS, we analyzed the threading dislocation densities (TDDs) of AlN films grown simultaneously on CPSS and flat sapphire substrate (FSS) by transmission electron microscopy (TEM). The corresponding TDD is measured to be 5.69 x 108 cm−2 for the AlN sample grown on the CPSS that is almost an order of magnitude lower than the value of 3.43 × 109 cm−2 on the FSS. The CPSS contributes to reduce the TDs originated from the AlN/sapphire interface via bending the TDs by lateral growth during the coalescence process. In addition, the reduction of direct interface area between AlN and sapphire by CPSS reduce the generation of TDs.

Epitaxial GaN Layer Growth Using Nitrogen Enriched TiN Buffer Layers

2006 ◽  
Vol 916 ◽  
Author(s):  
Kazuhiro Ito ◽  
Yu Uchida ◽  
Sang-jin Lee ◽  
Susumu Tsukimoto ◽  
Yuhei Ikemoto ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Light Emission ◽  
Chemical Vapor ◽  
Nucleation Site ◽  
Layer Growth ◽  
Buffer Layers ◽  
Organic Chemical ◽  
Nitrogen Enrichment ◽  
Threading Dislocation ◽  
Sapphire Substrates

AbstractAbout 20 years ago, the discovery of an AlN buffer layer lead to the breakthrough in epitaxial growth of GaN layers with mirror-like surface, using a metal organic chemical vapor deposition (MOCVD) technique on sapphire substrates. Since then, extensive efforts have been continued to develop a conductive buffer layer/substrate for MOCVD-grown GaN layers to improve light emission of GaN light-emitting diodes. In the present study, we produced MOCVD-grown, continuous, flat epitaxial GaN layers on nitrogen enriched TiN buffer layers with the upper limit of the nitrogen content of TiN deposited at room temperature (RT) on sapphire substrates. It was concluded that the nitrogen enrichment would reduce significantly the TiN/GaN interfacial energy. The RT deposition of the TiN buffer layers suppresses their grain growth during the nitrogen enrichment and the grain size refining must increase nucleation site of GaN. In addition, threading dislocation density in the GaN layers grown on TiN was much lower than that in the GaN layers grown on AlN.

Microstructral Investigations on GaN Films Grown by Laser Induced Molecular Beam Epitaxy

1999 ◽  
Vol 595 ◽  
Author(s):  
H. Zhou ◽  
F. Phillipp ◽  
M. Gross ◽  
H. Schröder
Keyword(s):  
Molecular Beam Epitaxy ◽  
Molecular Beam ◽  
Threading Dislocations ◽  
Planar Defects ◽  
Sapphire Substrates ◽  
Inversion Domain ◽  
Transmission Electron ◽  
Domain Boundaries ◽  
Line Defects ◽  
Inversion Domain Boundaries

AbstractMicrostructural investigations on GaN films grown on SiC and sapphire substrates by laser induced molecular beam epitaxy have been performed. Threading dislocations with Burgers vectors of 1/3<1120>, 1/3<1123> and [0001] are typical line defects, predominantly the first type of dislocations. Their densities are typically 1.5×1010 cm−2 and 4×109 cm−2 on SiC and sapphire, respectively. Additionally, planar defects characterized as inversion domain boundaries lying on {1100} planes have been observed in GaN/sapphire samples with an inversion domain density of 4×109 cm−2. The inversion domains are of Ga-polarity with respect to the N-polarity of the adjacent matrix. However, GaN layers grown on SiC show Ga-polarity. Possible reasons for the different morphologies and structures of the films grown on different substrates are discussed. Based on an analysis of displacement fringes of inversion domains, an atomic model of the IDB-II with Ga-N bonds across the boundary was deduced. High resolution transmission electron microscopy (HRTEM) observations and the corresponding simulations confirmed the IDB-II structure determined by the analysis of displacement fringes.

InAs Quantum Dots Grown on an AlGaAsSb Strain-Relief Buffer

2000 ◽  
Vol 642 ◽  
Author(s):  
A.L. Gray ◽  
L. R. Dawson ◽  
Y. Lin ◽  
A. Stintz ◽  
Y.-C. Xin ◽  
...  
Keyword(s):  
Quantum Dots ◽  
Cross Section ◽  
Gaas Substrate ◽  
Buffer Layers ◽  
Threading Dislocations ◽  
X Ray Diffraction ◽  
Strain Relief ◽  
Inas Quantum Dots ◽  
X Ray ◽  
Transmission Electron

ABSTRACTAn In(Ga)As-based self-assembled quantum dot laser test structure grown on strain-relief Al0.5Ga0.5As1-ySby strain-relief buffer layers (0≤y ≤ 0.24) on a GaAs substrate is investigated in an effort to increase dot size and therefore extend the emission wavelength over conventional InAs quantum dots on GaAs platforms. Cross-section transmission electron microscopy, and high-resolution x-ray diffraction are used to monitor the dislocation filtering process and morphology in the buffer layers. Results show that the buffer layers act as an efficient dislocation filter by drastically reducing threading dislocations, thus providing a relaxed, low dislocation, compositionally modulated Al0.5Ga0.5Sb0.24As0.76 substrate for large (500Å height x 300Å width) defect -free InAs quantum dots. Photoluminescence shows a ground-state emission of the InAs quantum dots at 1.45 μm.

A Novel Approach for The Production of Low Dislocation Relaxed Sige Material.

1993 ◽  
Vol 319 ◽  
Author(s):  
A.R. Powell ◽  
S.S. Iyer ◽  
F.K. Legoues
Keyword(s):  
Sige Layer ◽  
Silicon On Insulator ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Tem Analysis ◽  
Cross Sectional ◽  
Novel Approach ◽  
Transmission Electron ◽  
Silicon Thickness ◽  
Buffer Structure

AbstractIn this growth process a new strain relief mechanism operates, whereby the SiGe epitaxial layer relaxes without the generation of threading dislocations within the SiGe layer. This is achieved by depositing SiGe on an ultrathin Silicon On Insulator, SOl, substrate with a superficial silicon thickness less than the SiGe layer thickness. Initially, the thin Si layer is put under tension due to an equalization of the strain between the Si and SiGe layers. Thereafter, the strain created in the thin Si layer relaxes by plastic deformation. Since the dislocations are formed and glide in the thin Si layer, no threading dislocation is ever introduced into the upper SiGe material, which appeared dislocation free to the limit of the cross sectional Transmission Electron Microscopy (TEM) analysis. We thus have a method for producing very low dislocation, relaxed SiGe films with the additional benefit of an SO substrate. This buffer structure is significantly less than a micrometer in thickness and offers distinct advantages over the thick SiGe buffer layers presently in use.

The Effect of Ag-Addition on Precipitation Sequence in Al-1.0mass%Mg2Si-Excess 0.4mass%Si Alloy

2007 ◽  
Vol 561-565 ◽  
pp. 239-242 ◽  
Author(s):  
Kenji Niwa ◽  
Kenji Matsuda ◽  
Junya Nakamura ◽  
Tatsuo Sato ◽  
Susumu Ikeno
Keyword(s):  
Metastable Phase ◽  
Type A ◽  
Precipitation Sequence ◽  
Type B ◽  
X Ray ◽  
Β Phase ◽  
Transmission Electron ◽  
Alloy Type ◽  
Type C ◽  
Study Type

It is well known that Ag additional Al-1.0mass%Mg2Si-excess0.4mass%Si alloy (ex. Si-Ag alloy) has higher hardness and elongation than those of Al-1.0mass%Mg2Si-excess 0.4mass%Si alloy (ex. Si alloy). However, precipitation sequence of ex. Si-Ag alloy is not clear yet. In this work, precipitation sequence of ex. Si-Ag alloy has been investigated using high resolution transmission electron microscopy and X-ray energy dispersive spectroscopy. Precipitates were classified into several kinds by HRTEM images and SAED patterns, and relative frequencies of precipitates were also investigated. Its precipitation sequence was compared with that of ex. Si alloy. Type-A, Type-B and Type-C precipitates as special metastable phase in excess Si type Al-Mg-Si alloy, has been observed in ex. Si-Ag alloy, but β’ phase increased and Type-A and Type-B precipitate decreased in this study. Type-A precipitate was found at only grain boundary.

scholarly journals The heterogeneous nucleation of threading dislocations on partial dislocations in III-nitride epilayers

2020 ◽  
Vol 10 (1) ◽  
Author(s):  
J. Smalc-Koziorοwska ◽  
J. Moneta ◽  
P. Chatzopoulou ◽  
I. G. Vasileiadis ◽  
C. Bazioti ◽  
...  
Keyword(s):  
Heterogeneous Nucleation ◽  
Physical Mechanism ◽  
Dislocation Nucleation ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Physical Mechanisms ◽  
Partial Dislocations ◽  
Transmission Electron ◽  
Device Applications ◽  
Very High

Abstract III-nitride compound semiconductors are breakthrough materials regarding device applications. However, their heterostructures suffer from very high threading dislocation (TD) densities that impair several aspects of their performance. The physical mechanisms leading to TD nucleation in these materials are still not fully elucidated. An overlooked but apparently important mechanism is their heterogeneous nucleation on domains of basal stacking faults (BSFs). Based on experimental observations by transmission electron microscopy, we present a concise model of this phenomenon occurring in III-nitride alloy heterostructures. Such domains comprise overlapping intrinsic I1 BSFs with parallel translation vectors. Overlapping of two BSFs annihilates most of the local elastic strain of their delimiting partial dislocations. What remains combines to yield partial dislocations that are always of screw character. As a result, TD nucleation becomes geometrically necessary, as well as energetically favorable, due to the coexistence of crystallographically equivalent prismatic facets surrounding the BSF domain. The presented model explains all observed BSF domain morphologies, and constitutes a physical mechanism that provides insight regarding dislocation nucleation in wurtzite-structured alloy epilayers.

Annihilation of Threading Dislocations in Regrown GaN on Electrochemically Etched Nanoporous GaN Template with Optimization of Buffer Layer Growth

2007 ◽  
Vol 31 ◽  
pp. 227-229
Author(s):  
C.B. Soh ◽  
H. Hartono ◽  
S.Y. Chow ◽  
Soo Jin Chua
Keyword(s):  
Electron Microscopy ◽  
Buffer Layer ◽  
Electrochemical Etching ◽  
Layer Growth ◽  
Device Fabrication ◽  
Buffer Layers ◽  
Threading Dislocations ◽  
High Quality ◽  
Transmission Electron ◽  
Gan Buffer Layer

Nanoporous GaN template has been fabricated by electrochemical etching to give hexagonal pits with nano-scale pores of size 20-50 nm in the underlying grains. Electrochemical etching at The effect of GaN buffer layer grown at various temperatures from 650°C to 1015°C on these as-fabricated nano-pores templates are investigated by transmission electron microscopy. The buffer layer grown at the optimized temperature of 850°C partially fill up the pores and voids with annihilation of threading dislocations, serving as an excellent template for high-quality GaN growth. This phenomenon is, however not observed for the samples grown with other temperature buffer layers. The PL spectrum for the regrowth GaN on nanoporous GaN template also shows an enhancement of PL intensity for GaN peak compared to as-grown GaN template, which is indicative of its higher crystal quality. This makes it as a suitable template for subsequent device fabrication.

High Power 330 nm AlInGaN UV LEDs in the High Injection Regime

2003 ◽  
Vol 798 ◽  
Author(s):  
M. Gherasimova ◽  
J. Su ◽  
G. Cui ◽  
J. Han ◽  
H. Peng ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
Threading Dislocation ◽  
Light Emitting ◽  
Force Microscopy ◽  
Sapphire Substrates ◽  
Atomic Force ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Dimensional Growth ◽  
Uv Leds

ABSTRACTWe report on the growth and testing of the light emitting diode structures incorporating quaternary AlInGaN active region with an emission wavelength of 330 nm. Small area circular devices were fabricated, yielding the output power of 110 μW measured with a bare-chip configuration in a high current injection regime (8 kA/cm2 for a 20 μm diameter device). Structural properties of the constituent epitaxial layers were evaluated by atomic force microscopy and transmission electron microscopy, resulting in the observation of two-dimensional growth morphologies of AlN and AlGaN, and the estimate of threading dislocation densities in the low 109 cm-2 range in the structures grown on sapphire substrates.

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