Electrical Characterization of Slurry Particles and their Interactions with Wafer Surfaces

The purpose of this study was to explore the interaction between slurry particles and wafer surfaces by the measurements of their zeta potentials. The zeta potentials of slurry particles such as fumed and colloidal silica, alumina, ceria and MnO2 and substrates such as silicon, TEOS, W, and Al have been measured by electrophoretic and electroosmosis method to evaluate the electrical properties of surfaces, respectively. The zeta potential of oxide and metal surfaces showed similar values to those of particles as a function of pH. The interaction energy between alumina and silica particles and TEOS, W and Al substrate were calculated based on DLVO theory. No deposition of silica particles on TEOS and the heavy deposition of alumina particles on metal substrates were observed in the particle deposition test. Experimental results were well agreed with the theoretical calculation.

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Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.103-104.275 ◽

2005 ◽

Vol 103-104 ◽

pp. 275-278

Author(s):

Yi Koan Hong ◽

Ja Hyung Han ◽

Jin Hyung Lee ◽

Jin Goo Park ◽

Ahmed A. Busnaina

Keyword(s):

Alumina Particle ◽

Adhesion Force ◽

Interaction Force ◽

Zeta Potentials ◽

Alumina Particles ◽

Particle Contamination ◽

Cu Cmp ◽

Wafer Surfaces

The adhesion force and removal of alumina particles on Cu, Ta, TEOS, SILKTM, Aurora and FSG wafer surfaces were experimentally and theoretically investigated in slurry solutions of different pHs. These wafer surfaces showed negative zeta potentials in the investigated pH ranges with exception of FSG and Ta. However, the zeta potentials of FSG surface drastically decreased with increasing pH. The lowest adhesion force and smallest number of alumina particles were measured between alumina particle and FSG surface in a slurry solution of pH 11. Alkaline slurry was much more desirable in controlling the level of particle contamination during Cu CMP. The pH of the slurry and zeta potentials of the surfaces played important roles in controlling the interaction force.

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Scanning Probe Characterization of Localized pH Changes on a Sapphire Surface in the Presence of an Applied Field

MRS Proceedings ◽

10.1557/proc-782-a3.1 ◽

2003 ◽

Vol 782 ◽

Author(s):

Joseph W. Bullard ◽

Ryan J. Kershner ◽

Michael J. Cima

Keyword(s):

Applied Field ◽

Silica Particles ◽

Scanning Probe ◽

Platinum Electrodes ◽

Sapphire Surface ◽

Force Microscopy ◽

Zeta Potentials ◽

Atomic Force ◽

Single Crystal Sapphire

ABSTRACTSingle crystal sapphire substrates were lithographically patterned with a system of parallel platinum electrodes, which were used to manipulate 1.58μm silica particles inplane, in the presence of an aqueous solution. Observation of the motion of these particles revealed the adhesion of some of them to the sapphire surface near the platinum working electrode, even in the range of pH where the zeta potentials of silica and sapphire are of the same sign. This phenomenon suggests the existence of localized differences in pH, attributable to the presence of potential determining ions produced in the faradaic processes occurring at the electrodes during the electrophoretic manipulation of silica particles. Atomic force microscopy (AFM) was used to corroborate this hypothesis, measuring the forces between a silica particle and a sapphire substrate in the presence of an applied field. The resultant force-distance curves demonstrate a change in the interaction forces between particle and substrate as a function of distance from the electrode. Variations in this interaction correspond to localized differences in the zeta potential of the substrate, which, in turn, are related to localized differences in pH. Quantification of these spatial variations in pH as a function of time yields further information about the diffusion of these faradaically produced potential determining ions across the substrate.

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Preparation and Characterization of CdS and ZnS Particles in Nanophase Reactors Provided by Binary Liquids Adsorbed at Colloidal Silica Particles

Langmuir ◽

10.1021/la951541i ◽

1996 ◽

Vol 12 (15) ◽

pp. 3709-3715 ◽

Cited By ~ 51

Author(s):

I. Dékány ◽

L. Nagy ◽

L. Túri ◽

Z. Király ◽

N. A. Kotov ◽

...

Keyword(s):

Colloidal Silica ◽

Silica Particles ◽

Binary Liquids

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Preparation and Characterization of Colloidal Silica Particles under Mild Conditions

Journal of Chemical Education ◽

10.1021/ed200684s ◽

2012 ◽

Vol 89 (7) ◽

pp. 940-942 ◽

Cited By ~ 14

Author(s):

Frances Neville ◽

Azrinawati Mohd. Zin ◽

Graeme J. Jameson ◽

Erica J. Wanless

Keyword(s):

Colloidal Silica ◽

Silica Particles ◽

Mild Conditions

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The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP

MRS Proceedings ◽

10.1557/proc-867-w1.9 ◽

2005 ◽

Vol 867 ◽

Cited By ~ 1

Author(s):

Jae-Hoon Song ◽

Ja-Hyung Han ◽

Yi-Koan Hong ◽

Young-Jae Kang ◽

Jin-Goo Park ◽

...

Keyword(s):

Isoelectric Point ◽

Adhesion Force ◽

Dielectric Materials ◽

Interaction Forces ◽

Zeta Potentials ◽

Alumina Particles ◽

Cu Cmp ◽

Wafer Surfaces

AbstractThe adhesion force of pad and alumina were experimentally and theoretically investigated in slurry solutions of different pHs. The isoelectric point (IEP) of pad particles was measured to be around pH 3. The wafer surfaces showed negative zeta potentials in the investigated pH ranges with exception of FSG and Ta. Cu and Ta showed higher interaction forces than dielectric materials. The lowest adhesion force was measured between pad particle and wafer surfaces in a slurry solution of pH 11. The magnitude of adhesion force of pad particles was lower than alumina particles.

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Characterization of Heterocoagulation by Direct Observation Technique

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.11-12.681 ◽

2006 ◽

Vol 11-12 ◽

pp. 681-684 ◽

Cited By ~ 2

Author(s):

C. Takai ◽

Masayoshi Fuji ◽

Minoru Takahashi

Keyword(s):

Direct Observation ◽

Large Scale ◽

Silica Particles ◽

Particle Dispersion ◽

Solid Loading ◽

Alumina Particles ◽

Two Component ◽

Acidic Region ◽

Basic Region

The control of particle dispersion is essential to the fabrication of highly designed ceramics. In this study, a direct observation technique was employed to characterize the heterocoagulation of particles in two-component slurry. TEM observation of solidified slurry composed of alumina and silica particles was attempted to evaluate heterocoagulation. At 10 mass% solid loading, the TEM showed the aggregation of silica with dispersed alumina particles at acidic region. A large scale of aggregation caused by attractive force among alumina and silica particles was observed on the TEM images at neutral region. At basic region, the aggregation of alumina with dispersed silica particles was observed. The measurements of zeta potential and viscosity were conducted to explain the results of the TEM observations.

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Characterization of Colloidal Silica Particles by Ultra-Small-Angle X-ray Scattering

Langmuir ◽

10.1021/la950777j ◽

1996 ◽

Vol 12 (10) ◽

pp. 2608-2610 ◽

Cited By ~ 7

Author(s):

Toshiki Konishi ◽

Eiji Yamahara ◽

Norio Ise

Keyword(s):

Small Angle ◽

Colloidal Silica ◽

Silica Particles ◽

X Ray ◽

X Ray Scattering ◽

Ray Scattering

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CHEMICAL AND ELECTRICAL CHARACTERIZATION OF POLYCRYSTALLINE SEMICONDUCTORS

Le Journal de Physique Colloques ◽

10.1051/jphyscol:1982124 ◽

1982 ◽

Vol 43 (C1) ◽

pp. C1-171-C1-185 ◽

Cited By ~ 5

Author(s):

L. L. Kazmerski ◽

P. E. Russell

Keyword(s):

Electrical Characterization ◽

Polycrystalline Semiconductors

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Structural and Electrical Characterization of Shaped Beam Laser Recrystallized Polysilicon on Amorphous Substrates

MRS Proceedings ◽

10.1557/proc-4-499 ◽

1981 ◽

Vol 4 ◽

Author(s):

T. J. Stultz ◽

J. F. Gibbons

Keyword(s):

Grain Size ◽

Electrical Characterization ◽

Grain Structure ◽

Electrical Characteristics ◽

Shaped Beam ◽

Beam Laser ◽

Cw Laser ◽

Amorphous Substrates ◽

Circular Beam

ABSTRACTStructural and electrical characterization of laser recrystallized LPCVD silicon films on amorphous substrates using a shaped cw laser beam have been performed. In comparing the results to data obtained using a circular beam, it was found that a significant increase in grain size can be achieved and that the surface morphology of the shaped beam recrystallized material was much smoother. It was also found that whereas circular beam recrystallized material has a random grain structure, shaped beam material is highly oriented with a <100> texture. Finally the electrical characteristics of the recrystallized film were very good when measured in directions parallel to the grain boundaries.

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