The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP

2005 ◽  
Vol 867 ◽  
Author(s):  
Jae-Hoon Song ◽  
Ja-Hyung Han ◽  
Yi-Koan Hong ◽  
Young-Jae Kang ◽  
Jin-Goo Park ◽  
...  
Keyword(s):  
Isoelectric Point ◽  
Adhesion Force ◽  
Dielectric Materials ◽  
Interaction Forces ◽  
Zeta Potentials ◽  
Alumina Particles ◽  
Cu Cmp ◽  
Wafer Surfaces

AbstractThe adhesion force of pad and alumina were experimentally and theoretically investigated in slurry solutions of different pHs. The isoelectric point (IEP) of pad particles was measured to be around pH 3. The wafer surfaces showed negative zeta potentials in the investigated pH ranges with exception of FSG and Ta. Cu and Ta showed higher interaction forces than dielectric materials. The lowest adhesion force was measured between pad particle and wafer surfaces in a slurry solution of pH 11. The magnitude of adhesion force of pad particles was lower than alumina particles.

Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP

2005 ◽  
Vol 103-104 ◽  
pp. 275-278
Author(s):  
Yi Koan Hong ◽  
Ja Hyung Han ◽  
Jin Hyung Lee ◽  
Jin Goo Park ◽  
Ahmed A. Busnaina
Keyword(s):  
Alumina Particle ◽  
Adhesion Force ◽  
Interaction Force ◽  
Zeta Potentials ◽  
Alumina Particles ◽  
Particle Contamination ◽  
Cu Cmp ◽  
Wafer Surfaces

The adhesion force and removal of alumina particles on Cu, Ta, TEOS, SILKTM, Aurora and FSG wafer surfaces were experimentally and theoretically investigated in slurry solutions of different pHs. These wafer surfaces showed negative zeta potentials in the investigated pH ranges with exception of FSG and Ta. However, the zeta potentials of FSG surface drastically decreased with increasing pH. The lowest adhesion force and smallest number of alumina particles were measured between alumina particle and FSG surface in a slurry solution of pH 11. Alkaline slurry was much more desirable in controlling the level of particle contamination during Cu CMP. The pH of the slurry and zeta potentials of the surfaces played important roles in controlling the interaction force.

Frictional behavior and particle adhesion of abrasive particles during Cu CMP

2005 ◽  
Vol 867 ◽  
Author(s):  
Yi-Koan Hong ◽  
Ja-Hyung Han ◽  
Jae-Hoon Song ◽  
Jin-Goo Park
Keyword(s):  
Citric Acid ◽  
Adhesion Force ◽  
Particle Adhesion ◽  
Friction Behavior ◽  
Abrasive Particles ◽  
Frictional Behavior ◽  
Cu Cmp ◽  
Particle Adhesion Force ◽  
Wafer Surfaces ◽  
Citrate Ions

AbstractThe friction behavior and adhesion of abrasive particles were experimentally investigated during Cu CMP process. The highest particle adhesion force was measured in alumina slurry without citric acid. However, the alumina slurry with addition of citric acid had the lowest particle adhesion due to the adsorption of citrate ions on the alumina surfaces. While citrate ions could be easily adsorbed on alumina particles, silica particle showed the least effect on adsorption in citric acid solutions. The magnitude of adsorptions of citrate ions on the particle surfaces had significant effect on frictional behavior as well as adhesion force. Higher particle adhesion force resulted in higher friction, particle contamination and scratches in CMP process. It indicates that the magnitudes of particle adhesions on wafer surfaces in slurries can be directly related to the frictional behavior during CMP process.

Electrical Characterization of Slurry Particles and their Interactions with Wafer Surfaces

1999 ◽  
Vol 566 ◽  
Author(s):  
Jin-Goo Park ◽  
Sang-Ho Lee ◽  
Hyoung-Gyun Kim
Keyword(s):  
Particle Deposition ◽  
Colloidal Silica ◽  
Electrical Characterization ◽  
Dlvo Theory ◽  
Silica Particles ◽  
Zeta Potentials ◽  
Alumina Particles ◽  
Silica Alumina ◽  
Wafer Surfaces

The purpose of this study was to explore the interaction between slurry particles and wafer surfaces by the measurements of their zeta potentials. The zeta potentials of slurry particles such as fumed and colloidal silica, alumina, ceria and MnO2 and substrates such as silicon, TEOS, W, and Al have been measured by electrophoretic and electroosmosis method to evaluate the electrical properties of surfaces, respectively. The zeta potential of oxide and metal surfaces showed similar values to those of particles as a function of pH. The interaction energy between alumina and silica particles and TEOS, W and Al substrate were calculated based on DLVO theory. No deposition of silica particles on TEOS and the heavy deposition of alumina particles on metal substrates were observed in the particle deposition test. Experimental results were well agreed with the theoretical calculation.

scholarly journals Mechanics for the Adhesion and Aggregation of Red Blood Cells on Chitosan

2018 ◽  
Vol 34 (5) ◽  
pp. 725-732 ◽  
Author(s):  
K. Y. Chen ◽  
T. H. Lin ◽  
C. Y. Yang ◽  
Y. W. Kuo ◽  
U. Lei
Keyword(s):  
Red Blood Cells ◽  
Blood Cells ◽  
Biomedical Applications ◽  
Adhesion Force ◽  
Layer Structure ◽  
Optical Tweezer ◽  
Wound Dressings ◽  
Zeta Potentials ◽  
Rbc Membrane ◽  
Layer Structures

AbstractHemostasis, a process which causes bleeding to stop, can be enhanced using chitosan; but the detailed mechanism is unclear. Red blood cells (RBCs) adhere to chitosan because of their opposite charges, but the adhesion force is small, 3.83 pN as measured here using an optical tweezer, such that the direct adhesion cannot be the sole cause for hemostasis. However, it was observed in this study that layer structures of aggregated RBCs were formed next to chitosan objects in both static and flowing environments, but not formed next to cotton and rayon yarns. The layer structure is the clue for the initiation of hemostatsis. Through the supporting measurements of zeta potentials of RBCs and pH's using blood-chitosan mixtures, it is proposed here that the formation of the RBC layer structure next to chitosan objects is due to the reduction of repulsive electric double layer force between RBCs, because of the association of H+ deprotonated from chitosan with COO− on RBC membrane, under the DLVO (Derjaguin-Landau-Verwey-Overbeek) theory. The results are beneficial for designing effective chitosan-based wound dressings, and also for general biomedical applications.

scholarly journals THE MODIFICATION OF ANTIBODIES BY FORMALDEHYDE

1933 ◽  
Vol 16 (6) ◽  
pp. 947-960 ◽  
Author(s):  
Stuart Mudd ◽  
Eleanore W. Joffe
Keyword(s):  
Physical Properties ◽  
Isoelectric Point ◽  
Specific Antibody ◽  
Marked Change ◽  
Zeta Potentials ◽  
Wide Range ◽  
Antigen Antibody

Certain strains of bacteria which have only minimal zeta potentials over a wide range of pH, and upon which surface deposits can be formed, afford a favorable means of studying certain chemical and physical properties of the surface deposits. Films of specific antibody-globulin upon these bacteria possess basic groups which can combine with formaldehyde. Combination of these groups with HCHO under the conditions of the present experiments shifts the isoelectric point of the sensitizing film toward the acid side by about 0.6 to 0.8 pH unit, and reduces the agglutinating tendency of the sensitizing film. Antibodies may be formalinized before combination with antigen without marked change in their specific combining affinities. The properties of the sensitizing films are similar whether formol treatment occurs before or after the antigen-antibody combination. The nature of the basic groups has been discussed.

Metrology Issues in Cu-Low-K Chemical Mechanical Planarization

2002 ◽  
Vol 750 ◽  
Author(s):  
Parshuram B. Zantye ◽  
Arun K. Sikder ◽  
Swetha Thagella ◽  
Nivedita Gulati ◽  
Ashok Kumar
Keyword(s):  
Tribological Properties ◽  
Surface Characterization ◽  
Chemical Mechanical Planarization ◽  
Dielectric Materials ◽  
Successful Implementation ◽  
Post Process ◽  
Damascene Process ◽  
Reduced Modulus ◽  
Materials Used ◽  
Cu Cmp

ABSTRACTUltra low-k materials used in Cu damascene process are inherently soft and weak in nature; hence the evaluation of tribological properties of these materials is an issue of paramount importance in the field of semiconductor fabrication. Chemical Mechanical Polishing (CMP) of these films is a major challenge due to their reduced modulus and cohesive strength. The objective of this research is to develop a strong understanding of the tribological properties of Cu ultra low-k dielectric materials for successful implementation in the semiconductor devices. The Cu ultra low-k systems are polished at different conditions of load and platen rotation and their polishing behavior is compared with the standard Cu-SiO2 system. The polishing behavior of Cu and the barrier Ta material is studied in order to effectively detect the end point of the Cu CMP process. Delamination studies, post process surface characterization using scanning electron microscopy and the reliability issues of these materials also come within the scope of this study.

The zeta potential of kaolin suspensions measured by electrophoresis and electroacoustics

2007 ◽  
Vol 61 (2) ◽  
Author(s):  
R. Greenwood ◽  
B. Lapčíková ◽  
M. Surýnek ◽  
K. Waters ◽  
L. Lapčík
Keyword(s):  
Zeta Potential ◽  
Isoelectric Point ◽  
Anionic Surfactant ◽  
Sodium Dodecyl ◽  
Isomorphic Substitution ◽  
Concentrated Suspensions ◽  
Concentrated Suspension ◽  
Zeta Potentials ◽  
Maximum Value ◽  
Triton X

AbstractThe zeta potentials of kaolin dilute and concentrated suspensions were monitored using the techniques of electrophoresis and electroacoustics, respectively. The effect of addition of salt (KCl), a polymer material (Triton X-100), and an anionic surfactant (sodium dodecyl sulphate, SDS) on the suspension properties was investigated by electrophoresis. Electroacoustics was employed for the measurement of zeta potentials for the highest possible kaolin content in suspension and the effect of dilution. The effect of aging of a freshly prepared sample and kaolin isoelectric point was also studied. Using both techniques it was noted that there was no isoelectric point, just a maximum value in the magnitude of the kaolin suspension zeta potential. These maxima were observed also in the presence of Triton X-100 and SDS. An increase of the concentration of KCl and SDS in suspension shifted the maxima towards more acidic values, while in the presence of Triton X-100 the position of the zeta potential maxima remained constant. Electroacoustic techniques revealed that a freshly prepared concentrated suspension requires about six hours to equilibrate to achieve a steady zeta potential. Diluting the concentrated suspensions led to decrease of the zeta potential as ions bound to the surface desorbed and screened the surface charge. The zeta potential maxima remained unchanged even after heating the powder in an oven at 200°C (to remove any organic material) thereby suggesting that the most likely explanation for the maxima is isomorphic substitution.

Sign in / Sign up

Export Citation Format

Share Document