Progress in Epitaxial Oxides on Semiconductors

2002 ◽  
Vol 747 ◽  
Author(s):  
Z. Yu ◽  
Y. Liang ◽  
H. Li ◽  
J. Curless ◽  
C. Overgaard ◽  
...  
Keyword(s):  
Gate Dielectrics ◽  
Surface Preparation ◽  
Future Generation ◽  
Silicon On Insulator ◽  
Buffer Layers ◽  
Oxide Semiconductor ◽  
Perovskite Oxide ◽  
High Quality ◽  
Mos Capacitors ◽  
High K

ABSTRACTIn this paper, we review the recent progress in the area of epitaxial oxides on semiconductors at Motorola Labs. Critical issues such as surface preparation, initial nucleation and growth behaviors of SrTiO3 (STO) thin film epitaxy on Si(001) are addressed. Using a systematic approach, high-quality epitaxial STO films are successfully grown on semiconductor substrates such as Si, silicon-on-insulator (SOI) and Ge. Amorphous interfacial layer between the epitaxial STO and the semiconductor can be eliminated or tailored by controlling oxide growth process and parameters. STO-based metal-oxide-semiconductor (MOS) capacitors and transistors are fabricated and tested, in order to explore the potential of STO as high-k gate dielectrics for future generation CMOS transistor technology. In addition, high-quality STO epitaxial films are utilized as thin buffer layers for fabricating integrated oxide heterostructures on semiconductors. Various perovskite oxide films such as SrZrO3, LaAlO3 and Pb(Zr,Ti)O3 are deposited epitaxially on STO-buffered Si(001) for potential high-k gate dielectrics and surface-acoustic-wave (SAW) device applications.

scholarly journals Leakage Current Conduction Mechanism of Au-Pt-Ti/ HfO2-Al2O3/n-InAlAs Metal-Oxide-Semiconductor Capacitor under Reverse-Biased Condition

Coatings ◽  
2019 ◽  
Vol 9 (11) ◽  
pp. 720
Author(s):  
He Guan ◽  
Shaoxi Wang
Keyword(s):  
Metal Oxide ◽  
Leakage Current ◽  
Photoelectron Spectroscopy ◽  
Metal Oxide Semiconductor ◽  
Schottky Emission ◽  
Oxide Semiconductor ◽  
Optimized Design ◽  
Mos Capacitors ◽  
Leakage Mechanism ◽  
High K

Au-Pt-Ti/high-k/n-InAlAs metal-oxide-semiconductor (MOS) capacitors with HfO2-Al2O3 laminated dielectric were fabricated. We found that a Schottky emission leakage mechanism dominates the low bias conditions and Fowler–Nordheim tunneling became the main leakage mechanism at high fields with reverse biased condition. The sample with HfO2 (4 m)/Al2O3 (8 nm) laminated dielectric shows a high barrier height ϕB of 1.66 eV at 30 °C which was extracted from the Schottky emission mechanism, and this can be explained by fewer In–O and As–O states on the interface, as detected by the X-ray photoelectron spectroscopy test. These effects result in HfO2 (4 m)/Al2O3 (8 nm)/n-InAlAs MOS-capacitors presenting a low leakage current density of below 1.8 × 10−7 A/cm2 from −3 to 0 V at 30 °C. It is demonstrated that the HfO2/Al2O3 laminated dielectric with a thicker Al2O3 film of 8 nm is an optimized design to be the high-k dielectric used in Au-Pt-Ti/HfO2-Al2O3/InAlAs MOS capacitor applications.

scholarly journals Functional Oxide as an Extreme High-k Dielectric towards 4H-SiC MOSFET Incorporation

2017 ◽  
Vol 897 ◽  
pp. 155-158 ◽  
Author(s):  
Stephen A.O. Russell ◽  
Michael R. Jennings ◽  
Tian Xiang Dai ◽  
Fan Li ◽  
Dean P. Hamilton ◽  
...  
Keyword(s):  
Thin Film ◽  
Perovskite Phase ◽  
Buffer Layers ◽  
Mos Capacitors ◽  
Lattice Match ◽  
Polarization Voltage ◽  
High K ◽  
Buffer Material ◽  
High K Dielectric ◽  
Accumulation Region

MOS Capacitors are demonstrated on 4H-SiC using an octahedral ABO3 ferroic thin-film as a dielectric prepared on several buffer layers. Five samples were prepared: ABO3 on SiC, ABO3 on SiC with a SiO2 buffer (10 nm and 40 nm) and ABO3 on SiC with an Al2O3 buffer (10nm and 40 nm). Depending on the buffer material the oxide forms in either the pyrochlore or perovskite phase. A better lattice match with the Al2O3 buffer yields a perovskite phase with internal switchable dipoles. Hysteresis polarization-voltage loops show an oxide capacitance of ~ 0.2 μF/cm2 in the accumulation region indicating a dielectric constant of ~120.

High-k Dielectrics and Dual Metal Gates: Integration Issues for New CMOS Materials

1999 ◽  
Vol 567 ◽  
Author(s):  
B. Claflin ◽  
K. Flock ◽  
G. Lucovsky
Keyword(s):  
Oxide Semiconductor ◽  
Metal Nitrides ◽  
Mos Capacitors ◽  
Gate Electrodes ◽  
Metal Gates ◽  
High K ◽  
Dielectric Interfaces ◽  
Work Functions ◽  
Dual Metal ◽  
Cv Measurements

ABSTRACTSeveral metal and conducting metal nitride candidates were investigated for alternative gate electrode applications in future complimentary metal-oxide-semiconductor (CMOS) devices. High frequency capacitance-voltage (CV) measurements were performed on n-MOS and p-MOS capacitors with Al, Ta, TaN, TIN, or W2N gates and ultra-thin SiO2/Si3N4 dielectric stacks. The work functions of Al and Ta were close to the conduction band of Si as expected while all the metal nitrides had work functions slightly above mid-gap. The thermal stability of the metal nitrides and the metal/dielectric interfaces was studied by Auger electron spectroscopy (AES) following rapid thermal annealing (RTA). Integration requirements for dual metal gate electrodes in future CMOS devices are discussed.

Interfacial and Electrical Properties of GaAs Metal-Oxide-Semiconductor Device with TiOxNy High-k Gate Dielectrics

2019 ◽  
Vol 35 (3) ◽  
pp. 325-332 ◽  
Author(s):  
T. Das ◽  
Chandreswar Mahata ◽  
G Sutradhar ◽  
P K Bose ◽  
C.K. Maiti
Keyword(s):  
Electrical Properties ◽  
Metal Oxide ◽  
Semiconductor Device ◽  
Gate Dielectrics ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
High K

Characterization of LaxHfyO Gate Dielectrics in 4H-SiC MOS Capacitor

2014 ◽  
Vol 778-780 ◽  
pp. 549-552 ◽  
Author(s):  
Jing Hua Xia ◽  
David M. Martin ◽  
Sethu Saveda Suvanam ◽  
Carl Mikael Zetterling ◽  
Mikael Östling
Keyword(s):  
Gate Dielectric ◽  
Gate Dielectrics ◽  
Atomic Layer ◽  
Deposition Process ◽  
Mos Capacitors ◽  
Mos Capacitor ◽  
Layer Deposition ◽  
High K ◽  
Film Characteristics

LaxHfyO nanolaminated thin film deposited using atomic layer deposition process has been studied as a high-K gate dielectric in 4H-SiC MOS capacitors. The electrical and nano-laminated film characteristics were studied with increasing post deposition annealing (PDA) in N2O ambient. The result shows that high quality LaxHfyO nano-laminated thin films with good interface and bulk qualities are fabricated using high PDA temperature.

High Quality Ultra-Thin Tunneling N2O Oxides Fabricated by Rtp

1993 ◽  
Vol 303 ◽  
Author(s):  
G. W. Yoon ◽  
A. B. Joshi ◽  
J. Kim ◽  
D. L. Kwong
Keyword(s):  
Thermal Processing ◽  
Dielectric Breakdown ◽  
Gate Dielectrics ◽  
Rapid Thermal Processing ◽  
Time Dependent ◽  
High Quality ◽  
Mos Capacitors ◽  
Time Dependent Dielectric Breakdown ◽  
Stress Induced Leakage Current ◽  
As Stress

ABSTRACTIn this paper, a detailed reliability investigation is presented for ultra-thin tunneling (∼50 Å) oxides grown in N2O ambient using rapid thermal processing (RTP). These N2Oss-oxides are compared with oxides of identical thickness grown in O2 ambient by RTP. The reliability investigations include time-dependent dielectric breakdown as well as stress-induced leakage current in MOS capacitors with these gate dielectrics. Results show that ultra-thin N2O-oxides show much improved reliability as compared to oxide grown in O2 ambient.

Methods to Improve Properties of Gate Dielectrics in Metal-Oxide-Semiconductor

2012 ◽  
Vol 463-464 ◽  
pp. 1341-1345 ◽  
Author(s):  
Chong Liu ◽  
Xiao Li Fan
Keyword(s):  
Gate Dielectric ◽  
Gate Dielectrics ◽  
Dielectric Materials ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Physical Limitation ◽  
Low Leakage ◽  
Mos Devices ◽  
Low Leakage Current ◽  
High K

This essay aims to introduce development of gate dielectrics. In present-day society, Si-based MOS has met its physical limitation. Scientists are trying to find a better material to reduce the thickness and dimension of MOS devices. While substrate materials are required to have a higher mobility, gate dielectrics are expected to have high k, low Dit and low leakage current. I conclude dielectrics in both Si-based and Ge-based MOS devices and several measures to improve the properties of these gate dielectric materials. I also introduce studies on process in our group and some achievements we have got. Significantly, this essay points out the special interest in rare-earth oxides functioning as gate dielectrics in recent years and summarizes the advantages and problems should be resolved in future.

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