Room Temperature Growth of Silicon Dioxide Using a Low Energy Ion Beam

1986 ◽  
Vol 75 ◽  
Author(s):  
S. S. Todorov ◽  
E. R. Fossum
Keyword(s):  
Silicon Dioxide ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Film Growth ◽  
Ion Beam ◽  
Silicon Surfaces ◽  
Ion Energy ◽  
Thermally Driven ◽  
Thin Oxide Films ◽  
Substrate Temperatures

AbstractUltra-thin films of silicon dioxide are formed on silicon surfaces at room temperature by direct bombardment with an oxygen-containing ion beam at energies of 150 eV or less. The process of film growth is studied.through ellipsometric measurements of their properties as a function of ion energy and dose, oxygen partial pressure and substrate temperature. Typical oxide thicknesses of the order of 50 Å are obtained by three minute or longer exposures to beams of current density 135 μA/cm2. Ion-beam grown oxides are compared to conventional thin oxide films grown at elevated temperatures and show the same stoichiometry. The growth rate decreases rapidly after a continuous oxide film has been formed. Performing the ion bombardment at elevated substrate temperatures leads to only small enhancement of the oxide growth indicating non-thermally driven reaction kinetics.

1X Thin Films Prepared By Mass Separated Ion Beam Deposition

1994 ◽  
Vol 354 ◽  
Author(s):  
H. C. Hofsäss ◽  
C. Ronntng ◽  
U. Griesmeier ◽  
M. Gross
Keyword(s):  
Thermal Activation ◽  
Room Temperature ◽  
Ion Beam ◽  
Ir Absorption ◽  
Ion Energy ◽  
Ion Beam Deposition ◽  
Ion Energies ◽  
Substrate Temperatures ◽  
Absorption Measurements ◽  
Beam Deposition

AbstractWe have studied the growth and the properties of CN films prepared by deposition of mass separated 12C+ and 14N+ ions. The film thickness and density were determined as a function of ion energy between 20 eV and 500 eV and for substrate temperatures of 20 °C and 350 °C. Sputtering effects limit the maximum N concentration to about 30 - 40 at.% even for ion energies as low as 20 eV. IR absorption measurements indicate predominantly C-N and C=N bonding and an amorphous or strongly disordered CN-network. For room temperature deposited CN films with N concentrations up to 25 at.% I-V curves of metal-CN-metal devices show Frenkel-Poole behavior due to field-enhanced thermal activation of localized electrons. Films deposited at 350 °C have N concentrations below 15 at.% and graphitic properties like low resistivity and a density close to graphite.

EFFECT OF ION-ENERGY ON THE PROPERTIES OF AMORPHOUS GaN FILMS PRODUCED BY ION-ASSISTED DEPOSITION

2001 ◽  
Vol 15 (28n29) ◽  
pp. 1355-1360 ◽  
Author(s):  
UDAY LANKE ◽  
ANNETTE KOO ◽  
SIMON GRANVILLE ◽  
JOE TRODAHL ◽  
ANDREAS MARKWITZ ◽  
...  
Keyword(s):  
Room Temperature ◽  
Single Phase ◽  
Thermal Evaporation ◽  
Ion Beam ◽  
Atomic Ratio ◽  
Nuclear Reaction Analysis ◽  
Ion Energy ◽  
X Ray ◽  
Nitrogen Ions ◽  
Nitrogen Ion

Amorphous GaN films were deposited on various substrates viz. Si (100), quartz, glass, Al, stainless steel and glassy carbon by thermal evaporation of gallium in the presence of energetic nitrogen ions from a Kaufman source. The films were deposited at room temperature and 5 × 10-4 mbar nitrogen partial pressure. The effect of a low energy nitrogen ion beam during the synthesis of films was investigated for energies 40 eV and 90 eV. The N:Ga atomic ratio, bonding state, microstructure, surface morphology, and electrical properties of the deposited a-GaN films were studied by different characterisation techniques. The films are found to be X-ray amorphous in nature, which is confirmed by Raman spectroscopy. Rutherford Backscattering Spectroscopy (RBS) and Nuclear Reaction Analysis (NRA) indicate the N:Ga atomic ratio in the films. The 400-750 eV energy range is thought to be optimal for the production of single-phase amorphous GaN . The effect of ion-energy on optical, Raman, and electrical conductivity measurements of the films is also presented.

Defects and AlSb Precipitate Nucleation in Laser Irradiated Aluminum

1981 ◽  
Vol 4 ◽  
Author(s):  
P. S. Peercy ◽  
D. M. Follstaedt ◽  
S. T. Picraux ◽  
W. R. Wampler
Keyword(s):  
Room Temperature ◽  
Laser Energy ◽  
Ion Beam ◽  
Threshold Energy ◽  
Single Pulse ◽  
Temperature Profiles ◽  
Beam Analysis ◽  
Slip Deformation ◽  
Precipitate Nucleation ◽  
Substrate Temperatures

ABSTRACTLattice defects and precipitates induced in unimplanted and Sb-implanted <110> single crystal Al by single pulse irradiation with a Q-switched ruby laser were studied using ion beam analysis and electron microscopy. The absorbed laser energy during irradiation is directly measured in these studies to allow precise numerical modeling of the melt times and temperature profiles. For unimplanted Al, slip deformation gives rise to increased channeled yields throughout the analyzed depth and occurs for energies well below the melt threshold energy of 3.5 J/cm2. Slip deformation is also observed for irradiation energies above the melt threshold energy, and melting is accompanied by a discontinuous increase in the minimum channeling yield, X min- Implanted Sb (to ∼2 at.% peak concentrations) is found to impede epitaxial regrowth and result in polycrystalline Al formation for laser energies such that the melt front is believed not to penetrate through the Sb-containing region. For deeper melt depths, a metastable alloy is formed with up to 35% of the Sb located in substitutional sites. AlSb precipitate formation in the melt was not observed for room temperature irradiations; however, randomly oriented AlSb precipitates are observed for irradiation at substrate temperatures of 100 and 200 °C These measurements yield an estimated time for nucleation of AlSb precipitates in molten Al of 5 nsec < tnuc < 25 nsec.

Epitaxy of Germanium on SI(001) Grating Templates

1993 ◽  
Vol 317 ◽  
Author(s):  
C.C. Umbach ◽  
J.M. Blakely
Keyword(s):  
Room Temperature ◽  
Elevated Temperatures ◽  
Scanning Tunneling ◽  
Growth Morphology ◽  
Tunneling Microscopy ◽  
Step Flow ◽  
Growth Modes ◽  
Step Density ◽  
Temperature Scanning ◽  
Substrate Temperatures

ABSTRACTEpitaxial Ge films (< 3 ML) have been grown at elevated temperatures on Si (001) grating substrates (repeat spacing of 2.0 μm) and imaged using room temperature scanning tunneling Microscopy (STM). The Ge films exhibit the 2×n reconstruction associated with missing dimer rows. The value of n and the growth morphology are influenced by the deposition rate and by annealing. At substrate temperatures of 600° C and deposition rates >0.5 ML/Min., islands elongated along the the dimer row direction nucleate at steps and on terraces. With sufficient annealing at 800° C, the islands coarsen and are eventually eliminated. The roughness of the A-type step becomes greater than that of the B-type step, which is the reverse of the situation with pure Si (001). The separation between missing dimer rows and hence the value of n are increased by annealing. Differences in substrate terrace widths due to the periodically varying step density of thegratings affect the growth Modes: two-dimensional islands occur near the extrema of the gratings whereas step flow occurs when steps are separated by ∼150 Å or less.

The Structure of Si and Ge Deposited by Ion Beam Sputtering

1985 ◽  
Vol 47 ◽  
Author(s):  
H. Windischmann ◽  
J. M. Cavese ◽  
R. W. Collins ◽  
R. D. Harris ◽  
J. Gonzalez-Hernandez
Keyword(s):  
Crystallization Temperature ◽  
Film Growth ◽  
Ion Beam ◽  
Operating Pressure ◽  
Ion Beam Sputtering ◽  
X Ray Diffraction ◽  
Oxygen Contamination ◽  
Beam Sputtering ◽  
Silicon And Germanium ◽  
Substrate Temperatures

ABSTRACTThe crystallinity for silicon and germanium films deposited by ion beam sputtering (IBS) as a function of substrate temperatures was determined using Raman spectroscopy, spectroscopic ellipsometry, electrical conductivity and x-ray diffraction measurements. The results show that IBS silicon crystallizes between 300–350°C while germanium crystallizes between 20–200°C. Reasonably good agreement is obtained among the four distinctively different characterization techniques in identifying the onset of crystallinity. A direct relationship is observed between the substrate temperature required for crystallization and the log of the operating pressure for various deposition techniques. Energetic particle stimulation during film growth appears to reduce the crystallization temperature at a given operating pressure. Raman data show that the crystallization temperature depends on the deposition rate. A graded structure is observed in films deposited above 300°C, probably due to oxygen contamination.

Room-temperature preparation of biaxially textured indium tin oxide thin films with ion-beam-assisted deposition

2003 ◽  
Vol 18 (2) ◽  
pp. 442-447 ◽  
Author(s):  
Karola Thiele ◽  
Sibylle Sievers ◽  
Christian Jooss ◽  
Jörg Hoffmann ◽  
Herbert C. Freyhardt
Keyword(s):  
Thin Films ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Room Temperature ◽  
Film Growth ◽  
Texture Evolution ◽  
Ion Beam ◽  
High Temperature Superconductors ◽  
Buffer Layers ◽  
Ito Thin Films

Biaxially aligned indium tin oxide (ITO) thin films were prepared by an ion-beamassisted deposition (IBAD) process at room temperature. Films with a transmittance at 550 nm of 90% and an electrical resistivity of 1.1 × 10−3 Ωcm for 300 and 250 nm thickness were obtained. Investigations of the texture evolution during IBAD film growth were carried out and compared to the well-established texture development in yttria-stabilized zirconia. An in-plane texture of 12.6° full width at half-maximum (FWHM) for a 1-μm-thick IBAD-ITO film was achieved. The quality of these films as electrically conductive buffer layers for YBa2Cu3O7-δ (YBCO) high-temperature superconductors was demonstrated by the subsequent deposition of high-currentcarrying YBCO films by thermal co-evaporation using a 3–5-nm-thick Y2O3 interlayer.A Jc of 0.76 MA/cm2 (77K, 0 T) was obtained for a 1 × 1 cm sample with ITO of 20° FWHM.

Heteroepitaxy of Ge on Vicinal Si(100)

1990 ◽  
Vol 198 ◽  
Author(s):  
Mohan Krishnamurthy ◽  
Jeff S. Drucker ◽  
J.A. Venables
Keyword(s):  
Intermediate Layer ◽  
Room Temperature ◽  
Secondary Electron ◽  
Elevated Temperatures ◽  
Film Growth ◽  
Growth Parameters ◽  
Ex Situ ◽  
Nucleation Density ◽  
Size Distributions ◽  
Surface Steps

ABSTRACTThe initial stages of germanium heteroepitaxy on vicinal Si(100) have been studied using in-situ deposition in a UHV STEM. Germanium was deposited using molecular beam techniques onto substrates misoriented 1° and 5* toward <110> held at room temperature, 375°C and 525°C. Film thicknesses were in the range 4-6 ML, just greater than the stable intermediate layer of 3-4ML (1ML = 0.14nm). The Ge clusters were observed using biassed secondary electron (b-SE) imaging with nanometer resolution. Comparisons were made between deposition at the elevated temperatures, and room temperature deposition followed by anneals at the same temperatures.Annealing the low temperature deposits produces coarsening of the islands which is similar on the 1° and 5° samples. Island size distributions and other film growth parameters obtained from the 375°C and 525°C anneals indicate that the coarsening is different at these temperatures and is possibly affected by instabilities in the intermediate layer. Results of the high temperature depositions indicate that neither surface steps nor the edges of islands act as perfect sinks, and that diffusion distances are of the order of several microns. The nucleation density and size distributions are markedly different for deposition at 375°C and 525°C possibly due to competitive capture at strong sinks.In a parallel set of experiments in a standard UHV chamber, macroscopic wafer samples were analyzed with RHEED, Auger and secondary electron spectroscopy. These correlate well with the intermediate layer thicknesses previously reported in the literature, and the large contrast observed in the b-SE images. Ex situ TEM studies of samples grown in this chamber show islands with various contrast features including those of coherent strain.

Ion Beam Processing of GaAs at Elevated Temperatures

1988 ◽  
Vol 144 ◽  
Author(s):  
J. S. Williams ◽  
R. G. Elliman ◽  
S. T. Johnson ◽  
D. K. Sengupta ◽  
J. M. Zemanski
Keyword(s):  
Elevated Temperature ◽  
Low Temperature ◽  
Substrate Temperature ◽  
Elevated Temperatures ◽  
Ion Beam ◽  
Defect Production ◽  
Ion Energy ◽  
Residual Damage ◽  
Low Temperature Crystallization ◽  
Temperature Crystallization

ABSTRACTElevated temperature ion bombardment of GaAs has been examined to investigate the nature of residual damage and the interplay between bombardment-induced defect production and dynamic annealing. The nature of disorder is found to depend strongly on ion energy, species, dose, dose rate and substrate temperature. A temperature regime is identified in which dynamic annealing leads both to the efficient formation of band gap traps for carrier removal and to the low temperature crystallization of pre-existing amorphous layers.

The Importance of Self-Sputtering by Low Energy Ions in Partially Ionized Beam Deposition

1989 ◽  
Vol 157 ◽  
Author(s):  
P. Bai ◽  
CH. SteinbrÜChel ◽  
T.-M. Lu
Keyword(s):  
Film Growth ◽  
Ion Beam ◽  
Threshold Energy ◽  
The Self ◽  
Ion Energy ◽  
Sputtering Yield ◽  
Partially Ionized ◽  
Low Energy Ions ◽  
Deposition Techniques ◽  
Beam Deposition

ABSTRACTIn ion-assisted deposition techniques such as partially ionized beam deposition, ions derived from the depositing material itself concurrently bombard the surface during thin film growth. The ion percentage in the deposition beam ranges from less than 0.1% to 100% (Ion Beam Deposition) with the ion energy varying between a few eV and several keV. When the sputtering yield of the self-sputtering is greater than one, there is a critical ion percentage, for a given ion energy, above which no net deposition can be obtained. The self-sputtering yield is shown to have a square root dependence on the ion energy above the threshold energy by fitting the experimental data obtained from the literature. The critical ion percentage for Al, Cu, Au, Ag, and C is then calculated and plotted as a function of the ion energy so that deposition and no-deposition regions are illustrated in terms of the ion energy and ion percentage.

Room Temperature Nitridation and Oxidation of Si, Ge and Mbegrown Sige Using Low Energy Ion Beams (0.1-1 Kev).

1991 ◽  
Vol 223 ◽  
Author(s):  
O. Vancauwenberghe ◽  
O. C. Hellman ◽  
N. Herbots ◽  
J. L. Olson ◽  
W. J. Tan ◽  
...  
Keyword(s):  
Room Temperature ◽  
Ion Beam ◽  
Film Properties ◽  
Dielectric Thin Films ◽  
Ion Energy ◽  
Insulating Films ◽  
Ion Energies ◽  
Energy Dependent

ABSTRACTDirect Ion Beam Nitridation (IBN) and Oxidation (IBO) of Si, Ge, and Si0.8Ge0.2 were investigated at room temperature as a function of ion energy. The ion energies were selected between 100 eV and 1 keV to establish the role of energy on phase formation and film properties. Si0.8Ge0.2 films were grown by MBE on Si (100) and transferred in UHV to the ion beam processing chamber. The modification of composition and chemical binding was measured as a function of ion beam exposure by in situ XPS analysis. The samples were nitridized or oxidized using until the N or O 1s signal reached saturation for ion doses between 5×1016 to 1×1017 ions/cm2. Combined characterization by XPS, SEM, ellipsometry and cross-section TEM showed that insulating films of stoichiometric SiO2 and Si-rich Si3N4 were formed during IBO and IBN of Si at all energies used. The formation of Ge dielectric thin films by IBO and IBN was found to be strongly energy dependent and insulating layers could be grown only at the lower energies (E ≤ 200 eV). In contrast to pure Ge, insulating SiGe-oxide and SiGe-nitride were successfully formed on Si0.8Ge0.20.2 at all energies studied.

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