Ferroelectric Thin Films in Micro-electromechanical Systems Applications

MRS Bulletin ◽  
1996 ◽  
Vol 21 (7) ◽  
pp. 59-65 ◽  
Author(s):  
D.L. Polla ◽  
L.F. Francis
Keyword(s):  
Thin Films ◽  
Integrated Circuit ◽  
Microelectromechanical Systems ◽  
Pressure Sensors ◽  
Ferroelectric Ceramic ◽  
Consumer Electronics ◽  
Ferroelectric Ceramics ◽  
Control Electronics ◽  
Commercial Applications ◽  
And Control

Ferroelectric ceramic thin films fit naturally into the burgeoning field of microelectromechanical systems (MEMS). Microelectromechanical systems combine traditional Si integrated-circuit (IC) electronics with micromechanical sensing and actuating components. The term MEMS has become synonymous with many types of microfabricated devices such as accelerometers, infrared detectors, flow meters, pumps, motors, and mechanical components. These devices have lateral dimensions in the range of 10 μm–10 mm. The ultimate goal of MEMS is a self-contained system of interrelated sensing and actuating devices together with signal processing and control electronics on a common substrate, most often Si. Since fabrication involves methods common to the IC industry, MEMS can be mass-produced. Commercial applications for MEMS already span biomedical (e.g., blood-pressure sensors), manufacturing (e.g., microflow controllers), information processing (e.g., displays), and automotive (e.g., accelerometers) industries. More applications are projected in consumer electronics, manufacturing control, communications, and aerospace. Materials for MEMS include traditional microelectronic materials (e.g., Si, SiO2, Si3N4, polyimide, Pt, Al) as well as nontraditional ones (e.g., ferroelectric ceramics, shapememory alloys, chemical-sensing materials). The superior piezoelectric and pyroelectric properties of ferroelectric ceramics make them ideal materials for microactuators and microsensors.

Chip Design for Coupled Nonlinear Structronic Thermo-Electro-Elastic/Control Systems

2012 ◽  
Author(s):  
H. S. Tzou ◽  
Huiyu Li ◽  
Hua Li
Keyword(s):  
Integrated Circuit ◽  
Large Scale ◽  
Elastic Beam ◽  
Chip Design ◽  
Distributed Sensors ◽  
Beam System ◽  
Control Electronics ◽  
Hostile Environments ◽  
And Control ◽  
Fully Coupled

The objective of this study is to demonstrate the feasibility that a fully-coupled nonlinear piezo(electric)-thermoelastic/control structronic systems can be represented by a single micro-electronic chip. This non-volatile chip is a poTable.lle miniature hardware that serves as a design standard for future calibration and diagnosis of the original “large-scale” structronic system and it can be used anywhere after any catastrophic disruption in extreme hostile environments. Distributed control of a nonlinear structronic beam system (i.e., an elastic beam laminated with distributed sensors/actuators and coupled with control electronics) subjected to mechanical and temperature excitations has been investigated recently. This study is to design an integrated electronic circuit chip encompassing the complete piezothermoelastic and control behavior of the nonlinear structronic beam system. The fully coupled nonlinear beam equations are first discretized into a number of “elements” and each element can be implemented by an active circuit block including operational amplifiers, resistors, capacitors, and other nonlinear multipliers. Signals from the integrated circuit chip of the coupled nonlinear piezothermoelastic beam system are favorably compared with analytical solutions.

scholarly journals Recent Progress of Miniature MEMS Pressure Sensors

Micromachines ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 56 ◽  
Author(s):  
Peishuai Song ◽  
Zhe Ma ◽  
Jing Ma ◽  
Liangliang Yang ◽  
Jiangtao Wei ◽  
...  
Keyword(s):  
Blood Pressure ◽  
Microelectromechanical Systems ◽  
Low Cost ◽  
Pressure Sensors ◽  
Consumer Electronics ◽  
Limited Region ◽  
Pressure Sensitive ◽  
Inner Diameter ◽  
Implantable Pressure Sensor ◽  
Mems Pressure Sensors

Miniature Microelectromechanical Systems (MEMS) pressure sensors possess various merits, such as low power consumption, being lightweight, having a small volume, accurate measurement in a space-limited region, low cost, little influence on the objects being detected. Accurate blood pressure has been frequently required for medical diagnosis. Miniature pressure sensors could directly measure the blood pressure and fluctuation in blood vessels with an inner diameter from 200 to 1000 μm. Glaucoma is a group of eye diseases usually resulting from abnormal intraocular pressure. The implantable pressure sensor for real-time inspection would keep the disease from worsening; meanwhile, these small devices could alleviate the discomfort of patients. In addition to medical applications, miniature pressure sensors have also been used in the aerospace, industrial, and consumer electronics fields. To clearly illustrate the “miniature size”, this paper focuses on miniature pressure sensors with an overall size of less than 2 mm × 2 mm or a pressure sensitive diaphragm area of less than 1 mm × 1 mm. In this paper, firstly, the working principles of several types of pressure sensors are briefly introduced. Secondly, the miniaturization with the development of the semiconductor processing technology is discussed. Thirdly, the sizes, performances, manufacturing processes, structures, and materials of small pressure sensors used in the different fields are explained in detail, especially in the medical field. Fourthly, problems encountered in the miniaturization of miniature pressure sensors are analyzed and possible solutions proposed. Finally, the probable development directions of miniature pressure sensors in the future are discussed.

scholarly journals Ferroelectric ceramic materials of the Aurivillius family

2013 ◽  
Vol 03 (04) ◽  
pp. 1330003 ◽  
Author(s):  
A. Peláiz-Barranco ◽  
Y. González-Abreu
Keyword(s):  
Lead Zirconate Titanate ◽  
Ceramic Materials ◽  
Ferroelectric Ceramic ◽  
Lead Zirconate ◽  
Ferroelectric Ceramics ◽  
Wide Range ◽  
Medical Diagnostic ◽  
Pyroelectric Sensors ◽  
Commercial Applications ◽  
High Dielectric

Ferroelectric ceramics are important materials with a wide range of industrial and commercial applications. Since the discovery of the phenomenon of ferroelectricity, they have been the heart and soul of several multibillion dollar industries, ranging from high-dielectric-permittivity capacitors to developments in piezoelectric transducers, pyroelectric sensors, medical diagnostic transducers, electro-optical devices, etc. Materials based on barium titanate and lead zirconate titanate have dominated the field throughout their history. Actually, the ferroelectric ceramics from the Aurivillius family receive great attention due to their large remanent polarization, lead-free nature, relatively low processing temperatures, high Curie temperatures and excellent piezoelectric properties, which made them good candidates for multiple applications. This review presents a general overview of the progress in the studies on the ferroelectric ceramics from the Aurivillius family. The progress includes several aspects: (i) structural studies, (ii) dielectric and electric behavior, (iii) piezoelectricity, and (iv) pyroelectricity.

Local electromechanical properties of ferroelectric materials for piezoelectric applications

2004 ◽  
Vol 838 ◽  
Author(s):  
A. L. Kholkin ◽  
I. K. Bdikin ◽  
V. V. Shvartsman ◽  
A. Orlova ◽  
D. Kiselev ◽  
...  
Keyword(s):  
Domain Wall ◽  
Microelectromechanical Systems ◽  
Ferroelectric Materials ◽  
Electromechanical Properties ◽  
Force Microscopy ◽  
Control Electronics ◽  
Piezoelectric Force Microscopy ◽  
And Control ◽  
Electromechanical Characterization

ABSTRACTLocal electromechanical characterization is becoming prerequisite for the development of ferroelectric-based piezoelectric devices including multilayer actuators, micromotors, piezoelectric filters and, especially, microelectromechanical systems (MEMS), which combine piezoelectric elements and control electronics on the same chip. In this work, we present the results of local electromechanical characterization of several important ferroelectric materials including Pb(Zr, Ti)O3 (PZT) and (Pb, La)(Zr, Ti)O3 (PLZT) in both thin film and ceramic form. Local piezoelectric hysteresis measurements are performed by the piezoelectric force microscopy (PFM) that detects small electric field-induced deformation on the nanoscale e. g., within the single grain of a polycrystalline material. A number of novel phenomena is observed with increasing dc bias voltage including the jump of ferroelectric domain wall to the grain boundary, the “fingerlike” instability of domain wall, and the local phase transition into ferroelectric phase.

The Fluid Mechanics of Microdevices—The Freeman Scholar Lecture

1999 ◽  
Vol 121 (1) ◽  
pp. 5-33 ◽  
Author(s):  
Mohamed Gad-el-Hak
Keyword(s):  
Integrated Circuit ◽  
Microelectromechanical Systems ◽  
Heat Pumps ◽  
Primary Objective ◽  
Sensors And Actuators ◽  
Thermal Actuators ◽  
The Status ◽  
Flow Phenomena ◽  
Processing Techniques ◽  
And Control

Manufacturing processes that can create extremely small machines have been developed in recent years. Microelectromechanical systems (MEMS) refer to devices that have characteristic length of less than 1 mm but more than 1 micron, that combine electrical and mechanical components and that are fabricated using integrated circuit batch-processing techniques. Electrostatic, magnetic, pneumatic and thermal actuators, motors, valves, gears, and tweezers of less than 100-μm size have been fabricated. These have been used as sensors for pressure, temperature, mass flow, velocity and sound, as actuators for linear and angular motions, and as simple components for complex systems such as micro-heat-engines and micro-heat-pumps. The technology is progressing at a rate that far exceeds that of our understanding of the unconventional physics involved in the operation as well as the manufacturing of those minute devices. The primary objective of this article is to critically review the status of our understanding of fluid flow phenomena particular to microdevices. In terms of applications, the paper emphasizes the use of MEMS as sensors and actuators for flow diagnosis and control.

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

Charge Trapping and Degradation Properties of PZT Thin Films for MEMS

1996 ◽  
Vol 444 ◽  
Author(s):  
Hyeon-Seag Kim ◽  
D. L. Polla ◽  
S. A. Campbell
Keyword(s):  
Thin Films ◽  
Loss Factor ◽  
High Field ◽  
Microelectromechanical Systems ◽  
Charge Trapping ◽  
Metal Organic ◽  
Electrical Reliability ◽  
Silicon Based ◽  
Degradation Properties ◽  
Organic Decomposition

AbstractThe electrical reliability properties of PZT (54/46) thin films have been measured for the purpose of integrating this material with silicon-based microelectromechanical systems. Ferroelectric thin films of PZT were prepared by metal organic decomposition. The charge trapping and degradation properties of these thin films were studied through device characteristics such as hysteresis loop, leakage current, fatigue, dielectric constant, capacitancevoltage, and loss factor measurements. Several unique experimental results have been found. Different degradation processes were verified through fatigue (bipolar stress), low and high charge injection (unipolar stress), and high field stressing (unipolar stress).

Exotic Doping for Zno Thin Films: Possibility of Monolithic Optical Integrated Circuit

1999 ◽  
Vol 574 ◽  
Author(s):  
Norifumi Fujimura ◽  
Tamaki Shimura ◽  
Toshifumi Wakano ◽  
Atsushi Ashida ◽  
Taichiro Ito
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Nonlinear Optic ◽  
Integrated Circuit ◽  
Film Surface ◽  
Zno Thin Films ◽  
Process Window ◽  
Electro Optic ◽  
Film Substrate ◽  
Optical Integrated Circuit

AbstractWe propose the application of ZnO:X (X = Li, Mg, N, In, Al, Mn, Gd, Yb etc.) films for a monolithic Optical Integrated Circuit (OIC). Since ZnO exhibits excellent piezoelectric effect and has also electro-optic and nonlinear optic effects and the thin films are easily obtained, it has been studied as one of the important thin film wave guide materials especially for an acoustooptic device[1]. In terms of electro-optic and nonlinear optic effects, however, LiNbO3 or LiTaO3 is superior to ZnO. The most important issue of thin film waveguide using such ferroelectrics is optical losses at the film/substrate interface and the film surface, because the process window to control the surface morphology is very narrow due to their high deposition temperature. Since ZnO can be grown at extremely low temperature, the roughness at the surface and the interface is expected to be minimized. This is the absolute requirement especially for waveguide using a blue or ultraviolet laser. Recently, lasing at the wavelength of ultraviolet, ferroelectric and antiferromagnetic behaviors of ZnO doped with various exotic elements (exotic doping) have been reported. This paper discusses the OIC application of ZnO thin films doped with exotic elements.

Design and Simulation of Pressure Sensor for Ocean Depth Measurements

2013 ◽  
Vol 313-314 ◽  
pp. 666-670 ◽  
Author(s):  
K.J. Suja ◽  
Bhanu Pratap Chaudhary ◽  
Rama Komaragiri
Keyword(s):  
Pressure Sensor ◽  
Integrated Circuit ◽  
Output Voltage ◽  
Pressure Sensors ◽  
Micro Electro Mechanical System ◽  
Constant Thickness ◽  
Piezoresistive Pressure Sensor ◽  
Wide Pressure Range ◽  
Processing Techniques ◽  
Wide Pressure

MEMS (Micro Electro Mechanical System) are usually defined as highly miniaturized devices combining both electrical and mechanical components that are fabricated using integrated circuit batch processing techniques. Pressure sensors are usually manufactured using square or circular diaphragms of constant thickness in the order of few microns. In this work, a comparison between circular diaphragm and square diaphragm indicates that square diaphragm has better perspectives. A new method for designing diaphragm of the Piezoresistive pressure sensor for linearity over a wide pressure range (approximately double) is designed, simulated and compared with existing single diaphragm design with respect to diaphragm deflection and sensor output voltage.

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