scholarly journals A Study on Universal Factor Determining the Evolution of Surface Roughness During Electrochemical Polishing

2021 ◽  
Author(s):  
Jianwei Ji ◽  
Khan M. Ajmal ◽  
Zejin Zhan ◽  
Rong Yi ◽  
Hui Deng
Keyword(s):  
Surface Roughness ◽  
Theoretical Analysis ◽  
Material Removal ◽  
Electrolyte Concentration ◽  
Polished Surface ◽  
Electrochemical Polishing ◽  
Viscous Layer ◽  
Practical Applications ◽  
Series Of Experiments ◽  
Key Parameter

Abstract Electrochemical polishing (ECP) is widely used for scratch- and damage-free finishing of metal components. Though the polishing effect of ECP has been confirmed in many researches, the influence of polishing parameters on evolution of surface roughness is still ambiguous owing to the use of different ECP systems. In this paper, the universal factor determining the evolution of surface roughness during ECP is studied by theoretical analysis as well as experiments. Theoretical analysis based on viscous layer mechanism demonstrates that the material removal thickness is the key parameter governing the roughness evolution of the polished surface regardless of other parameters including the voltage, current and electrolyte concentration and so forth. A series of experiments were designed and carried out to verify the proposed hypothesis. Both the experimental results and already published researches proved the validity and universality of the newly developed hypothesis on surface roughness evolution. This work is of great significance for further understanding the finishing mechanism of ECP and process control for its practical applications.

Performance analysis of process parameters on machining α–β titanium alloy in electrochemical micromachining process

2016 ◽  
Vol 232 (9) ◽  
pp. 1577-1589 ◽  
Author(s):  
T Geethapriyan ◽  
K Kalaichelvan ◽  
T Muthuramalingam ◽  
A Rajadurai
Keyword(s):  
Surface Roughness ◽  
Titanium Alloy ◽  
Grey Relational Analysis ◽  
Material Removal ◽  
Electrolyte Concentration ◽  
Removal Rate ◽  
Electrochemical Micromachining ◽  
Relational Analysis ◽  
Micro Tool ◽  
Grey Relational

Due to inherent properties of Ti-6Al-4V alloy, it is being used in the application of fuel injector nozzle for diesel engine, aerospace and marine industries. Since the electrochemical micromachining process involves the no heat-affected zone, no tool wear, stress- and burr-free process compared to other micromachining processes, it is widely used in the manufacturing field to fabricate complex shape and die. Hence, it is highly important to compute the optimum input parameters for enhancing the machining characteristics in such machining process. In this study, an attempt has been made to find the influence of the process parameters and optimize the parameters on machining α–β titanium alloy using Taguchi-grey relational analysis. Since applied voltage, micro-tool feed rate, electrolyte concentration and duty cycle have vital role in the process, these parameters have been chosen as the input parameters to evaluate the performance measures such as material removal rate, surface roughness and overcut in this study. From the experimental results, it has been found that micro-tool feed rate has more influence due to its importance in maintaining inter electrode gap to avoid micro-spark generation. It has also been found that lower electrolyte concentration with lower duty cycle produces lower surface roughness with better circularity on machining α–β titanium alloy. The optimum combination has been found using Taguchi-grey relational analysis and verified from confirmation test. It has also been inferred that the multi-response characteristics such as material removal rate, surface roughness and overcut can be effectively improved through the grey relational analysis.

Manufacturing of Mini-Channel by Electrical Chemical Machining Processes

2016 ◽  
Vol 842 ◽  
pp. 111-114
Author(s):  
Muslim Mahardika ◽  
Agung Mulianto ◽  
Andi Sudiarso
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Manufacturing Industry ◽  
Complex Shape ◽  
Electrolyte Concentration ◽  
Removal Rate ◽  
Hard Material ◽  
Machining Processes ◽  
Conventional Machining

The manufacturing industry is now growing rapidly in the area of non-conventional machining, especially Electrical Chemical Machining (ECM). The ECM can be used for machining of very hard material and very complex shape. This research is performed in order to manufacture mini-channel, which has a complex shape. The ECM machine cutting conditions are as follow; voltage: 7 Volt, feed rate: 1 .0 mm/minute, electrolyte: Natrium Cloride (NaCl), electrolyte concentration: 15 %, electrolyte speed: 3.32 m/s. The result shows that the mini-channel can be manufactured with the average of Material Removal Rate 0.035 g/min with the overcut average is 0.481 mm, and the surface roughness is 5.19 micro meter.

Mechanism and Experimental Investigation on Silicon Wafer Hybrid Polishing by Ultrasonic-Elliptic-Vibration Chemical-Mechanical

2011 ◽  
Vol 314-316 ◽  
pp. 829-836 ◽  
Author(s):  
Wei Ping Yang ◽  
Yong Bo Wu ◽  
Hong Fei Yang
Keyword(s):  
Theoretical Analysis ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Ultrasonic Vibration ◽  
Material Removal ◽  
Polished Surface ◽  
Polishing Pad ◽  
Wafer Polishing ◽  
Elliptic Vibration ◽  
Polishing Tool

Considering the technical status and existing problems of traditional silicon wafer chemical mechanical polishing (CMP), especially for the diameter of silicon wafer increasing, constantly, the surface quality and efficiency of silicon wafer polishing are becoming an urgent problem to be solved, so the research subject of ultrasonic vibration hybrid polishing new technique was proposed. By means of mechanism theoretical analysis research, firstly, the processing mechanism of hybrid polishing was studied systematically. An investigation of polishing mechanisms based on the micro-contact model between the polishing pad and the polishing surface of silicon wafer was developed. Polishing mechanism theoretical analysis shows that when ultrasonic vibrations combined with mechanical and chemical, the performance of polishing slurry is improved in the process of CMP, therefore to create favorable conditions. To verify the established theory, then, a series of experiments to investigate the traditional CMP are conducted, as well as the polishing tool with the forms of ultrasonic vibration, the polishing pad, the polishing surface quality, velocity at polishing point v, and slurry supplying Q on silicon wafer polishing. Experiment findings showed that, in the same polishing conditions, especially, hybrid polishing by ultrasonic-elliptic-vibration has gained more advantage over the effect of silicon wafer polishing. When ultrasonic-elliptic-vibration is put in polishing tool, the silicon wafer polished surface roughness Ra from the traditional method of polishing 0.077μm going down to the 0.042μm, the no-smooth rate KR which describes the polished surface morphology is significantly improved, and the material removal rate increases by 18%. Experimental research findings of the surface quality and the material removal mechanism are shown to be consistent with the theoretical analysis.

scholarly journals Experimental Optimization of Annular Polishing Parameters for Silicon Carbide

2018 ◽  
Vol 2018 ◽  
pp. 1-6
Author(s):  
Yuan Liu ◽  
La Han ◽  
Haiying Liu ◽  
Yikai Shi ◽  
Junjie Zhang
Keyword(s):  
Surface Roughness ◽  
Silicon Carbide ◽  
Surface Quality ◽  
Material Removal ◽  
Polished Surface ◽  
Strong Impact ◽  
Machined Surface ◽  
Experimental Optimization ◽  
Machined Surface Quality ◽  
Influential Parameters

Machined surface quality has a strong impact on the functionality of silicon carbide-based components and devices. In the present work, we first analytically investigate the complex coupling of motions in annular polishing based on the Preston equation, which derives the influential parameters for material removal. Subsequently, we conduct systematic annular polishing experiments of reaction-bonded silicon carbide to investigate the influence of derived parameters on polished surface quality, which yield optimized polishing parameters for achieving ultralow surface roughness of reaction-bonded silicon carbide.

Evolution of Surface Roughness of Ti Plate in Abrasive and Abrasive-Less Polishing

2010 ◽  
Vol 139-141 ◽  
pp. 844-847
Author(s):  
Quan Li Han ◽  
Bin Zhang
Keyword(s):  
Surface Roughness ◽  
Material Removal ◽  
Processing Time ◽  
Experimental Results ◽  
Polished Surface ◽  
Titanium Plate ◽  
Polishing Machine

Polishing the titanium plate is commonly necessary step before being used in many fields. Experiments of the titanium plate polished in the condition of including abrasive and existing abrasive are carried out to study the roughness of polished surface in given state. Surface roughness and morphology were investigated in experiments and experimental results were analyzed. In both experiments, the polished surface roughness value reduces with increase in processing time, and the detects on titanium plate before polishing decreases, which attributes to the mechanical and chemical tooth rising from lap between workpiece and polishing machine with the help of energy required. Material removal block in abrasive polishing is higher than that in case of existing abrasive. This helps to deepen the understanding of change in roughness of surface polished and indicates the promising operation technology for processing titanium in factory and workroom.

scholarly journals Investigation of Finishing Aluminum Alloy A5052 Using the Magnetic Abrasive Finishing Combined with Electrolytic Process

Machines ◽  
2020 ◽  
Vol 8 (4) ◽  
pp. 78
Author(s):  
Baijun Xing ◽  
Yanhua Zou
Keyword(s):  
Surface Roughness ◽  
Aluminum Alloy ◽  
Parameter Optimization ◽  
Material Removal ◽  
Experimental Conditions ◽  
Magnetic Abrasive Finishing ◽  
Machining Mechanism ◽  
Abrasive Finishing ◽  
Current Curve ◽  
Series Of Experiments

The magnetic abrasive finishing combined with electrolytic (EMAF) process was proposed to improve the finishing efficiency of the traditional magnetic abrasive finishing (MAF) process. Since the EMAF process contains electrolysis reactions, the machining mechanism of processing different metal is different. In this paper, a series of experiments were conducted to explore the feasibility of using the compound processing tool to finish aluminum alloy A5052, and to preliminary explore the machining mechanism. Surface roughness and material removal are used to evaluate the finishing effect and the finishing efficiency, respectively. The EMAF processing current curve is used to evaluate and analyze the EMAF process. The feasibility of the EMAF processing is proved by the analysis of simulations and the experimental results. Finally, through a series of exploration experiments and parameter optimization experiments, the main conclusions are as follows: (1) Compared with the traditional MAF process, when finishing the surface of aluminum alloy A5052 by the same compound processing tool and at the same experimental conditions (except the electrolysis conditions), the EMAF process, which includes electrolysis reactions, can achieve higher finishing efficiency. (2) In this study, when the working gap is 1 mm and the concentration of NaNO3 solution is 15%, the recommended processing voltage is about 3.4 V.

Ultra Smooth Planarization Polishing Technique Based on the Cluster Magnetorheological Effect

2010 ◽  
Vol 135 ◽  
pp. 18-23 ◽  
Author(s):  
Qiu Sheng Yan ◽  
Jie Wen Yan ◽  
Jia Bin Lu ◽  
Wei Qiang Gao
Keyword(s):  
Surface Roughness ◽  
Carbonyl Iron ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Polished Surface ◽  
Mr Fluid ◽  
Magnetorheological Effect ◽  
The Difference ◽  
Mr Effect

A new planarization polishing method based on the cluster magnetorheological (MR) effect is presented to polish optical glass in this paper. Some process experiments were conducted to reveal the influence of the content of carbonyl iron and the abrasive materials in the MR fluid on the machining effect, and the machining characteristic of polished surface was studied. The results indicate that the surface roughness of the polished workpiece can be reduced rapidly when the strong magnetic field is applied, and ultra smooth surface with Ra 1.4 nm can be achieved while the CeO2 abrasives are used in the MR fluid. The content of carbonyl iron obviously influences the machining effect of this planarization polishing method based on cluster MR-effect. With the increase of the content of carbonyl iron in the MR fluid, the material removal rate improves and the surface roughness reduces rapidly. However, the difference of abrasive material results in various machining effects. As for the K9 optical glass, the CeO2 abrasive is better polishing abrasive than the SiC abrasive in the planarization polishing technique based on the cluster MR-effect.

A Quasi-Static Mechanics Analysis of Three-Dimensional Nanoscale Surface Polishing

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
H. Xu ◽  
K. Komvopoulos
Keyword(s):  
Surface Roughness ◽  
Steady State ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Three Dimensional ◽  
Polished Surface ◽  
Elastic Plastic ◽  
Surface Polishing ◽  
Mechanics Analysis

A quasi-static mechanics analysis of nanoscale surface polishing that provides insight into the surface topography evolution and the removal of material at the asperity level is presented. The analysis is based on a three-dimensional stochastic model that accounts for multiscale (fractal) surface roughness and elastic, elastic-plastic, and fully plastic asperity deformation by hard abrasive nanoparticles embedded in the soft surface layer of a rigid polishing plate. Numerical results of the steady-state roughness of the polished surface, material removal rate, and wear coefficient are presented in terms of the apparent contact pressure, polishing speed, original topography and mechanical properties of the polished surface, average size and density of nanoparticles, and surface roughness of the polishing plate. Simulation trends are associated with elastic-plastic and fully plastic asperity contacts, responsible for irreversible topography changes (roughening effect) and material removal (smoothening effect), respectively. Analytical trends and predictions of the steady-state roughness of the polished surface and material removal rate are shown to be in good agreement with experimental results of nanoscale surface polishing (lapping) of magnetic recording ceramic heads.

On Performance of Electrochemical Discharge Micro-Machining Process Using Different Electrolytes and Tool Shapes

2020 ◽  
Vol 10 (2) ◽  
pp. 49-63
Author(s):  
Bijan Mallick ◽  
Sumit Biswas ◽  
Biplab Ranjan Sarkar ◽  
Biswanath Doloi ◽  
Bijoy Bhattacharyya
Keyword(s):  
Surface Roughness ◽  
Applied Voltage ◽  
Material Removal ◽  
Electrolyte Concentration ◽  
Removal Rate ◽  
Machining Process ◽  
Micro Machining ◽  
Sem Images ◽  
Research Article ◽  
Tool Shape

The electro-chemical discharge micro-machining (µ-ECDM) process can be utilised as a potential micro-machining process, which offers several advantages such as cost-effectiveness and diversity in applications on electrically non-conducting hard brittle materials like glass. The present research article includes the analysis of material removal rate (MRR), width of cut (WOC), heat affected zone (HAZ), and surface roughness (Ra) during µ-channeling on glass with a micro-ECDM process, considering applied voltage (V), electrolyte concentration (wt%), and tool shapes as process parameters. A comparative study is conducted to select the suitable tool shape and electrolyte. Moreover, the optical and SEM images are used to examine HAZ, WOC and topography of µ-channels. MRR and WOC enhance with the rise of applied voltage for fixed electrolyte concentration and vary with tool shape. Surface roughness (Ra) is found low at applied voltage of 55V and 60V for both electrolytes when straight and curved tools, respectively, are used. The straight tool shape is more suitable for µ-channeling on glass by µ-ECDM.

scholarly journals The effects of the process parameters in electrochemical machining on the surface quality

2020 ◽  
Vol 3 (SI1) ◽  
pp. First
Author(s):  
Nguyen Thi Bich Nhung ◽  
Dao Thanh Liem ◽  
Truong Quoc Thanh
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Process Parameters ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Electrolyte Concentration ◽  
Removal Rate ◽  
Electrochemical Machining ◽  
Electrode Gap

Based on the number of previous studies, this study aims to investigate the effects of process parameters of an Electrochemical Machining process, which are electrolyte concentration, the voltage applied to the machine, feed rate of the electrode, and Inter-Electrode Gap between tool and workpiece. Aluminum samples of 25 mm diameter x 25 mm height and 30mm diameter x 25mm height of the tool is made up of copper with a circular cross-section with 2 mm internal hole. The design of the system is based on the Taguchi method. Here, the signal-to-noise (S/N) model, the analysis of variance (ANOVA) and regression analyses are applied to determine optimal levels and to investigate the effects of these parameters on surface quality. Finally, the experiments that use the optimal levels of machining parameters are conducted to verify the effects of the process parameters on the surface quality of the products. The results pointed out a set of optimal parameters of the ECM process. The Inter-Electrode Gap between the tool and workpiece has extremely effected on these Material Removal rates and surface roughness. The Material Removal Rate increases with diseases in Inter-Electrode Gap, and Ra diseases with diseases in Inter-Electrode Gap. The experimental results show that maximum Material Removal Rate has obtained with electrolyte concentration at 100 g/l, feed rate at 0.0375 mm/min, the voltage at 15V, and Inter-Electrode Gap at 0.5mm. The minimum Ra has obtained with electrolyte concentration at 80 g/l, feed rate at 0.0468 mm/min, the voltage at 10V, and Inter-Electrode Gap at 0.5mm. This result has led to need studies on these parameters in Electrochemical Machining, which are improving productivities and surface roughness of the products.   

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