Evolution of Surface Roughness of Ti Plate in Abrasive and Abrasive-Less Polishing

2010 ◽  
Vol 139-141 ◽  
pp. 844-847
Author(s):  
Quan Li Han ◽  
Bin Zhang
Keyword(s):  
Surface Roughness ◽  
Material Removal ◽  
Processing Time ◽  
Experimental Results ◽  
Polished Surface ◽  
Titanium Plate ◽  
Polishing Machine

Polishing the titanium plate is commonly necessary step before being used in many fields. Experiments of the titanium plate polished in the condition of including abrasive and existing abrasive are carried out to study the roughness of polished surface in given state. Surface roughness and morphology were investigated in experiments and experimental results were analyzed. In both experiments, the polished surface roughness value reduces with increase in processing time, and the detects on titanium plate before polishing decreases, which attributes to the mechanical and chemical tooth rising from lap between workpiece and polishing machine with the help of energy required. Material removal block in abrasive polishing is higher than that in case of existing abrasive. This helps to deepen the understanding of change in roughness of surface polished and indicates the promising operation technology for processing titanium in factory and workroom.

Polishing Characteristics of a Low Frequency Vibration Assisted Polishing Method

2013 ◽  
Vol 797 ◽  
pp. 450-454 ◽  
Author(s):  
Wei Min Lin ◽  
Sze Keat Chee ◽  
Hirofumi Suzuki ◽  
Toshiro Higuchi
Keyword(s):  
Surface Roughness ◽  
Piezoelectric Actuator ◽  
Medical Devices ◽  
Material Removal ◽  
Low Frequency ◽  
Experimental Results ◽  
Two Dimensional ◽  
Digital Devices ◽  
Low Frequency Vibration

Demands of precision molds with complicated microstructures for digital devices such as DVD pick-up system, and medical devices such as μ-TAS and solar optics etc. are increasing. To enhance precision, the structured molds must be polished after grinding or cutting in order to improve the surface roughness. In this paper, a two-dimensional low frequency vibration (LFV) polishing actuator using PZT is proposed and developed. The LFV consists of four mechanical amplitude magnified actuators, a multilayer stacked piezoelectric actuator (PZT) incorporated with mechanical transformer, and a center piece. In the polishing experiments, HIPM workpieces were polished with WA slurry by the rotation & revolution type polishing method (RRP). The surface roughness of the work pieces and material removal amount (polished amount) was also evaluated. From the experimental results, it was found that the application of low frequency vibration is useful for realizing higher precision in the polishing of micro structured molds.

scholarly journals Experimental Optimization of Annular Polishing Parameters for Silicon Carbide

2018 ◽  
Vol 2018 ◽  
pp. 1-6
Author(s):  
Yuan Liu ◽  
La Han ◽  
Haiying Liu ◽  
Yikai Shi ◽  
Junjie Zhang
Keyword(s):  
Surface Roughness ◽  
Silicon Carbide ◽  
Surface Quality ◽  
Material Removal ◽  
Polished Surface ◽  
Strong Impact ◽  
Machined Surface ◽  
Experimental Optimization ◽  
Machined Surface Quality ◽  
Influential Parameters

Machined surface quality has a strong impact on the functionality of silicon carbide-based components and devices. In the present work, we first analytically investigate the complex coupling of motions in annular polishing based on the Preston equation, which derives the influential parameters for material removal. Subsequently, we conduct systematic annular polishing experiments of reaction-bonded silicon carbide to investigate the influence of derived parameters on polished surface quality, which yield optimized polishing parameters for achieving ultralow surface roughness of reaction-bonded silicon carbide.

Ultra Smooth Planarization Polishing Technique Based on the Cluster Magnetorheological Effect

2010 ◽  
Vol 135 ◽  
pp. 18-23 ◽  
Author(s):  
Qiu Sheng Yan ◽  
Jie Wen Yan ◽  
Jia Bin Lu ◽  
Wei Qiang Gao
Keyword(s):  
Surface Roughness ◽  
Carbonyl Iron ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Polished Surface ◽  
Mr Fluid ◽  
Magnetorheological Effect ◽  
The Difference ◽  
Mr Effect

A new planarization polishing method based on the cluster magnetorheological (MR) effect is presented to polish optical glass in this paper. Some process experiments were conducted to reveal the influence of the content of carbonyl iron and the abrasive materials in the MR fluid on the machining effect, and the machining characteristic of polished surface was studied. The results indicate that the surface roughness of the polished workpiece can be reduced rapidly when the strong magnetic field is applied, and ultra smooth surface with Ra 1.4 nm can be achieved while the CeO2 abrasives are used in the MR fluid. The content of carbonyl iron obviously influences the machining effect of this planarization polishing method based on cluster MR-effect. With the increase of the content of carbonyl iron in the MR fluid, the material removal rate improves and the surface roughness reduces rapidly. However, the difference of abrasive material results in various machining effects. As for the K9 optical glass, the CeO2 abrasive is better polishing abrasive than the SiC abrasive in the planarization polishing technique based on the cluster MR-effect.

A Quasi-Static Mechanics Analysis of Three-Dimensional Nanoscale Surface Polishing

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
H. Xu ◽  
K. Komvopoulos
Keyword(s):  
Surface Roughness ◽  
Steady State ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Three Dimensional ◽  
Polished Surface ◽  
Elastic Plastic ◽  
Surface Polishing ◽  
Mechanics Analysis

A quasi-static mechanics analysis of nanoscale surface polishing that provides insight into the surface topography evolution and the removal of material at the asperity level is presented. The analysis is based on a three-dimensional stochastic model that accounts for multiscale (fractal) surface roughness and elastic, elastic-plastic, and fully plastic asperity deformation by hard abrasive nanoparticles embedded in the soft surface layer of a rigid polishing plate. Numerical results of the steady-state roughness of the polished surface, material removal rate, and wear coefficient are presented in terms of the apparent contact pressure, polishing speed, original topography and mechanical properties of the polished surface, average size and density of nanoparticles, and surface roughness of the polishing plate. Simulation trends are associated with elastic-plastic and fully plastic asperity contacts, responsible for irreversible topography changes (roughening effect) and material removal (smoothening effect), respectively. Analytical trends and predictions of the steady-state roughness of the polished surface and material removal rate are shown to be in good agreement with experimental results of nanoscale surface polishing (lapping) of magnetic recording ceramic heads.

scholarly journals A Study on Universal Factor Determining the Evolution of Surface Roughness During Electrochemical Polishing

2021 ◽  
Author(s):  
Jianwei Ji ◽  
Khan M. Ajmal ◽  
Zejin Zhan ◽  
Rong Yi ◽  
Hui Deng
Keyword(s):  
Surface Roughness ◽  
Theoretical Analysis ◽  
Material Removal ◽  
Electrolyte Concentration ◽  
Polished Surface ◽  
Electrochemical Polishing ◽  
Viscous Layer ◽  
Practical Applications ◽  
Series Of Experiments ◽  
Key Parameter

Abstract Electrochemical polishing (ECP) is widely used for scratch- and damage-free finishing of metal components. Though the polishing effect of ECP has been confirmed in many researches, the influence of polishing parameters on evolution of surface roughness is still ambiguous owing to the use of different ECP systems. In this paper, the universal factor determining the evolution of surface roughness during ECP is studied by theoretical analysis as well as experiments. Theoretical analysis based on viscous layer mechanism demonstrates that the material removal thickness is the key parameter governing the roughness evolution of the polished surface regardless of other parameters including the voltage, current and electrolyte concentration and so forth. A series of experiments were designed and carried out to verify the proposed hypothesis. Both the experimental results and already published researches proved the validity and universality of the newly developed hypothesis on surface roughness evolution. This work is of great significance for further understanding the finishing mechanism of ECP and process control for its practical applications.

Research on Surface Roughness of Ultrasonic Polishing without Abrasive Based on Orthogonal Experiments

2009 ◽  
Vol 416 ◽  
pp. 133-136
Author(s):  
Jian Jun Jiang ◽  
Jian Xin Zheng ◽  
Chuan Shao Liu
Keyword(s):  
Surface Roughness ◽  
Feed Rate ◽  
Lower Surface ◽  
Orthogonal Test ◽  
Test Method ◽  
Experimental Results ◽  
Polished Surface ◽  
Orthogonal Experiments ◽  
Orthogonal Test Method ◽  
Conventional Rolling

Experiments of ultrasonic polishing the 45# steel shaft without abrasive are carried out by using orthogonal test method to study the polished surface roughness, and experimental results are analyzed with range method. The influence of polishing parameters on the polished surface roughness could be arranged as follows: feed rate, power of generator, preload pressure and radius of the tool head, in which the feed rate brings the most remarkable influence on the polished surface roughness. The surface roughness value reduces at first and then increases when the radius of tool head, preload pressure and power of the generator increase. The surface roughness value increases with the feed rate. Comparative experimental results of ultrasonic polishing without abrasive and the conventional rolling indicate that lower surface roughness value may be obtained by ultrasonic polishing without abrasive.

Anisotropic Lapping of Single Crystal Sapphire

2010 ◽  
Vol 102-104 ◽  
pp. 502-505
Author(s):  
Ping Zhou ◽  
Peng Fei Gao ◽  
Wei Fang Wang ◽  
Dong Hui Wen
Keyword(s):  
Fracture Toughness ◽  
Surface Roughness ◽  
Elastic Modulus ◽  
Single Crystal ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Orientation ◽  
Experimental Results ◽  
Single Crystal Sapphire

Lapping processes of single crystal sapphire are investigated in relation to crystallo- graphic orientation, the influence of the crystal anisotropism under different lapping liquid concentration, loading forces on materials removal rate and roughness in sapphire lapping is discussed. C-plane(0001),M-plane ( ),R-plane ( ),A-plane ( ) sapphire wafers were used for lapping experiments, experimental results show that Surface roughness is depend on the fracture toughness, surface orientation with higher fracture toughness such as C-plane would get better roughness during lapping, material removal rate of R-plane is the lowest in four planes, it is for elastic modulus and fracture toughness of R-plane are less than other three planes.

An Experimental Investigation of Effect of Process Parameters on Materials Removal Characteristics in Fluid Jet Polishing

2016 ◽  
Vol 679 ◽  
pp. 91-96
Author(s):  
Zhong Chen Cao ◽  
Chi Fai Cheung
Keyword(s):  
Process Parameters ◽  
Influence Function ◽  
Material Removal ◽  
Optical Glass ◽  
Experimental Results ◽  
Visible Range ◽  
Tool Influence Function ◽  
Ultra Precision ◽  
Polishing Machine ◽  
Polishing Tool

Fluid Jet Polishing (FJP) is a promising ultra-precision machining technology which shows great potential with regard to the application value in the generation of freeform surfaces with sub-micrometre form accuracy and nanometric surface finish. The polishing tool influence function (TIF), which is affected by various parameters and commonly assessed in terms of width, maximum depth and volumetric material removal rate, is critically required for corrective polishing and deterministic machining. In this study, a series of experiments was conducted to study the effect of various process parameters on the polishing tool influence function. The polishing machine used is a Zeeko IRP 200 ultra-precision freeform polishing machine, with three linear axes and three rotational axes. All polishing experiments were performed on BK7, which is one of the most common technical optical glass materials for high-quality optical components in the visible range. These specimens were polished using Al2O3 (Aluminium oxide) abrasive particles and measured by a Zygo Nexview 3D Optical Surface Profiler. All these experiments were conducted by changing one process parameter and keeping the other process parameters constant. In this paper, the experimental results are described in detail to show the relationships between the material removal and the various parameters (i.e. slurry pressure, standoff distance, impingement angle, etc.), and some interesting experimental results are explained.

Effects of Process Parameters on Surface Roughness and MRR in the hard turning of EN 36 steel

2018 ◽  
pp. 102-110
Author(s):  
Amritpal Singh ◽  
Rakesh Kumar
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Hard Turning ◽  
Control Parameter ◽  
Removal Rate ◽  
Cutting Speed ◽  
Depth Of Cut ◽  
Cutting Condition ◽  
Dry Cutting

In the present study, Experimental investigation of the effects of various cutting parameters on the response parameters in the hard turning of EN36 steel under the dry cutting condition is done. The input control parameters selected for the present work was the cutting speed, feed and depth of cut. The objective of the present work is to minimize the surface roughness to obtain better surface finish and maximization of material removal rate for better productivity. The design of experiments was done with the help of Taguchi L9 orthogonal array. Analysis of variance (ANOVA) was used to find out the significance of the input parameters on the response parameters. Percentage contribution for each control parameter was calculated using ANOVA with 95 % confidence value. From results, it was observed that feed is the most significant factor for surface roughness and the depth of cut is the most significant control parameter for Material removal rate.

Effect of SiC-Cu Electrode on Material Removal Rate, Tool Wear and Surface Roughness in EDM Process

2020 ◽  
Vol 38 (9A) ◽  
pp. 1406-1413
Author(s):  
Yousif Q. Laibia ◽  
Saad K. Shather
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal Rate ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
304 Stainless Steel ◽  
Tool Electrode ◽  
Pulse Time ◽  
Edm Process

Electrical discharge machining (EDM) is one of the most common non-traditional processes for the manufacture of high precision parts and complex shapes. The EDM process depends on the heat energy between the work material and the tool electrode. This study focused on the material removal rate (MRR), the surface roughness, and tool wear in a 304 stainless steel EDM. The composite electrode consisted of copper (Cu) and silicon carbide (SiC). The current effects imposed on the working material, as well as the pulses that change over time during the experiment. When the current used is (8, 5, 3, 2, 1.5) A, the pulse time used is (12, 25) μs and the size of the space used is (1) mm. Optimum surface roughness under a current of 1.5 A and the pulse time of 25 μs with a maximum MRR of 8 A and the pulse duration of 25 μs.

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