scholarly journals Исследование формирования омических контактов Au/Mo/Ti с пониженным сопротивлением к эпитаксиальным слоям алмаза p-типа

2019 ◽  
Vol 89 (12) ◽  
pp. 1923
Author(s):  
М.Н. Дроздов ◽  
Е.В. Демидов ◽  
Ю.Н. Дроздов ◽  
С.А. Краев ◽  
В.И. Шашкин ◽  
...  
Keyword(s):  
Titanium Carbide ◽  
Contact Resistance ◽  
Ohmic Contacts ◽  
Contact Region ◽  
Effective Diffusion ◽  
Protective Properties ◽  
High Adhesion ◽  
Heavy Doping ◽  
P Type

The formation of ohmic Au/Mo/Ti contacts to epitaxial p-type diamond films is studied. The effect of annealing on the electrical and structural properties of contacts has been investigated. It was shown that during rapid thermal annealing, the outer layer of gold protects the contact system from oxidation up to a temperature of 850°C, unlike the simplified Au/Ti system, which is more common in modern works. In Au/Ti structures without a Mo layer after high-temperature annealing, effective diffusion of titanium into the gold layer occurs, which reduces its protective properties and accelerates the diffusion of oxygen to the boundary with the diamond. Oxidation of the Ti/C contact region blocks the formation of a conductive layer of titanium carbide with high adhesion at the border with diamond. The role of various factors in reducing the contact resistance is compared: annealing for the formation of titanium carbide, heavy doping of diamond with boron atoms, and crystalline perfection of epitaxial diamond substrates. For doped epitaxial films grown on single-sector quality substrates, non-annealed ohmic contacts with a record contact resistance of 4•10<-7> Ω•cm<2> were obtained.

In-Based Ohmic Contacts to the Base Layer of GaAs-AlGaAs Heterojunction Bipolar Transistors

1990 ◽  
Vol 181 ◽  
Author(s):  
F. Ren ◽  
S. J. Pearton ◽  
W. S. Hobson ◽  
T. R. Fullowan ◽  
A. B. Emerson ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Heterojunction Bipolar Transistors ◽  
Ohmic Contacts ◽  
Bipolar Transistors ◽  
Base Layer ◽  
Specific Contact Resistance ◽  
Current Transport ◽  
Specific Contact ◽  
P Type

ABSTRACTThe use of AuBe-In/Ag/Au p-ohmic contacts for the base layer of GaAs-AIGaAs heterojunction bipolar transistors (HBTs) is described. Annealing at 420°C for 20 sec produces a contact resistivity of 0.095 Ω mm and a specific contact resistance of l.5 × 10-7 Ω cm2, and the surface morphology of the contact is excellent. The role of the silver is as a diffusion barrier to prevent Au spiking into the base layer which could degrade the HBT performance. The presence of the In layer is highly desirable in order to reduce the contact resistance, probably by forming an InGaAs phase at the metal-GaAs interface. Beryllium acts as the p-type dopant, and the top Au layer is used to lower the contact sheet resistance. Current transport through the structure is dominated by tunneling through the barrier due to field emission in the highly doped base layer at p-type doping levels above ∼1019 cm−3

Improvement of the Specific Contact Resistance on P-Type 4H-SiC by Using a Highly P-Typed Doped 4H-SiC Layer Selectively Grown by VLS Transport

2014 ◽  
Vol 806 ◽  
pp. 57-60
Author(s):  
Nicolas Thierry-Jebali ◽  
Arthur Vo-Ha ◽  
Davy Carole ◽  
Mihai Lazar ◽  
Gabriel Ferro ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
Schottky Barrier Height ◽  
Annealing Temperature ◽  
Process Condition ◽  
Specific Contact Resistance ◽  
High Doping Level ◽  
Annealing Temperatures ◽  
Specific Contact ◽  
P Type

This work reports on the improvement of ohmic contacts made on heavily p-type doped 4H-SiC epitaxial layer selectively grown by Vapor-Liquid-Solid (VLS) transport. Even before any annealing process, the contact is ohmic. This behavior can be explained by the high doping level of the VLS layer (Al concentration > 1020 cm-3) as characterized by SIMS profiling. Upon variation of annealing temperatures, a minimum value of the Specific Contact Resistance (SCR) down to 1.3x10-6 Ω.cm2 has been obtained for both 500 °C and 800 °C annealing temperature. However, a large variation of the SCR was observed for a same process condition. This variation is mainly attributed to a variation of the Schottky Barrier Height.

Ohmic Contacts to p-Type InGaAs/InP with a Graded Bandgap Heterobarrier

1993 ◽  
Vol 318 ◽  
Author(s):  
Patrick W. Leech ◽  
Geoffrey K. Reeves
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
Rutherford Backscattering Spectrometry ◽  
Specific Contact Resistance ◽  
Superlattice Structure ◽  
Specific Contact ◽  
P Type ◽  
Metal Layers ◽  
Anneal Temperature ◽  
Graded Bandgap

ABSTRACTOhmic contacts to p-type InP with an In0.47Ga0.53As buffer layer and an interposed superlattice of 50 Å In0.47Ga0.53As/ 50 Å InP have been investigated. Initial studies of contacts to In0.47Ga0.53As/ InP without the superlattice structure have shown that Pd/Zn/Pd/Au metallization produced a lower specific contact resistance (pc = 1.1 × 10−4 Ω cm2) than Pd/Ge/Au, and over a wider range of anneal temperature than Au/Zn/Au. The incorporation of the superlattice in the p-In0.47Ga0.53As/ InP structure resulted in Pd/Zn/Pd/Au contacts with pc of 3.2 × 10−5 Ω cm2 as-deposited and 7.5 × 10−6 Ω.cm2 after a 500 °C anneal. The presence of Pd/Zn in the metallization was shown as important in reducing pc. Significant intermixing of the metal layers and In0.47Ga0.53As occured at ≥ 350 °C, as revealed by Rutherford backscattering spectrometry.

Ni-Al-Ti Ohmic Contacts with Preserved Form Factor and Few 10- 4 Ωcm2 Specific Resistance on 0.1-1 Ωcm p-Type 4H-SiC

2018 ◽  
Vol 924 ◽  
pp. 385-388 ◽  
Author(s):  
Roberta Nipoti ◽  
Maurizio Puzzanghera ◽  
Maria Concetta Canino ◽  
Giovanna Sozzi ◽  
Paolo Fedeli
Keyword(s):  
Form Factor ◽  
Contact Resistance ◽  
Contact Area ◽  
Room Temperature ◽  
Ohmic Contacts ◽  
Specific Resistance ◽  
Thickness Ratio ◽  
Specific Contact Resistance ◽  
Specific Contact ◽  
P Type

This study shows that a thin Ni film on Al/Ti/4H-SiC metal pads allows to preserve the pad form factor during a 1000 °C/2 min treatment, provided that the Al and Ti film thicknesses are sufficiently thin. Moreover, by reducing the Al to Ti thickness ratio, droplet formation in the contact area is avoided and a mirror-like appearance is obtained. This optimal contact morphology corresponds to a specific contact resistance of few 10-4Ωcm2at room temperature on p-type 4H-SiC with resistivity in the range 0.1 – 1 Ωcm.

scholarly journals Optimization of Ohmic Contacts to p-GaAs Nanowires

2019 ◽  
Vol 14 (1) ◽  
Author(s):  
Marcelo Rizzo Piton ◽  
Teemu Hakkarainen ◽  
Joonas Hilska ◽  
Eero Koivusalo ◽  
Donald Lupo ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
Grazing Incidence ◽  
Degree Of Crystallinity ◽  
X Ray Diffraction ◽  
Gaas Nanowires ◽  
Current Voltage ◽  
Metal Evaporation ◽  
Gaas Nanowire ◽  
P Type

AbstractThe performance of Ohmic contacts applied to semiconductor nanowires (NWs) is an important aspect for enabling their use in electronic or optoelectronic devices. Due to the small dimensions and specific surface orientation of NWs, the standard processing technology widely developed for planar heterostructures cannot be directly applied. Here, we report on the fabrication and optimization of Pt/Ti/Pt/Au Ohmic contacts for p-type GaAs nanowires grown by molecular beam epitaxy. The devices were characterized by current–voltage (IV) measurements. The linearity of the IV characteristics curves of individual nanowires was optimized by adjusting the layout of the contact metal layers, the surface treatment prior to metal evaporation, and post-processing thermal annealing. Our results reveal that the contact resistance is remarkably decreased when a Pt layer is deposited on the GaAs nanowire prior to the traditional Ti/Pt/Au multilayer layout used for p-type planar GaAs. These findings are explained by an improved quality of the metal-GaAs interface, which was evidenced by grazing incidence X-ray diffraction measurements in similar metallic thin films deposited on GaAs (110) substrates. In particular, we show that Ti exhibits low degree of crystallinity when deposited on GaAs (110) surface which directly affects the contact resistance of the NW devices. The deposition of a thin Pt layer on the NWs prior to Ti/Pt/Au results in a 95% decrease in the total electrical resistance of Be-doped GaAs NWs which is associated to the higher degree of crystallinity of Pt than Ti when deposited directly on GaAs (110).

Stable Low Resistance Ohmic Contacts To p-GaN

2001 ◽  
Vol 680 ◽  
Author(s):  
Mi-Ran Park ◽  
Wayne A. Anderson
Keyword(s):  
Contact Resistance ◽  
Photoelectron Spectroscopy ◽  
Ohmic Contacts ◽  
Depth Profiling ◽  
Force Microscopy ◽  
Low Resistance ◽  
Atomic Force ◽  
Current Voltage ◽  
Thermionic Field Emission ◽  
P Type

ABSTRACTStable and low-resistance Ohmic contacts are especially important for laser diodes where high current levels are required. Good contacts are especially difficult on p-type GaN which was the motivation for this study. The GaN was epitaxially grown on (0001) sapphire substrates by MOCVD. Resistivity of this layer was 3.5 Ohm-cm and thickness was 2 microns. After conventional cleaning followed by treatment in boiling HNO3: HCl (1:3), metallization was by thermally evaporating 40 nm Au / 60 nm Ni or 70 nm Au / 55 nm Pd. Heat treatment in O2 + N2 at various temperatures followed, with best results at 600 °C or 700 °C, respectively. Best values of the contact resistance were 1.8×10−4 Ohm-cm2 for Pd/Au and 2.65×10−4 Ohm-cm2 for Ni/Au contacts. After repetitive cycling from room temperature to 600 °C, the Ni contacts were very stable and more stable than the Pd contacts. X-ray photoelectron spectroscopy depth profiling showed the Ni contacts to be NiO followed by Au at the interface for the Ni/Au contacts whereas the Pd/Au contacts exhibited a Pd: Au solid solution. Some contacts were quenched in liquid nitrogen following sintering. These contacts were much more uniform under atomic force microscopy examination and gave a 3 times lower contact resistance with the Ni/Au design. Current-voltage-temperature analysis revealed that conduction was predominantly by thermionic field emission.

The Role of Ni in the Formation of Low Resistance Ni–Ge–Au Ohmic Contacts to n+ GaAs Heterostructures

1999 ◽  
Vol 14 (4) ◽  
pp. 1261-1271 ◽  
Author(s):  
Nancy E. Lumpkin ◽  
Gregory R. Lumpkin ◽  
Mark G. Blackford
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
Wetting Agent ◽  
Dopant Distribution ◽  
Low Resistance ◽  
Ni Content ◽  
Alloy Microstructure

Nickel is a commonly used wetting agent in alloyed Au–Ge ohmic contacts to n-GaAs, resulting in uniformity improvements to the morphology and contact resistance. In order to study the role of Ni in Ni–Ge–Au alloys, we have fabricated samples with varying Ni content and characterized them using electron microbeam techniques. Our data indicate the amount of Ni in the alloy affects the microstructure and composition, the morphology of the metal/GaAs interface, and the amount of GaAs consumed during the alloy reaction. Also, the dopant distribution into the GaAs is heterogeneous depending on the alloy microstructure.

Al/Ni And Al/Ti Ohmic Contact To P-type SiC Diffused Layer

2000 ◽  
Vol 640 ◽  
Author(s):  
Xaiobin Wang ◽  
Stanislav Soloviev ◽  
Ying Gao ◽  
G. Straty ◽  
Tangali Sudarshan ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
Specific Contact Resistance ◽  
Metal Contacts ◽  
Transfer Length ◽  
Type Layer ◽  
Transmission Line Method ◽  
Specific Contact ◽  
Background Doping ◽  
P Type

ABSTRACTOhmic contacts to p-type SiC were fabricated by depositing Al/Ni and Al/Ti followed by high temperature annealing. A p-type layer was fabricated by Al or B diffusion from vapor phase into both p-type and n-type substrates. The thickness of the diffused layer was about 0.1–0.2 μm with surface carrier concentration of about 1.0×1019cm−3. Metal contacts to a p-type substrate with a background doping concentration of 1.2×1018cm−3, without a diffusion layer, were also formed. The values of specific contact resistance obtained by Circular Transmission Line Method (CTLM) and Transfer Length Method (TLM) for the n-type substrate, and by Cox & Strack method for p-type substrate, respectively, varied from 1.3×10−4Ωcm2 to 8.8×10−3 Ωcm2. The results indicate that the specific contact resistance could be significantly reduced by creating a highly doped diffused surface layer.

scholarly journals Comparison of Electrical Properties of Ohmic Contact Realized on p-Type 4H-SiC

2008 ◽  
Vol 600-603 ◽  
pp. 639-642
Author(s):  
Duy Minh Nguyen ◽  
Christophe Raynaud ◽  
Mihai Lazar ◽  
Heu Vang ◽  
Dominique Planson
Keyword(s):  
Surface Roughness ◽  
Electrical Properties ◽  
Contact Resistance ◽  
Carrier Mobility ◽  
Ohmic Contacts ◽  
Series Resistance ◽  
Specific Contact Resistance ◽  
Specific Contact ◽  
P Type ◽  
Post Implantation

N+ 4H-SiC commercial substrates with n-type epilayers have been used to realize bipolar diodes and TLM structures. The p-type emitter of diodes was realized by Al implantations followed by a post-implantation annealing with or without a graphite capping layer. Ohmic contacts were formed by depositing Ti/Ni on the backside and Ni/Al on the topside of the wafer. It appears that capping the sample during the annealing reduces considerably the surface roughness and the specific contact resistance. Sheet resistance and specific contact resistance as low as 2kΩ/□ and respectively 1.75×10-4 Ωcm² at 300 K have been obtained. I-V measurements as a function of temperature have been performed from ~100 to ~500 K. The variations of the series resistance vs. temperature can be explained by the freeze-out of carriers and by the variation of carrier mobility.

Dual Role of Tin Reaction Barrier in Gold-Based Metallization to GaAs

1993 ◽  
Vol 300 ◽  
Author(s):  
A. Piotrowska ◽  
E. Kaminska ◽  
M. Guziewicz ◽  
S. Kwiatkowski ◽  
A. Turos
Keyword(s):  
Magnetron Sputtering ◽  
Contact Resistance ◽  
Ohmic Contact ◽  
Diffusion Barrier ◽  
Ohmic Contacts ◽  
Specific Contact Resistance ◽  
Tin Films ◽  
Specific Contact ◽  
Tin Diffusion Barrier

ABSTRACTThe formation of ohmic contacts to p-GaAs based on Au-Zn system comprising a TiN diffusion barrier has been investigated using 2 MeV He+ RBS and the specific contact resistance measurements. It has been proved that TiN films deposited by reactive RF bias magnetron sputtering serves two purposes. First it suppresses the arsenic evaporation and thus confines the reaction between AuZn and GaAs. Second, it prevents intermixing between p-GaAs/Au(Zn) ohmic contact and an overlayer of Au.

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