scholarly journals Analytical study of the temperature distribution in solids subjected to nonuniform moving heat sources

2013 ◽  
Vol 17 (3) ◽  
pp. 687-694 ◽  
Author(s):  
Mohamed Hamraoui ◽  
Mounir Chbiki ◽  
Najib Laraqi ◽  
Luis Roseiro
Keyword(s):  
Steady State ◽  
Temperature Distribution ◽  
Power Dissipation ◽  
Relative Velocity ◽  
Analytical Study ◽  
Three Dimensional ◽  
Total Power ◽  
Heat Sources ◽  
Reference Case ◽  
Made In

We propose in this paper an analytical study of the temperature distribution in a solid subjected to moving heat sources. The power dissipated by the heat sources is considered nonuniform. The study was made in steady state. The model is three-dimensional. It is valid regardless of the relative velocity of the source. We have considered three cases of semi-elliptic distribution of the power with: (i) the maximum at the center of the source, (ii) the maximum at the inlet of the source, (iii) the maximum at the output of the source. These configurations simulate the conformity imperfection of contact due to wear and / or the non-uniformity of contact pressure in frictional devices. We compare the temperature change for these different scenarios and for different relative velocities, considering the same total power dissipation. The reference case is that of a uniform source dissipating the same power.

Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package

2007 ◽  
Author(s):  
Anand Desai ◽  
James Geer ◽  
Bahgat Sammakia
Keyword(s):  
Experimental Study ◽  
Heat Conduction ◽  
Steady State ◽  
Temperature Distribution ◽  
Numerical Model ◽  
Analytical Solution ◽  
Three Dimensional ◽  
Power Input ◽  
Experimental Measurements ◽  
Steady State Heat

This paper presents the results of an experimental study of steady state heat conduction in a three dimensional stack package. The temperatures are measured at different interfaces within the stacked package. Delphi devices are used in the experiment which enables controlled power input and surface temperature of the devices. The experiment is carried out for three different boundary conditions on the package. The power input in varied to study its effects. A numerical model is created to compare to the experimental results. The results are also compared with the analytical solution presented in Desai et al [5] and Geer et al [6]. The results indicate that the experimental, numerical and analytical solutions follow the same trend. The agreement between the experimental and numerical results improves when the lateral losses are taken into account.

On-State and Switching Performance of High-Voltage 15 – 20 kV 4H-SiC DMOSFETs and IGBTs

2008 ◽  
Vol 600-603 ◽  
pp. 1143-1146 ◽  
Author(s):  
Tomohiro Tamaki ◽  
Ginger G. Walden ◽  
Yang Sui ◽  
James A. Cooper
Keyword(s):  
High Voltage ◽  
Current Density ◽  
Power Dissipation ◽  
Three Dimensional ◽  
Total Power ◽  
Switching Frequency ◽  
Dimensional Parameter ◽  
Switching Performance ◽  
Blocking Voltage ◽  
Maximum Current

We compare the on-state and switching performance of high-voltage 4H-SiC n-channel DMOSFETs and p-channel IGBTs within a three-dimensional parameter space defined by blocking voltage, switching frequency, and current density. We determine the maximum current density each device can carry at a given switching frequency, such that the total power dissipation is 300 W/cm2. The IGBT current depends strongly on lifetime in the NPT buffer layer, and only weakly on lifetime in the drift layer. The MOSFET current is essentially independent of frequency.

A Full Numerical Solution for the Thermoelastohydrodynamic Problem in Elliptical Contacts

1984 ◽  
Vol 106 (2) ◽  
pp. 246-254 ◽  
Author(s):  
Dong Zhu ◽  
Shi-zhu Wen
Keyword(s):  
Steady State ◽  
Temperature Distribution ◽  
Numerical Solution ◽  
Pressure Distribution ◽  
Three Dimensional ◽  
Thermal Action ◽  
Film Pressure ◽  
Rolling Velocity ◽  
Friction Factors

In this paper a full numerical solution for the thermoelastohydrodynamic problem in elliptical contacts is presented, and the method of computation is also described. The film pressure, thickness, and film shape, the three dimensional temperature distribution within both the film and the bounding solids, as well as the coefficients of the sliding and rolling frictions have all been determined for different rolling velocities and slide-roll ratios. The results obtained indicate the film temperature increases as the rolling velocity or slide-roll ratio increases. The effects of thermal action on the pressure distribution, the film shape and thickness, and the friction factors are also given. The problem studied in this paper is steady-state, the lubricant is assumed to be Newtonian.

Thermal Math Modeling and Analysis of an Electronic Assembly

2000 ◽  
Vol 123 (4) ◽  
pp. 372-378 ◽  
Author(s):  
K. N. Shukla
Keyword(s):  
Temperature Distribution ◽  
Integral Transform ◽  
Three Dimensional ◽  
Thermal Characteristics ◽  
Circuit Board ◽  
Heat Sources ◽  
The Finite Element Method ◽  
Modeling And Analysis ◽  
Discrete Surface ◽  
Integral Transform Technique

This paper presents a mathematical model for a three-dimensional thermal analysis of a circuit board with multiple heat dissipating sources. The model considers the three-dimensional flat plate with discrete surface heat sources and integral transform technique is employed to determine the temperature distribution. The calculation procedure for the thermal characteristics of a circuit board, with surface mounted components, is presented and the solution is compared with those obtained from the finite element method. Also, the temperature distribution of a two-layered circuit board is presented in terms of Green’s function.

An Experimental Investigation of the Thermal Interaction of Electro-Optical Components on a Printed Circuit Board in Natural and Forced Convection

2003 ◽  
Author(s):  
Amy S. Fleischer ◽  
Randy D. Weinstein
Keyword(s):  
Natural Convection ◽  
Forced Convection ◽  
Power Dissipation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Total Power ◽  
Heat Sources ◽  
Thermal Interaction ◽  
Relative Location ◽  
Optical Components

The thermal interaction of an electrical and an optical component located on the same vertical circuit board is studied experimentally. The effects of component proximity and convective flow rate on overall power dissipation from each component are analyzed. The components are represented by isothermal heat sources mounted to a standard 1.59mm (0.0625 in) thick FR4 circuit board. In natural convection situations, when the spacing between components is great enough that the component thermal footprints do not interfere, the power dissipation reaches a maximum “plateau” value that is independent of spacing. If the components are located close enough together that their thermal footprints interfere then the total power dissipation is highly dependent on component spacing (relative location of the electrical source and the geometric positioning of both sources). In forced convection, the total power dissipated increases with both Reynolds number and component spacing. As in natural convection, the relative location of the electrical sources and the positioning of the sources are found to have a strong influence on power dissipation.

Sign in / Sign up

Export Citation Format

Share Document