Metallurgical Analysis of a Hopewell Copper Earspool

1971 ◽  
Vol 36 (3) ◽  
pp. 358-361 ◽  
Author(s):  
Arlene L. Fraikor ◽  
James J. Hester ◽  
Frederick J. Fraikor
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Cold Working ◽  
Analytical Techniques ◽  
Fabrication Process ◽  
Micro Hardness ◽  
Transmission Electron ◽  
Metallurgical Analysis

AbstractA prehistoric Hopewell copper earspool was analyzed by a number of metallurgical techniques including transmission electron microscopy. While optical photomicrographs and micro-hardness data suggest that the final fabrication process was annealing, transmission electron microscopy indicates that some final cold working was applied. This paper illustrates a new application of physical analytical techniques to archaeology.

The Analyses of Anthropogenic Atmospheric Particulates by EM

1990 ◽  
Vol 48 (2) ◽  
pp. 547-547
Author(s):  
Philip A. Russell
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Fine Particles ◽  
Analytical Techniques ◽  
Bulk Sample ◽  
Airborne Particulates ◽  
Discrete Particle ◽  
Transmission Electron ◽  
Physical And Chemical ◽  
Scanning Electron

This presentation will summarize fourteen years of research on the physical and chemical nature of particulates suspended in the earths atmosphere utilizing scanning electron microscopy and, to a lesser extent, transmission electron microscopy. Topics to be discussed include (1) the rationale for using electron microscopy to study airborne particulates, (2) methods for collecting airborne particulates, (3) methods of analysis and (4) a summary of results. Examples will demonstrate how conclusions about the nature and source of collected particles can differ between bulk sample analyses and discrete particle analyses. Without the input from discrete particle analyses, bulk analytical techniques may produce serious errors in the apportionment of airborne particulates to specific sources.The scanning electron microscope (SEM) and transmission electron microscopy (TEM) have proven themselves to be the preferred instruments to use in the study of discrete fine particles because they permit sufficient resolution and analytical capabilities to examine the structure and chemistry of individual particles less than a few micrometers in diameter.

scholarly journals Transmission electron microscopy for wood and fiber analysis – A Review

BioResources ◽  
2015 ◽  
Vol 10 (3) ◽  
pp. 6230-6261
Author(s):  
Mehedi Reza ◽  
Eero Kontturi ◽  
Anna-Stiina Jääskeläinen ◽  
Tapani Vuorinen ◽  
Janne Ruokolainen
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Cell Wall ◽  
Imaging Techniques ◽  
Analytical Techniques ◽  
Preparation Methods ◽  
Fiber Analysis ◽  
Transmission Electron ◽  
Cell Wall Polymers ◽  
Tension And Compression

This review describes use of transmission electron microscopy (TEM) in wood and fiber analysis. Analytical techniques and sample preparation methods are used to localize substructures of the cell wall polymers and are discussed in this review. The ultrastructural features of the wood cell walls, the structures formed by microfibrils, and the distribution of cell wall polymers, as revealed by TEM, are covered. Research investigating the distribution of lignin in tension and compression woods using TEM is reviewed. Different kinds of wood biodegrading enzymes localized using TEM are mentioned. Additional features of TEM, i.e., 3D imaging, analytical TEM, and electron diffraction are discussed. Lastly, a comparison between TEM and other imaging techniques used for wood and fiber research are made. Thus, this review provides insight into the contribution of TEM in wood research since its invention and demonstrates how to use it more effectively in the future.

Transmission Electron Microscopy of polysilicon microresistor

1994 ◽  
Vol 52 ◽  
pp. 864-865
Author(s):  
J. Z. Duan ◽  
B. Thomas ◽  
A. Sidhwa ◽  
S. Chopra
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Process Development ◽  
Electronic Materials ◽  
Region Of Interest ◽  
Analytical Techniques ◽  
Specimen Preparation ◽  
Control Parameters ◽  
Area Of Interest ◽  
Transmission Electron

The electrical properties of electronic materials are greatly affected by their microstructure, which in turn is determined by the processes used for fabrication. Transmission Electron Microscopy (TEM) is one of the most powerful analytical techniques to provide localized information about microstructure as it relates to process control parameters. This information is used for process development and failure diagnoses as well as QA/QC control. In this study, the microstructures within the devicesof polysilicon microresistors were analyzed using TEM to understand different resistances.The TEM samples were prepared from the devices to be analyzed by the mechanical polishing method using the tripod polisherTM. The selected area polishing technique was used to find the area of interest within one micron range. Figure 1 shows the specimen preparation process. The low and high magnification optical micrographs in Figures 1a and 1b indicate the region of interest within the die. Figure 1c is the optical image of the cross section along the line A-A in Figure lb.

Novel Application of Transmission Electron Microscopy and Scanning Capacitance Microscopy for Defect Root Cause Identification and Yield Enhancement

2003 ◽  
Author(s):  
P. Tangyunyong ◽  
T. A. Hill ◽  
C. Y. Nakakura ◽  
J. M. Soden ◽  
E. I. Cole ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
New Product Development ◽  
Analytical Techniques ◽  
Yield Enhancement ◽  
Product Development Process ◽  
Scanning Capacitance Microscopy ◽  
Root Cause ◽  
Transmission Electron ◽  
Root Cause Identification

Abstract Transmission electron microscopy (TEM) [1] and scanning capacitance microscopy (SCM) [2] have become common failure analysis tools at Sandia for new product development, process validation, and yield enhancement. These two techniques provide information that cannot be obtained with other analytical techniques. The information provided by these two techniques has been instrumental in identifying the root causes of several yield-limiting defects in CMOS IC technologies at Sandia. This paper describes an example of how TEM and SCM have been used to identify the root causes of SOI device failures. The corrective actions taken to reduce defects and improve yield are also described.

Cosio2 Formation on Strained GexSi1−x Layers BY Co/GexSi1−x Thermal Reaction

1993 ◽  
Vol 311 ◽  
Author(s):  
M.M. Ridgway ◽  
R.R. Elliman ◽  
R. Pascual ◽  
J.J. Whitton ◽  
J.-M. Baribeau
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Raman Spectroscopy ◽  
Analytical Techniques ◽  
Thermal Reaction ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transmission Electron ◽  
Scanning Electron

ABSTRACTThe formation of CoSi2 on Ge.17Si.83 layers by Co/Ge.17Si.83 thermal reaction nas been studied with a variety of analytical techniques. Co films deposited on strained Ge.17Si.83 layers were annealed at 600°C for 0–240 min. Following 240 rain annealing, the reacted surface layer was composed of CoSi, CoSi2 and GexSi1-x precipitates (the latter probably rich in Ge) as identified with transmission electron microscopy, x-ray diffraction and/or Raman spectroscopy. Lateral phase non-uniformity was evident with both transmission and scanning electron microscopy. For samples annealed with and without an evaporated Co film, enhanced relaxation of the underlying Ge.17Si.83 layer was apparent in the former.

Phase Transformation and Properties under Different Quenching Mediums of a X120 Pipeline Steel

2010 ◽  
Vol 152-153 ◽  
pp. 408-412
Author(s):  
Min Zhou ◽  
Lin Xiu Du ◽  
Xiang Hua Liu ◽  
Kai Zhang
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Pipeline Steel ◽  
Polygonal Ferrite ◽  
Granular Bainite ◽  
Micro Hardness ◽  
Transmission Electron ◽  
Cooling Velocity ◽  
Scanning Electron

The microstructure, CVN toughness and micro-hardness of an X120 pipeline steel were investigated by metalloscopy, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) etc. It showed that the microstructure evolved from lathe martensite, lathe bainite to granular bainite and polygonal ferrite, the size of M-A islands increased. With cooling velocity increasing, the CVN toughness at -20 was fluctuating, and reaching its peak in the steel cooled in oil had the best toughness, while the steel cooled in furnace was brittle at -20 . With cooling velocity decreasing, the micro-hardness of the steel decreased, whereas, the micro-hardness of the steel cooled in furnace increased slightly.

Techniques for Transmission Electron Microscopy of Fiber-Matrix Interfaces in Aluminum Alloy-Boron Composites by Ion Erosio

1971 ◽  
Vol 29 ◽  
pp. 204-205
Author(s):  
G. G. Shaw
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Aluminum Alloy ◽  
Electron Beam ◽  
Pure Aluminum ◽  
Ion Milling ◽  
Transmission Electron ◽  
Fiber Matrix ◽  
Ion Erosion ◽  
Row Of Fibers

The morphology and composition of the fiber-matrix interface can best be studied by transmission electron microscopy and electron diffraction. For some composites satisfactory samples can be prepared by electropolishing. For others such as aluminum alloy-boron composites ion erosion is necessary.When one wishes to examine a specimen with the electron beam perpendicular to the fiber, preparation is as follows: A 1/8 in. disk is cut from the sample with a cylindrical tool by spark machining. Thin slices, 5 mils thick, containing one row of fibers, are then, spark-machined from the disk. After spark machining, the slice is carefully polished with diamond paste until the row of fibers is exposed on each side, as shown in Figure 1.In the case where examination is desired with the electron beam parallel to the fiber, preparation is as follows: Experimental composites are usually 50 mils or less in thickness so an auxiliary holder is necessary during ion milling and for easy transfer to the electron microscope. This holder is pure aluminum sheet, 3 mils thick.

Direct Observation of Heat Exchanger Deposits by Cross Sectioning

1967 ◽  
Vol 25 ◽  
pp. 364-365
Author(s):  
R. W. Anderson ◽  
D. L. Senecal
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Heat Exchanger ◽  
Direct Observation ◽  
Cross Sections ◽  
Preparation Method ◽  
Specimen Preparation ◽  
Flowing Water ◽  
Transmission Electron ◽  
Deposit Layer

A problem was presented to observe the packing densities of deposits of sub-micron corrosion product particles. The deposits were 5-100 mils thick and had formed on the inside surfaces of 3/8 inch diameter Zircaloy-2 heat exchanger tubes. The particles were iron oxides deposited from flowing water and consequently were only weakly bonded. Particular care was required during handling to preserve the original formations of the deposits. The specimen preparation method described below allowed direct observation of cross sections of the deposit layers by transmission electron microscopy.The specimens were short sections of the tubes (about 3 inches long) that were carefully cut from the systems. The insides of the tube sections were first coated with a thin layer of a fluid epoxy resin by dipping. This coating served to impregnate the deposit layer as well as to protect the layer if subsequent handling were required.

Phase Transformations in Ti-7w/oMo-3w/oMe Alloy

1974 ◽  
Vol 32 ◽  
pp. 514-515
Author(s):  
S. Fujishiro
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Transmission Electron Microscopy ◽  
Tensile Strength ◽  
Mechanical Processing ◽  
Ray Method ◽  
X Ray ◽  
Transmission Electron ◽  
Water Quench ◽  
Alpha Beta

The mechanical properties of three titanium alloys (Ti-7Mo-3Al, Ti-7Mo- 3Cu and Ti-7Mo-3Ta) were evaluated as function of: 1) Solutionizing in the beta field and aging, 2) Thermal Mechanical Processing in the beta field and aging, 3) Solutionizing in the alpha + beta field and aging. The samples were isothermally aged in the temperature range 300° to 700*C for 4 to 24 hours, followed by a water quench. Transmission electron microscopy and X-ray method were used to identify the phase formed. All three alloys solutionized at 1050°C (beta field) transformed to martensitic alpha (alpha prime) upon being water quenched. Despite this heavily strained alpha prime, which is characterized by microtwins the tensile strength of the as-quenched alloys is relatively low and the elongation is as high as 30%.

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