Fabrication of Diamond/Cu Direct Bonding for Power Device Application

Author(s):  
Shinji Kanda ◽  
Satoshi Masuya ◽  
Makoto Kasu ◽  
Naoteru Shigekawa ◽  
Jianbo Liang
2018 ◽  
Vol 5 (6) ◽  
pp. 065020
Author(s):  
Abu Hussein Nurul Athirah ◽  
Ang Bee Chin ◽  
Wong Yew Hoong ◽  
Ong Boon Hoong ◽  
Baharuddin Aainaa Aqilah

2009 ◽  
Vol 615-617 ◽  
pp. 141-144 ◽  
Author(s):  
Ryo Hattori ◽  
Kazuhito Kamei ◽  
Kazuhiko Kusunoki ◽  
Nobuyoshi Yashiro ◽  
S. Shimosaki

LPE (liquid phase epitaxy) growth of low nitrogen unintentionally doped SiC epitaxial layer on on-axis 4H-SiC substrate using nitrogen getter Si based solution was investigated to realize basal plane dislocation (BPD) free epitaxial layer. A significant reduction in BPD was demonstrated.


2018 ◽  
Vol 458 ◽  
pp. 949-953 ◽  
Author(s):  
Haiding Sun ◽  
Young Jae Park ◽  
Kuang-Hui Li ◽  
Xinwei Liu ◽  
Theeradetch Detchprohm ◽  
...  

2008 ◽  
Vol 600-603 ◽  
pp. 179-182 ◽  
Author(s):  
Ryo Hattori ◽  
Kazuhiko Kusunoki ◽  
Nobuyuki Yashiro ◽  
Kazuhito Kamei

Solution growth on off-axis 4H-SiC sublimation substrate as a buffer layer for the subsequent CVD epitaxial growth was investigated. Dislocation conversion and propagation from the substrate to the CVD epitaxial layer through the solution grown buffer layer was inspected by molten KOH etch pit observation. Effective dislocation conversion from BPD to TED as an effect of the buffer layer insertion with no drastic change in the total EPD was confirmed.


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