scholarly journals Ternary Bi-Cu-Ni alloys – thermodynamics, characterization, mechanical and electrical properties

10.30544/316 ◽  
2017 ◽  
Vol 23 (3) ◽  
pp. 241-254 ◽  
Author(s):  
Branislav Radomir Marković ◽  
Dragan Manasijević ◽  
Nadežda Talijan ◽  
Miroslav Sokić ◽  
Nada Štrbac ◽  
...  
Keyword(s):  
Energy Dispersive Spectrometry ◽  
Molar Ratio ◽  
Lead Free Solder ◽  
High Temperature Application ◽  
Scanning Calorimetry ◽  
Ni Alloys ◽  
Mechanical And Electrical Properties ◽  
General Solution Model ◽  
Temperature Application ◽  
Free Solder

The Bi–Cu–Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.

scholarly journals Thermal, Structural and Electrical Properties of Some Bi-Cu-Ni Alloys

2014 ◽  
Vol 59 (1) ◽  
pp. 117-120 ◽  
Author(s):  
B. Marković ◽  
D. Živković ◽  
D. Manasijeyić ◽  
M. Sokić ◽  
D. Minić ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Cross Sections ◽  
Molar Ratio ◽  
High Temperature Application ◽  
Ni Alloys ◽  
Eds Analysis ◽  
Structural And Electrical Properties ◽  
Temperature Application ◽  
Thermal And Electrical Properties ◽  
Free Solder

Abstract The Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. In this study microstructure investigation of the slow-cooled Bi-Cu-Ni samples was done using SEM-EDS analysis. The samples compositions were chosen along three cross-sections with molar ratio Cu:Ni=1:3, 1:1 and 3:1. The experimentally obtained phase structure was compared with the results of thermodynamic calculation according to CALPHAD method. Also, new results regarding thermal and electrical properties investigations of these alloys are presented in this paper, based on DSC and electroconductivity measurements.

Addition of porous Cu interlayer to Sn-3.0Ag-0.5Cu lead-free solder joint for high temperature application

2014 ◽  
Author(s):  
Nashrah Hani Jamadon ◽  
Farazila Yusof ◽  
Mohd Abd Hamdi Shukor ◽  
Tadashi Ariga ◽  
Yukio Miyashita
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
High Temperature Application ◽  
Temperature Application ◽  
Free Solder ◽  
Cu Interlayer

scholarly journals Thermodynamic analysis and characterization of Bi–Cu–Sn alloys as advanced lead-free solder materials for high temperature application

2010 ◽  
Vol 22 (8) ◽  
pp. 1130-1135 ◽  
Author(s):  
Dragana Živković ◽  
Duško Minić ◽  
Dragan Manasijević ◽  
Nadežda Talijan ◽  
Iwao Katayama ◽  
...  
Keyword(s):  
High Temperature ◽  
Thermodynamic Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
High Temperature Application ◽  
Temperature Application ◽  
Free Solder

scholarly journals Thermodynamic analysis and characterization of alloys in Bi-Cu-Sb system

2010 ◽  
Vol 46 (1) ◽  
pp. 105-111 ◽  
Author(s):  
D. Zivkovic ◽  
D. Minic ◽  
D. Manasijevic ◽  
A. Kostov ◽  
N. Talijan ◽  
...  
Keyword(s):  
General Solution ◽  
Thermodynamic Analysis ◽  
Solution Model ◽  
Lead Free ◽  
Molar Ratio ◽  
Lead Free Solder ◽  
General Solution Model ◽  
Free Solder ◽  
Optic Microscopy

The results of thermodynamic analysis and characterization of some alloys in Bi-Cu-Sb lead-free solder system are presented in this paper. Thermodynamic analysis was done using general solution model, while optic microscopy, hardness and electroconductivity measurements were used in order to determine structural, mechanic and electric characteristics of selected samples in section from bismuth corner with molar ratio Cu:Sb=3:7.

Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium

2016 ◽  
Vol 23 (6) ◽  
pp. 641-647
Author(s):  
Her-Yueh Huang ◽  
Chung-Wei Yang ◽  
Yu-Chang Peng
Keyword(s):  
Mechanical Properties ◽  
Aging Process ◽  
Intermetallic Layer ◽  
Eutectic Structure ◽  
Contact Angles ◽  
Solidification Structure ◽  
Lead Free Solder ◽  
Bulk Alloy ◽  
Scanning Calorimetry ◽  
Free Solder

AbstractThe influence of a small amount of magnesium (only 0.01 wt.%) added to the Sn-0.7Cu solder alloy during the aging process of microstructural evolution is studied along with the mechanical properties of the alloy. The experimental results indicate that the addition of magnesium decreases the tensile strength of the solders but improves their elongation. The solidification structure of eutectic Sn-0.7Cu consists of β-Sn, and the eutectic structure, which has extremely fine intermetallic nodules, Cu6Sn5, is located in the interdendritic region. When the magnesium is added to the Sn-0.7Cu alloy, the Sn dendrites become slightly coarser; in comparison, the melting point of the Sn-0.7Cu-0.01Mg alloy decreased by 2°C for the differential scanning calorimetry results of bulk alloy samples. Sn-0.7Cu-0.01Mg exhibits the lowest contact angles and the widest spreading areas. After aging, the Sn-0.7Cu and Sn-0.7Cu-0.01Mg solders show significant changes in strength, mainly because of the obvious increase in the thickness of the Cu6Sn5 intermetallic layer.

Thermal Properties of Sn-0.7Cu/re-Al Composite Lead-Free Solder

2013 ◽  
Vol 795 ◽  
pp. 451-454
Author(s):  
M.A.A. Mohd Salleh ◽  
Flora Somidin ◽  
N.Z. Noriman ◽  
Khairel Rafezi Ahmad ◽  
Ramani Mayappan ◽  
...  
Keyword(s):  
Differential Scanning Calorimetry ◽  
Thermal Properties ◽  
Melting Temperature ◽  
Composite Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Scanning Calorimetry ◽  
Composite Approach ◽  
Al Composite ◽  
Free Solder

Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminum (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminum beverage cans were successfully fabricated via powder metallurgy techniques in this study. This paper focuses on the thermal properties focusing on the melting temperature of the new developed Sn-0.7Cu/re-Al lead-free composite solder. The melting temperature (Tm) of the new solders was determined using differential scanning calorimetry (DSC). The melting temperature of the composite solders has showed comparable results with the monolithic solders of Sn-0.7Cu lead-free solder.

Studies of the mechanical and electrical properties of lead-free solder joints

2002 ◽  
Vol 31 (11) ◽  
pp. 1292-1303 ◽  
Author(s):  
S. K. Kang ◽  
W. K. Choi ◽  
M. J. Yim ◽  
D. Y. Shih
Keyword(s):  
Electrical Properties ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Mechanical And Electrical Properties ◽  
Free Solder

Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys

2015 ◽  
Vol 9 (1) ◽  
pp. 2287-2298
Author(s):  
Rizk Mostafa Shalaby
Keyword(s):  
Grain Size ◽  
Intermetallic Compound ◽  
Creep Resistance ◽  
Melt Spinning ◽  
Microstructural Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Scanning Calorimetry ◽  
Hardness Tester ◽  
Free Solder

AbstractThe harmful effects of lead on the environment and human health, coupled with the threat of legislation, have prompted a serious search for lead-free solders for electronic packaging applications. The melt-spinning processes of ternary Sn-10 wt.%Sb-3 wt.%X (X=In, Ag, Bi and Zn) were analyzed using x-ray diffractometer (XRD), scanning electron microscopy (SEM), differential scanning calorimetry (DSC) and Vickers hardness tester (HV). The investigation showed that, the addition of a small amount of the third element enhances the ductility of the Sn–10 wt.% Sb lead-free solder due to the formation of a fine, homogeneous ternary microstructure.. It is concluded that, the addition of 3.0 wt% Ag improves the grain size of the ternary microstructure. Moreover, SnSb intermetallic compound, precipitated finely from the solid tin solution near the grain boundaries with antimony. This fine precipitated intermetallic compound suppresses the coarsening of the ternary structure and thus enhances solder ductility. Structural and microstructural analysis revealed that the origin of change in mechanical behaviors was due to refined beta-Sn grains and formation of intermetallic compounds (IMCs) SnSb, InSn19, β-In3Sn and Ag3Sn. The results indicated that the melting point of Sn-10Sb-3 wt.% Ag and Sn-10 wt.%Sb- 3 wt.% Zn alloys reduced to  230 and 240 ˚C respectively.  In particular, the zinc addition at 3 wt.%  is the most effective in improving solder ductility. The good creep resistance of Sn-10 wt.% Sb-3 wt.% Zn lead-free solder correlated to a large β-Sn grain size and complete soluble of SnSb IMC particles in the β-Sn matrix.

Characterization of Indium addition on Sn-Bi-Sb Lead free Solder alloy

2016 ◽  
Vol 12 (2) ◽  
pp. 4231-4243 ◽  
Author(s):  
Sara Mosaad Mahlab ◽  
Mustafa Kamal ◽  
Abd El-Raouf Mohamed Mansour
Keyword(s):  
Elastic Moduli ◽  
Resonance Method ◽  
Lead Free Solder ◽  
X Ray Diffraction ◽  
Scanning Calorimetry ◽  
X Ray ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Rapidly Solidified

The aim of these work is to measure the effect of the addition of In with different atomic percent weight on structure, melting, Electrical and mechanical properties of Sn70-X at.% -Bi15 at.% -Sb15 at.%- Inx at.%  rapidly solidified. X-ray diffraction analysis (XRD), differential scanning calorimetry (DSC), temperature dependence of resistivity (TDR), and mechanical resonance method are performed. It's found that electrical conductivity (σ) and thermal conductivity (K) increased gradually by increasing In at.%. Melting temperature reduced from 470.12 K for Sn70 at.%- Bi15 at.%- Sb15 at.% to 427.13 K in Sn61 at.%- Bi15 at.%- Sb15 at.%- In9 at.%. Also, elastic moduli, internal friction and thermal diffusivity measured from melt-quenched ribbons. 

scholarly journals Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature

Metals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1077
Author(s):  
Umair Ali ◽  
Hamza Khan ◽  
Muhammad Aamir ◽  
Khaled Giasin ◽  
Numan Habib ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Thermal Aging ◽  
Lead Free ◽  
Lead Free Solder ◽  
Scanning Calorimetry ◽  
X Ray ◽  
Lead Free Solder Alloy ◽  
Free Solder

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the problems associated with the growth formation of intermetallic compounds need further research, especially at high temperatures. This study investigates the doping of Bismuth into SAC305 in the various compositions of 1, 2, and 3 wt.%. The microstructure in terms of intermetallic compound particles and mechanical properties was examined after thermal aging at temperatures of 100 °C and 200 °C for 60 h. The microstructure examination was observed using scanning electron microscopy, and the chemical composition of each alloy was confirmed with an energy dispersive X-ray. Tensile tests were performed to find the mechanical properties such as yield strength and ultimate tensile strength. The intermetallic compound’s phase analysis was identified using X-ray diffraction, and differential scanning calorimetry was done to study the temperature curves for melting points. Results showed that the addition of Bismuth refined the microstructure by suppressing the growth of intermetallic compounds, which subsequently improved the mechanical properties. The thermal aging made the microstructure coarsen and degraded the mechanical properties. However, the most improved performance was observed with a Bismuth addition of 3 wt.% into SAC305. Furthermore, a decrease in the melting temperature was observed, especially at Bismuth compositions of 3 wt.%.

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