Thermal Properties of Sn-0.7Cu/re-Al Composite Lead-Free Solder

2013 ◽  
Vol 795 ◽  
pp. 451-454
Author(s):  
M.A.A. Mohd Salleh ◽  
Flora Somidin ◽  
N.Z. Noriman ◽  
Khairel Rafezi Ahmad ◽  
Ramani Mayappan ◽  
...  
Keyword(s):  
Differential Scanning Calorimetry ◽  
Thermal Properties ◽  
Melting Temperature ◽  
Composite Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Scanning Calorimetry ◽  
Composite Approach ◽  
Al Composite ◽  
Free Solder

Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminum (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminum beverage cans were successfully fabricated via powder metallurgy techniques in this study. This paper focuses on the thermal properties focusing on the melting temperature of the new developed Sn-0.7Cu/re-Al lead-free composite solder. The melting temperature (Tm) of the new solders was determined using differential scanning calorimetry (DSC). The melting temperature of the composite solders has showed comparable results with the monolithic solders of Sn-0.7Cu lead-free solder.

Influence of Silicon Nitride (Si3N4) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder

2015 ◽  
Vol 754-755 ◽  
pp. 530-534
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
M.N. Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Silicon Nitride ◽  
Powder Metallurgy ◽  
Entire Range ◽  
Composite Solder ◽  
Lead Free ◽  
Mechanical And Thermal Properties ◽  
Lead Free Solder ◽  
Alloy Addition ◽  
Free Solder

This research has investigated the solder performances of Sn-0.7Cu lead-free solder reinforced with silicon nitride (Si3N4). The Sn-0.7Cu + Si3N4 composite solder were fabricated via powder metallurgy (PM) technique with five different weight percentages (0, 0.25, 0.5, 0.75 and 1.0). Results showed that distribution of Si3N4 along the grain boundaries has increased the hardness of the Sn-0.7Cu + Si3N4 composite solders compared to monolithic Sn-0.7Cu solder alloy. Addition of Si3N4 reinforcement had no significant effect to the melting temperature of the solder. Overall, the entire range of Sn-0.7Cu + Si3N4 composition greatly improves the microhardness of the eutectic solder.

Design of Experiment (DOE) of Powder Metallurgy Technique in Fabricating SnCu/Carbon Lead-Free Composite Solder with Different Mixing Parameters

2014 ◽  
Vol 803 ◽  
pp. 269-272
Author(s):  
Sayyidah Amnah Musa ◽  
Norainiza Saud
Keyword(s):  
Powder Metallurgy ◽  
High Performance ◽  
Composite Solder ◽  
Mixing Time ◽  
Physical And Mechanical Properties ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Best Parameter ◽  
Free Solder

Physical and mechanical properties of a solder joint will be improved by adding the high performance of reinforcement particulates in the monolithic lead-free solder. In this study, 0.1wt% of activated carbon (AC) was added into Sn-0.7Cu lead-free solder which fabricated via powder metallurgy (PM) techniques. Various parameters used in PM technique such as mixing time, compacting load and sintering temperature has been carried out in fabricating the composite solder. In this study, the best mixing time has been optimized. The distribution of carbon in SnCu matrix for each mixing time was observed by using optical microscope. Microstructural observation showed that the increasing in mixing time has increased the number of AC particles to become agglomerated. It is found out that 1hour of mixing time is the best parameter to fabricate SnCu/AC composite solder via powder metallurgy route since the distribution of reinforcement particles has distributed uniformly at the grain boundaries without any agglomeration.

Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement

2015 ◽  
Vol 754-755 ◽  
pp. 518-523 ◽  
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Rita Mohd Said ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Powder Metallurgy ◽  
Phase Analysis ◽  
Solder Alloy ◽  
Composite Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Microstructural Observation ◽  
Micron Size ◽  
Free Solder

The effect of micron-size silicon nitride (Si3N4) particles additions, up to 1.0 wt. % on Sn-Cu-Ni (SN100C) solder alloy was investigated. Sn-Cu-Ni composite solder were prepared via powder metallurgy (PM) technique. Different percentages of Si3N4(0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added into the alloy. Result revealed that reinforcement was well distributed between the grain boundaries which could positively affect the properties of the composite solder.

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

2008 ◽  
Vol 38 (2) ◽  
pp. 351-355 ◽  
Author(s):  
Chang Dong Zou ◽  
Yu Lai Gao ◽  
Bin Yang ◽  
Xin Zhi Xia ◽  
Qi Jie Zhai ◽  
...  
Keyword(s):  
Melting Temperature ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Temperature Depression ◽  
Melting Temperature Depression

Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder

2014 ◽  
Vol 803 ◽  
pp. 273-277 ◽  
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Nazree Derman ◽  
Arif Anuar Mohd Salleh ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Titanium Dioxide ◽  
Powder Metallurgy ◽  
Solder Alloy ◽  
Composite Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Physical Performances ◽  
Free Solder ◽  
Sac Solder ◽  
Solder Composite

This research has investigated the physical performances of low-silver Sn-Ag-Cu (SAC) lead-free composite solder reinforced with titanium dioxide (TiO2). The SAC/TiO2 composite solder were fabricated via powder metallurgy (PM) technique. The five different composition chosen were 0, 0.25, 0.5, 0.75, and 1.0. The results showed that distribution of TiO2 along the grain boundaries has increased the hardness of the SAC/TiO2 composite solders compared to monolithic SAC solder alloy.

Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

2009 ◽  
Vol 484 (1-2) ◽  
pp. 777-781 ◽  
Author(s):  
Yulai Gao ◽  
Changdong Zou ◽  
Bin Yang ◽  
Qijie Zhai ◽  
Johan Liu ◽  
...  
Keyword(s):  
Melting Temperature ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snpb Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate

2013 ◽  
Vol 20 (4) ◽  
pp. 301-306 ◽  
Author(s):  
Her-Yueh Huang ◽  
Chung-Wei Yang ◽  
Sian-Ze Pan
Keyword(s):  
Carbon Nanotube ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Multiwalled Carbon Nanotube ◽  
Lead Free ◽  
Intermetallic Compound Layer ◽  
Lead Free Solder ◽  
Multiwalled Carbon ◽  
Free Solder

AbstractIn this work, contact angle, spreading area, and isothermal aging tests were conducted to study the difference between Sn-3Ag-0.5Cu lead-free solder and its composite solder at different multiwalled carbon nanotube reinforcement volume fractions. The material interaction between the solder and the substrate at different aging temperatures and times was investigated using scanning electron microscopy elemental analysis. The experimental results indicated that the composite solder had a lower contact angle as well as good spreading area. An intermetallic compound layer was found between the solder and the copper substrate, and the thickness of this reaction layer increased with increasing aging temperature and time. Meanwhile, the intermetallic compound layer of multiwalled carbon nanotube reinforcement composite solder was thicker than that of the Sn-3Ag-0.5Cu lead-free solder. The composite solder with 0.1 vol% multiwalled carbon nanotube reinforcement addition exhibited better comprehensive properties than composite solders with other reinforcement volume fractions.

Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys

2015 ◽  
Vol 9 (1) ◽  
pp. 2287-2298
Author(s):  
Rizk Mostafa Shalaby
Keyword(s):  
Grain Size ◽  
Intermetallic Compound ◽  
Creep Resistance ◽  
Melt Spinning ◽  
Microstructural Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Scanning Calorimetry ◽  
Hardness Tester ◽  
Free Solder

AbstractThe harmful effects of lead on the environment and human health, coupled with the threat of legislation, have prompted a serious search for lead-free solders for electronic packaging applications. The melt-spinning processes of ternary Sn-10 wt.%Sb-3 wt.%X (X=In, Ag, Bi and Zn) were analyzed using x-ray diffractometer (XRD), scanning electron microscopy (SEM), differential scanning calorimetry (DSC) and Vickers hardness tester (HV). The investigation showed that, the addition of a small amount of the third element enhances the ductility of the Sn–10 wt.% Sb lead-free solder due to the formation of a fine, homogeneous ternary microstructure.. It is concluded that, the addition of 3.0 wt% Ag improves the grain size of the ternary microstructure. Moreover, SnSb intermetallic compound, precipitated finely from the solid tin solution near the grain boundaries with antimony. This fine precipitated intermetallic compound suppresses the coarsening of the ternary structure and thus enhances solder ductility. Structural and microstructural analysis revealed that the origin of change in mechanical behaviors was due to refined beta-Sn grains and formation of intermetallic compounds (IMCs) SnSb, InSn19, β-In3Sn and Ag3Sn. The results indicated that the melting point of Sn-10Sb-3 wt.% Ag and Sn-10 wt.%Sb- 3 wt.% Zn alloys reduced to  230 and 240 ˚C respectively.  In particular, the zinc addition at 3 wt.%  is the most effective in improving solder ductility. The good creep resistance of Sn-10 wt.% Sb-3 wt.% Zn lead-free solder correlated to a large β-Sn grain size and complete soluble of SnSb IMC particles in the β-Sn matrix.

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