scholarly journals Processing and Interconnections of Finely Segmented Semiconductor Pixel Detectors for Applications in Particle Physics and Photon Detection

2021 ◽  
Vol 9 ◽  
Author(s):  
J. Härkönen ◽  
J. Ott ◽  
A. Gädda ◽  
M. Bezak ◽  
E. Brücken ◽  
...  
Keyword(s):  
Particle Physics ◽  
Large Scale ◽  
Flip Chip ◽  
Atomic Layer ◽  
Processing Technology ◽  
Semiconductor Detectors ◽  
Pixel Detector ◽  
Pixel Detectors ◽  
Imaging Detector ◽  
Radiation Induced

Radiation hardness is in the focus of the development of particle tracking and photon imaging detector installations. Semiconductor detectors, widely used in particle physics experiments, have turned into capacitive-coupled (AC-coupled) detectors from the originally developed conductively coupled (DC-coupled) detectors. This is due to the superior isolation of radiation-induced leakage current in AC-coupled detectors. However, some modern detector systems, such as the tracking detectors in the CERN LHC CMS or ATLAS experiments, are still DC-coupled. This originates from the difficulty of implementing AC coupling on very small pixel detector areas. In this report, we describe our advances in the detector processing technology. The first topic is the applications of the atomic layer deposition processing technology, which enables the very high densities of capacitance and resistance that are needed when the dimensions of the physical segmentation of pixel detectors need to be scaled down. The second topic is the flip-chip/bump-bonding interconnection technology, which is necessary in order to manufacture pixel detector modules on a large scale with a more than 99% yield of noise-free and faultless pixels and detector channels.

Semiconductor detectors

2020 ◽  
pp. 255-372
Author(s):  
Hermann Kolanoski ◽  
Norbert Wermes
Keyword(s):  
Particle Physics ◽  
Nuclear Physics ◽  
Gamma Ray ◽  
Semiconductor Detectors ◽  
Silicon Detectors ◽  
Particle Detection ◽  
Semiconductor Physics ◽  
Pixel Detectors ◽  
Drift Chambers ◽  
Electronic Measurement

Already since the early 1960s semiconductor detectors have been employed in nuclear physics, in particular for gamma ray energy measurement. This chapter concentrates on position sensitive semiconductor detectors which have been developed in particle physics since the 1980s and which feature position resolutions in the range of 50–100 μ‎m by structuring the electrodes, thus reaching the best position resolutions of electronic detectors. For the first time this made the electronic measurement of secondary vertices and therewith the lifetime of heavy fermions possible. The chapter first conveys the basics of semiconductor physics, of semiconductor and metal-semiconductor junctions used in electronics and detector applications as well as particle detection with semiconductor detectors. It follows the description of different detector types, like strip and pixel detectors, silicon drift chambers and charged-coupled devices. New developments are addressed in the sections on ‘Monolithic pixel detectors’ and on ‘Precision timing with silicon detectors’. In the last sections detector deterioration by radiation damage is described and an overview of other semiconductor detector materials but silicon is given.

3D TSV hybrid pixel detector modules with ATLAS FE-I4 readout electronic chip

2022 ◽  
Vol 17 (01) ◽  
pp. C01029
Author(s):  
T. Fritzsch ◽  
F. Huegging ◽  
P. Mackowiak ◽  
K. Zoschke ◽  
M. Rothermund ◽  
...  
Keyword(s):  
Flip Chip ◽  
High Energy Physics ◽  
Metal Layer ◽  
High Energy ◽  
Pixel Detector ◽  
Final Thickness ◽  
Readout Electronic ◽  
Pixel Detectors ◽  
Wide Range ◽  
Electroplating Process

Abstract The through silicon via (TSV) technology has been introduced in a wide range of electronic packaging applications. Hybrid pixel detectors for X-ray imaging and for high-energy physics (HEP) can benefit from this technology as well. A 3D TSV prototype using the ATLAS FE-I4 readout electronic chip is described in this paper. This type of readout chip is already prepared for the TSV backside process providing a TSV landing pad in the first metal layer of the backend-of-line (BEOL) layer stack. Based on this precondition a TSV backside via-last process is developed on ATLAS FE-I4 readout chip wafer. The readout chip wafers were thinned to 100 µm and 80 µm final thickness and straight sidewall vias with 60 µm in diameter has been etched into the silicon from wafer backside using deep reactive ion etching (DRIE). The filling of the TSVs and the formation of the wafer backside interconnection were provided by a copper electroplating process. ATLAS FE-I4 readout chips with through silicon vias has been successfully tested, tuned and operated. In addition, hybrid pixel detector modules have been flip chip bonded using ATLAS FE-I4 TSV readout chips and planar sensor chips. After mounting the bare modules onto a support PCB, its full functionality has been verified with a source scan.

X-ray powder diffraction with hybrid semiconductor pixel detectors

1999 ◽  
Vol 6 (2) ◽  
pp. 112-115 ◽  
Author(s):  
S. Manolopoulos ◽  
R. Bates ◽  
G. Bushnell-Wye ◽  
M. Campbell ◽  
G. Derbyshire ◽  
...  
Keyword(s):  
Particle Physics ◽  
High Rate ◽  
Pixel Detector ◽  
X Ray Diffraction ◽  
Position Information ◽  
X Ray ◽  
Pixel Detectors ◽  
Powder Samples ◽  
Diffraction Patterns ◽  
Physics Experiments

Semiconductor hybrid pixel detectors, originally developed for particle physics experiments, have been used for an X-ray diffraction experiment on a synchrotron radiation source. The spatial resolution of the intensity peaks in the diffraction patterns of silicon and potassium niobate powder samples was found to be better than that of a scintillator-based system, typically used at present. The two-dimensional position information of the pixel detector enabled multi-peak diffraction patterns to be acquired and clearly resolved without the need for an angle scan with a diffractometer. This trial experiment shows the potential of this technology for high-resolution high-rate diffraction systems.

Optimal Test Assembly in Practice

2013 ◽  
Vol 221 (3) ◽  
pp. 190-200 ◽  
Author(s):  
Jörg-Tobias Kuhn ◽  
Thomas Kiefer
Keyword(s):  
Particle Physics ◽  
Large Scale ◽  
Block Design ◽  
Linear Optimization ◽  
Mixed Integer ◽  
Optimal Test ◽  
Automated Test Assembly ◽  
Test Assembly ◽  
Block Level ◽  
Mixed Integer Linear Optimization

Several techniques have been developed in recent years to generate optimal large-scale assessments (LSAs) of student achievement. These techniques often represent a blend of procedures from such diverse fields as experimental design, combinatorial optimization, particle physics, or neural networks. However, despite the theoretical advances in the field, there still exists a surprising scarcity of well-documented test designs in which all factors that have guided design decisions are explicitly and clearly communicated. This paper therefore has two goals. First, a brief summary of relevant key terms, as well as experimental designs and automated test assembly routines in LSA, is given. Second, conceptual and methodological steps in designing the assessment of the Austrian educational standards in mathematics are described in detail. The test design was generated using a two-step procedure, starting at the item block level and continuing at the item level. Initially, a partially balanced incomplete item block design was generated using simulated annealing, whereas in a second step, items were assigned to the item blocks using mixed-integer linear optimization in combination with a shadow-test approach.

Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy

1996 ◽  
Author(s):  
O. Diaz de Leon ◽  
M. Nassirian ◽  
C. Todd ◽  
R. Chowdhury
Keyword(s):  
Failure Analysis ◽  
Large Scale ◽  
Flip Chip ◽  
Ultrasonic Waves ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Chip Technology ◽  
Ball Joints ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

Abstract Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Integration (ULSI) applications [1]. The flip-chip technology is based on the direct attach principle of die to substrate interconnection.. The absence of bondwires clearly enables packages to become more slim and compact, and also provides higher pin counts and higher-speeds [2]. However, due to its construction, with inherent hidden structures the Flip-Chip technology presents a challenge for non-destructive Failure Analysis (F/A). The scanning acoustic microscope (SAM) has recently emerged as a valuable evaluation tool for this purpose [3]. C-mode scanning acoustic microscope (C-SAM), has the ability to demonstrate non-destructive package analysis while imaging the internal features of this package. Ultrasonic waves are very sensitive, particularly when they encounter density variations at surfaces, e.g. variations such as voids or delaminations similar to air gaps. These two anomalies are common to flip-chips. The primary issue with this package technology is the non-uniformity of the die attach through solder ball joints and epoxy underfill. The ball joints also present defects as open contacts, voids or cracks. In our acoustic microscopy study packages with known defects are considered. It includes C-SCAN analysis giving top views at a particular package interface and a B-SCAN analysis that provides cross-sectional views at a desired point of interest. The cross-section analysis capability gives confidence to the failure analyst in obtaining information from a failing area without physically sectioning the sample and destroying its electrical integrity. Our results presented here prove that appropriate selection of acoustic scanning modes and frequency parameters leads to good reliable correlation between the physical defects in the devices and the information given by the acoustic microscope.

Effective Field Theory in Particle Physics and Cosmology

2020 ◽  
Keyword(s):  
Field Theory ◽  
Effective Field Theory ◽  
Particle Physics ◽  
Large Scale ◽  
Effective Field ◽  
Effective Theory ◽  
Soft Collinear Effective Theory ◽  
Multiple Length Scales ◽  
Cosmological Observations ◽  
Standard Models

Effective field theory (EFT) is a general method for describing quantum systems with multiple-length scales in a tractable fashion. It allows us to perform precise calculations in established models (such as the standard models of particle physics and cosmology), as well as to concisely parametrize possible effects from physics beyond the standard models. EFTs have become key tools in the theoretical analysis of particle physics experiments and cosmological observations, despite being absent from many textbooks. This volume aims to provide a comprehensive introduction to many of the EFTs in use today, and covers topics that include large-scale structure, WIMPs, dark matter, heavy quark effective theory, flavour physics, soft-collinear effective theory, and more.

scholarly journals Innovative Polymeric Hybrid Nanocomposites for Application in Photocatalysis

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1184
Author(s):  
Maria Cantarella ◽  
Giuliana Impellizzeri ◽  
Alessandro Di Mauro ◽  
Vittorio Privitera ◽  
Sabrina Carola Carroccio
Keyword(s):  
Hybrid Systems ◽  
Hybrid Materials ◽  
Large Scale ◽  
Mechanical Stability ◽  
Low Cost ◽  
Atomic Layer ◽  
Hybrid Nanocomposites ◽  
Polymeric Nanocomposites ◽  
Wastewater Remediation ◽  
Antibacterial Performance

The immobilization of inorganic nanomaterials on polymeric substrates has been drawing a lot of attention in recent years owing to the extraordinary properties of the as-obtained materials. The hybrid materials, indeed, combine the benefits of the plastic matter such as flexibility, low-cost, mechanical stability and high durability, with them deriving from their inorganic counterparts. In particular, if the inorganic fillers are nanostructured photocatalysts, the originated hybrid systems will be able to utilize the energy delivered by light, catalysing chemical reactions in a sustainable pathway. Most importantly, since the nanofillers can be ad-hoc anchored to the macromolecular structure, their release in the environment will be prevented, thus overcoming one of the main restrictions that impedes their applications on a large scale. In this review, several typologies of hybrid photocatalytic nanomaterials, obtained by using both organic and inorganic semiconductors and realized with different synthetic protocols, were reported and discussed. In the first part of the manuscript, nanocomposites realized by simply blending the TiO2 or ZnO nanomaterials in thermoplastic polymeric matrices are illustrated. Subsequently, the atomic layer deposition (ALD) technique is presented as an excellent method to formulate polymeric nanocomposites. Successively, some examples of polyporphyrins hybrid systems containing graphene, acting as photocatalysts under visible light irradiation, are discussed. Lastly, photocatalytic polymeric nanosponges, with extraordinary adsorption properties, are shown. All the described materials were deeply characterized and their photocatalytic abilities were evaluated by the degradation of several organic water pollutants such as dyes, phenol, pesticides, drugs, and personal care products. The antibacterial performance was also evaluated for selected systems. The relevance of the obtained results is widely overviewed, opening the route for the application of such multifunctional photocatalytic hybrid materials in wastewater remediation.

scholarly journals A lightweight approach to performance portability with targetDP

2016 ◽  
Vol 32 (2) ◽  
pp. 288-301
Author(s):  
Alan Gray ◽  
Kevin Stratford
Keyword(s):  
Particle Physics ◽  
Message Passing ◽  
Graphics Processing Units ◽  
High Performance ◽  
Large Scale ◽  
Message Passing Interface ◽  
Graphics Processing Unit ◽  
Processing Unit ◽  
Performance Portability ◽  
Graphics Processing

Leading high performance computing systems achieve their status through use of highly parallel devices such as NVIDIA graphics processing units or Intel Xeon Phi many-core CPUs. The concept of performance portability across such architectures, as well as traditional CPUs, is vital for the application programmer. In this paper we describe targetDP, a lightweight abstraction layer which allows grid-based applications to target data parallel hardware in a platform agnostic manner. We demonstrate the effectiveness of our pragmatic approach by presenting performance results for a complex fluid application (with which the model was co-designed), plus separate lattice quantum chromodynamics particle physics code. For each application, a single source code base is seen to achieve portable performance, as assessed within the context of the Roofline model. TargetDP can be combined with Message Passing Interface (MPI) to allow use on systems containing multiple nodes: we demonstrate this through provision of scaling results on traditional and graphics processing unit-accelerated large scale supercomputers.

Subpixel resolution in CdTe Timepix3 pixel detectors

2018 ◽  
Vol 25 (6) ◽  
pp. 1650-1657 ◽  
Author(s):  
Mohamad Khalil ◽  
Erik Schou Dreier ◽  
Jan Kehres ◽  
Jan Jakubek ◽  
Ulrik Lund Olsen
Keyword(s):  
Single Photon ◽  
Weighted Average ◽  
European Synchrotron Radiation Facility ◽  
Time Of Arrival ◽  
Pixel Detector ◽  
Step Size ◽  
X Ray ◽  
Pixel Detectors ◽  
Individual Photon ◽  
Subpixel Resolution

Timepix3 (256 × 256 pixels with a pitch of 55 µm) is a hybrid-pixel-detector readout chip that implements a data-driven architecture and is capable of simultaneous time-of-arrival (ToA) and energy (ToT: time-over-threshold) measurements. The ToA information allows the unambiguous identification of pixel clusters belonging to the same X-ray interaction, which allows for full one-by-one detection of photons. The weighted mean of the pixel clusters can be used to measure the subpixel position of an X-ray interaction. An experiment was performed at the European Synchrotron Radiation Facility in Grenoble, France, using a 5 µm × 5 µm pencil beam to scan a CdTe-ADVAPIX-Timepix3 pixel (55 µm × 55 µm) at 8 × 8 matrix positions with a step size of 5 µm. The head-on scan was carried out at four monochromatic energies: 24, 35, 70 and 120 keV. The subpixel position of every single photon in the beam was constructed using the weighted average of the charge spread of single interactions. Then the subpixel position of the total beam was found by calculating the mean position of all photons. This was carried out for all points in the 8 × 8 matrix of beam positions within a single pixel. The optimum conditions for the subpixel measurements are presented with regards to the cluster sizes and beam subpixel position, and the improvement of this technique is evaluated (using the charge sharing of each individual photon to achieve subpixel resolution) versus alternative techniques which compare the intensity ratio between pixels. The best result is achieved at 120 keV, where a beam step of 4.4 µm ± 0.86 µm was measured.

Packaging of In-Plane Thermal Microactuators for BioMEMS Applications

2005 ◽  
Author(s):  
Hrishikesh V. Panchawagh ◽  
Faheem F. Faheem ◽  
Cari F. Herrmann ◽  
David B. Serrell ◽  
Dudley S. Finch ◽  
...  
Keyword(s):  
Flip Chip ◽  
Atomic Layer ◽  
Thermal Actuator ◽  
Mems Devices ◽  
Thermal Actuators ◽  
Layer Deposition ◽  
Comb Drives ◽  
Small Clearance ◽  
Surrounding Liquid ◽  
Packaging Technique

This paper addresses two issues related to in-plane, electro-thermal actuators for BioMEMS applications. First, in order to protect the actuator from biological debris and particulates, a packaging technique using a flip-chip bonded polysilicon cap is demonstrated. The encapsulated actuator transmits motion outside the package via a piston, which moves through a small clearance. The second issue addressed is the reduction in efficiency of the thermal actuator in liquids. By coating the packaged actuator with a thin conformal hydrophobic layer via an atomic layer deposition (ALD) process, the liquid is prevented from entering the encapsulation. This avoids direct contact between the actuator and the surrounding liquid thereby improving its efficiency. The unpackaged and packaged actuators were tested in both air and de-ionized water. Although the packaging resulted in a reduction in the performance of the thermal actuator in air, the actuation efficiency in water was significantly improved due to the isolation of the hot arms from the liquid. This packaging technique is also applicable to other MEMS devices and in-plane actuators such as electrostatic comb drives for engineering as well as biological applications.

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