scholarly journals A Versatile Silicon-Silicon Nitride Photonics Platform for Enhanced Functionalities and Applications

2019 ◽  
Vol 9 (2) ◽  
pp. 255 ◽  
Author(s):  
Quentin Wilmart ◽  
Houssein El Dirani ◽  
Nicola Tyler ◽  
Daivid Fowler ◽  
Stéphane Malhouitre ◽  
...  

Silicon photonics is one of the most prominent technology platforms for integrated photonics and can support a wide variety of applications. As we move towards a mature industrial core technology, we present the integration of silicon nitride (SiN) material to extend the capabilities of our silicon photonics platform. Depending on the application being targeted, we have developed several integration strategies for the incorporation of SiN. We present these processes, as well as key components for dedicated applications. In particular, we present the use of SiN for athermal multiplexing in optical transceivers for datacom applications, the nonlinear generation of frequency combs in SiN micro-resonators for ultra-high data rate transmission, spectroscopy or metrology applications and the use of SiN to realize optical phased arrays in the 800–1000 nm wavelength range for Light Detection And Ranging (LIDAR) applications. These functionalities are demonstrated using a 200 mm complementary metal-oxide-semiconductor (CMOS)-compatible pilot line, showing the versatility and scalability of the Si-SiN platform.

2019 ◽  
Author(s):  
A. Marinins ◽  
S.P. Dwivedi ◽  
J.Ø. Kjellman ◽  
S. Kerman ◽  
T. David ◽  
...  

ISRN Optics ◽  
2012 ◽  
Vol 2012 ◽  
pp. 1-27 ◽  
Author(s):  
Zhou Fang ◽  
Ce Zhou Zhao

With the increasing bandwidth requirement in computing and signal processing, the inherent limitations in metallic interconnection are seriously threatening the future of traditional IC industry. Silicon photonics can provide a low-cost approach to overcome the bottleneck of the high data rate transmission by replacing the original electronic integrated circuits with photonic integrated circuits. Although the commercial promise has not been realized, this perspective gives huge impetus to the development of silicon photonics these years. This paper provides an overview of the progress and the state of the art of each component in silicon photonics, including waveguides, filters, modulators, detectors, and lasers, mainly in the last five years.


2020 ◽  
Vol 59 (SG) ◽  
pp. SGGE02
Author(s):  
Aleksandrs Marinins ◽  
Sarvagya P. Dwivedi ◽  
Jon Ø. Kjellman ◽  
Sarp Kerman ◽  
Tangla David ◽  
...  

2011 ◽  
Vol 171 ◽  
pp. 1-17 ◽  
Author(s):  
Sarab Preet Singh ◽  
Pankaj Srivastava

There has been a rapidly increasing interest in the synthesis and characterization of Si- nanostructures embedded in a dielectric matrix, as it can lead to energy-efficient and cost-effective Complementary Metal-Oxide-Semiconductor (CMOS)-compatible Si-based light sources for optoelectronic integration. In the present contribution, first an overview of the SiOx as a dielectric matrix and its limitations are discussed. We then review the literature on hydrogenated amorphous silicon nitride (a-SiNx:H) as a dielectric matrix for Si-nanostructures, which have been carried out using silane (SiH4) and ammonia (NH3) as the reactant gases. Our studies demonstrate that the least amount of hydrogen in the as-deposited (ASD) a-SiNx:H films not only allows in-situ formation of Si-nanostructures but also stabilizes silicon nitride (Si3N4) phase. The recent advances made in controlling the shape and size of Si-nanostructures embedded in a-SiNx:H matrix by swift heavy ion (SHI) irradiation are briefly discussed.


1999 ◽  
Vol 592 ◽  
Author(s):  
Sanjit Singh Dang ◽  
Christos G. Takoudis

ABSTRACTUltra-thin silicon nitride films are being studied for use as high-dielectric constant (highk) materials in future gate dielectric applications, as Complementary Metal-Oxide-Semiconductor (CMOS) transistors are scaled down to the sub-100nm regime. In this study, process modifications are proposed to reduce the total charge and interface trap densities in sub-3.5 nm-thick silicon nitride films, grown in NH3, in a conventional furnace at 900°C and 1 atm. It is shown that by employing a short (<1 min) oxynitridation step in NO, before nitridation, and oxynitridation/Ar-annealing steps, after nitridation, silicon nitride films can be thermally grown with a total charge density as low as about 2.5E10 q/cm2 and an interface trap density of about 2.1E11/(eV-cm2). Besides, the effect of using NO as opposed to N2O for oxynitridation steps is also discussed.


Sign in / Sign up

Export Citation Format

Share Document