scholarly journals An Analysis of 3D Steganography Techniques

Electronics ◽  
2021 ◽  
Vol 10 (19) ◽  
pp. 2357
Author(s):  
Rohit Tanwar ◽  
Urmila Pilania ◽  
Mazdak Zamani ◽  
Azizah Abdul Manaf

Steganography has become a preferred technique these days to successfully hide secret messages. Various research has been done in the past to justify and analyze suitable types of cover file, such as images, audio, videos, etc. Advancement in the image-processing domain has opened various possibilities of using three-dimensional (3D) images as cover files. In this paper, a systematic study of the research work done on 3D steganography in the last fifteen years has been carried out. The study is divided into different sections based on the types of algorithms used, additional security features, evaluation parameters, etc. Moreover, certain steganalysis techniques that are applicable for 3D steganography are also discussed.

2021 ◽  
Vol 14 (4) ◽  
pp. 1-20
Author(s):  
Dzemila Sero ◽  
Isabelle Garachon ◽  
Erma Hermens ◽  
Robert Van Liere ◽  
Kees Joost Batenburg

Fingerprints play a central role in any field where person identification is required. In forensics and biometrics, three-dimensional fingerprint-based imaging technologies, and corresponding recognition methods, have been vastly investigated. In cultural heritage, preliminary studies provide evidence that the three-dimensional impressions left on objects from the past (ancient fingerprints) are of paramount relevance to understand the socio-cultural systems of former societies, to possibly identify a single producer of multiple potteries, and to authenticate the artist of a sculpture. These findings suggest that the study of ancient fingerprints can be further investigated and open new avenues of research. However, the potential for capturing and analyzing ancient fingerprints is still largely unexplored in the context of cultural heritage research. In fact, most of the existing studies have focused on plane fingerprint representations and commercial software for image processing. Our aim is to outline the opportunities and challenges of digital fingerprint recognition in answering a range of questions in cultural heritage research. Therefore, we summarize the fingerprint-based imaging technologies, reconstruction methods, and analyses used in biometrics that could be beneficial to the study of ancient fingerprints in cultural heritage. In addition, we analyze the works conducted on ancient fingerprints from potteries and ceramic/fired clay sculptures. We conclude with a discussion on the open challenges and future works that could initiate novel strategies for ancient fingerprint acquisition, digitization, and processing within the cultural heritage community.


2020 ◽  
Vol 10 (19) ◽  
pp. 6828
Author(s):  
Malte Misol

This work deals with the reduction of aircraft interior noise using active sidewall panels (linings). Research work done in the past showed that considerable reductions of the sound pressure level (SPL) in the cabin are possible using structural actuators mounted on the lining and error microphones distributed in front of the linings. However, microphones are undesirable for error sensing because they are not suitable for the realisation of an integrated and autonomous active lining (smart lining module). Therefore, the goal of the present work is the replacement of the microphones by structural sensors. Using the structural sensors as remote sensors in combination with an acoustic filter, virtual microphones can be defined. The present study relies on experimental data of a double-walled fuselage system which is mounted in a sound transmission loss facility. Simulation results based on measured time data and identified frequency response functions are provided. Different configurations of virtual microphones are investigated regarding the SPL reduction and the induced vibration of the lining panel.


Alzheimer's disease (AD) is a degenerative brain disease, a common health problem in elderly pesople which causes decline in memory and affected on nerve cells. AD has different stages like mild congestive impairment (MIC) (early stage), moderate (middle stage), severe (late stage) it is essential to detect AD early in MIC, so that pre-emptive measures can be taken. Significant research was carried out over the past century to diagnose and detect this disease early. The objective of the article is provide a review evaluation and critical analysis of the recent research work done to early diagnosis of AD using Machine Learning Strategies.


MAUSAM ◽  
2021 ◽  
Vol 10 (1) ◽  
pp. 67-68
Author(s):  
B. LYAKHOV

In the past period the research work under-taken arcording to the programme of the International Geophysical Year has yielded its first results.


2019 ◽  
Vol 8 (1) ◽  
pp. 6
Author(s):  
Georgi Nikolov Georgiev

The research of historical heritage is related to creation, storage and distribution of visual information about them. With the development of digital technologies, the three-dimensional scanning and visual regeneration of buildings of cultural heritage combined with 3D virtual reconstruction is becoming increasingly important tool for understanding and reconstructing the past. Instead of expensive laser scanning, cheaper photogrammetric methods for creating and processing of spatial (3D) images of historical and architectural monuments are finding a growing application. The article analyses the opportunities for use of different ICT tools, including inexpensive digital imaging options for preservation and exhibiting of large and diverse Bulgarian cultural heritage.


Author(s):  
Joachim Frank

The technique of three-dimensional imaging with the transmission electron microscope is a new tool ready to be used by the cell biologist. By itself, the transmission microscope is not capable of producing 3D images, but it allows collection of a tilt series of projections in a wide angular range. From such a series, a 3D image can be reconstructed using established mathematical principles. The first reconstructions of this kind were obtained by Walter Hoppe’s group in 1974, but the full potential of this approach was not realized until the mid-80’s when computers with sufficient speed and memory became available.Especially within the past three years, there has been a rapid development in the areas of instrumentation, computation, and visualization. New tilt stages meet the demands of high accuracy and wide angular coverage. Direct image readout systems and on-line control of the microscope make it possible to design automated data collection systems.


2011 ◽  
Vol 133 (4) ◽  
Author(s):  
Vikram Venkatadri ◽  
Bahgat Sammakia ◽  
Krishnaswami Srihari ◽  
Daryl Santos

Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power and design flexibilities. The main enabler of 3D integration is through-silicon-vias (TSVs) and stacking of multiple dies. Irrespective of these advantages, thermal management in 3D stacks poses significant challenges for the implementation of 3D integrated circuits. Even though extensive research work has been done in understanding the thermal management in two dimensional (2D) planar circuits for the past several decades, 3D integration offers a new set of challenges in terms of thermal management, which makes it difficult to readily apply the thermal management strategies available for 2D planar circuits. Over the past decade, some work has been done in thermal analysis and management of 3D stacks but still, knowledge is scattered and a comprehensive understanding is lacking. This research work focuses on bringing together the limited work on thermal analysis and thermal management in 3D vertically integrated circuits available in the literature. A compilation and analysis of the results from investigations on thermal management in 3D stacks is presented in this review with special emphasis on experimental studies conducted on different thermal management strategies. Furthermore, 3D integration technologies, thermal management challenges, and advanced 2D thermal management solutions are discussed.


Author(s):  
Jerome J. Paulin

Within the past decade it has become apparent that HVEM offers the biologist a means to explore the three-dimensional structure of cells and/or organelles. Stereo-imaging of thick sections (e.g. 0.25-10 μm) not only reveals anatomical features of cellular components, but also reduces errors of interpretation associated with overlap of structures seen in thick sections. Concomitant with stereo-imaging techniques conventional serial Sectioning methods developed with thin sections have been adopted to serial thick sections (≥ 0.25 μm). Three-dimensional reconstructions of the chondriome of several species of trypanosomatid flagellates have been made from tracings of mitochondrial profiles on cellulose acetate sheets. The sheets are flooded with acetone, gluing them together, and the model sawed from the composite and redrawn.The extensive mitochondrial reticulum can be seen in consecutive thick sections of (0.25 μm thick) Crithidia fasciculata (Figs. 1-2). Profiles of the mitochondrion are distinguishable from the anterior apex of the cell (small arrow, Fig. 1) to the posterior pole (small arrow, Fig. 2).


Author(s):  
John C. Russ

Three-dimensional (3D) images consisting of arrays of voxels can now be routinely obtained from several different types of microscopes. These include both the transmission and emission modes of the confocal scanning laser microscope (but not its most common reflection mode), the secondary ion mass spectrometer, and computed tomography using electrons, X-rays or other signals. Compared to the traditional use of serial sectioning (which includes sequential polishing of hard materials), these newer techniques eliminate difficulties of alignment of slices, and maintain uniform resolution in the depth direction. However, the resolution in the z-direction may be different from that within each image plane, which makes the voxels non-cubic and creates some difficulties for subsequent analysis.


Author(s):  
Weiping Liu ◽  
John W. Sedat ◽  
David A. Agard

Any real world object is three-dimensional. The principle of tomography, which reconstructs the 3-D structure of an object from its 2-D projections of different view angles has found application in many disciplines. Electron Microscopic (EM) tomography on non-ordered structures (e.g., subcellular structures in biology and non-crystalline structures in material science) has been exercised sporadically in the last twenty years or so. As vital as is the 3-D structural information and with no existing alternative 3-D imaging technique to compete in its high resolution range, the technique to date remains the kingdom of a brave few. Its tedious tasks have been preventing it from being a routine tool. One keyword in promoting its popularity is automation: The data collection has been automated in our lab, which can routinely yield a data set of over 100 projections in the matter of a few hours. Now the image processing part is also automated. Such automations finish the job easier, faster and better.


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