scholarly journals Low Temperature Cu/Ga Solid–Liquid Inter-Diffusion Bonding Used for Interfacial Heat Transfer in High-Power Devices

Metals ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 1223
Author(s):  
Guoqian Mu ◽  
Wenqing Qu ◽  
Haiyun Zhu ◽  
Hongshou Zhuang ◽  
Yanhua Zhang
Keyword(s):  
Heat Transfer ◽  
Low Temperature ◽  
High Power ◽  
Diffusion Bonding ◽  
Wire Mesh ◽  
High Heat Flux ◽  
Interfacial Heat Transfer ◽  
Power Devices ◽  
Average Shear Strength ◽  
Solid Liquid

Interfacial heat transfer is essential for the development of high-power devices with high heat flux. The metallurgical bonding of Cu substrates is successfully realized by using a self-made interlayer at 10 °C, without any flux, by Cu/Ga solid-liquid inter-diffusion bonding (SLID), which can be used for the joining of heat sinks and power devices. The microstructure and properties of the joints were investigated, and the mechanism of Cu/Ga SLID bonding was discussed. The results show that the average shear strength of the joints is 7.9 MPa, the heat-resistant temperature is 200 °C, and the thermal contact conductance is 83,541 W/(m2·K) with a holding time of 30 h at the bonding temperature of 100 °C. The fracture occurs on one side of the copper wire mesh which is caused by the residual gallium. The microstructure is mainly composed of uniform θ-CuGa2 phase, in addition to a small amount of residual copper, residual gallium and γ3-Cu9Ga4 phase. The interaction product of Cu and Ga is mainly θ-CuGa2 phase, with only a small amount of γ3-Cu9Ga4 phase occurring at the temperature of 100 °C for 20 h. The process of Cu/Ga SLID bonding can be divided into three stages as follows: the pressurization stage, the reaction diffusion stage and the isothermal solidification stage. This technology can meet our requirements of low temperature bonding, high reliability service and interfacial heat transfer enhancement.

Flow Boiling Enhancement in Microchannels With Diffusion Bonded Wire Mesh

2007 ◽  
Author(s):  
Hailei Wang ◽  
Richard Peterson
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
Wire Mesh ◽  
Working Fluid ◽  
High Heat Flux ◽  
Vapor Quality ◽  
Heating Wall

Flow boiling and heat transfer enhancement in four parallel microchannels using a dielectric working fluid, HFE 7000, was investigated. Each channel was 1000 μm wide and 510 μm high. A unique channel surface enhancement technique via diffusion bonding a layer of conductive fine wire mesh onto the heating wall was developed. According to the obtained flow boiling curves for both the bare and mesh channels, the amount of wall superheat was significantly reduced for the mesh channel at all stream-wise locations. This indicated that the nucleate boiling in the mesh channel was enhanced due to the increase of nucleation sites the mesh introduced. Both the nucleate boiling dominated and convective evaporation dominated regimes were identified. In addition, the overall trend for the flow boiling heat transfer coefficient, with respect to vapor quality, was increasing until the vapor quality reached approximately 0.4. The critical heat flux (CHF) for the mesh channel was also significantly higher than that of the bare channel in the low vapor quality region. Due to the fact of how the mesh was incorporated into the channels, no pressure drop penalty was identified for the mesh channels. Potential applications for this kind of mesh channel include high heat-flux electronic cooling systems and various energy conversion systems.

Low Temperature and Short Time Au/Sn Solid-liquid Diffusion Bonding for 3D Integration

2021 ◽  
Author(s):  
Ziyu Liu ◽  
Wang Wenchao ◽  
Zhu Zhiyuan ◽  
Chen Lin ◽  
Sun Qingqing
Keyword(s):  
Low Temperature ◽  
Diffusion Bonding ◽  
3D Integration ◽  
Liquid Diffusion ◽  
Short Time ◽  
Solid Liquid

Numerical Study of Evaporation Heat Transfer From the Liquid-Vapor Interface in Wick Microstructures

2009 ◽  
Author(s):  
Ram Ranjan ◽  
Jayathi Y. Murthy ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Numerical Study ◽  
Saturated Vapor ◽  
Wire Mesh ◽  
Liquid Meniscus ◽  
Vapor Interface ◽  
Evaporation Heat ◽  
Evaporation Heat Transfer ◽  
Solid Liquid ◽  
Liquid Vapor

A numerical model of the evaporating liquid meniscus under saturated vapor conditions in wick microstructures has been developed. Four different wick geometries representing the common wicks used in heat pipes, viz., wire mesh, rectangular grooves, sintered wicks and vertical microwires, are modeled and compared for evaporative performance. The solid-liquid combination considered is copper-water. Steady evaporation is modeled and the liquid-vapor interface shape is assumed to be static during evaporation. Liquid-vapor interface shapes in different geometries are obtained by solving the Young-Laplace equation using Surface Evolver. Mass, momentum and energy equations are solved numerically in the liquid domain, with the vapor assumed to be saturated. Evaporation at the interface is modeled by using appropriate heat and mass transfer rates obtained from kinetic theory. Thermo-capillary convection due to non-isothermal conditions at the interface is modeled for all geometries and its role in heat transfer enhancement from the interface is quantified for both low and high superheats. More than 80% of the evaporation heat transfer is noted to occur from the thin-film region of the liquid meniscus. Very small Capillary and Weber numbers arising due to small fluid velocities near the interface for low superheats validate the assumption of static liquid meniscus shape during evaporation. Solid-liquid contact angle, wick porosity, solid-vapor superheat and liquid level in the wick pore are varied to study their effects on evaporation from the liquid meniscus.

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