scholarly journals Encapsulation of Cinnamic Acid on Plant-Based Proteins: Evaluation by HPLC, DSC and FTIR-ATR

Plants ◽  
2021 ◽  
Vol 10 (10) ◽  
pp. 2158
Author(s):  
Mirela Kopjar ◽  
Ivana Buljeta ◽  
Ivana Jelić ◽  
Vanja Kelemen ◽  
Josip Šimunović ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Ir Spectra ◽  
Cinnamic Acid ◽  
The Other ◽  
Dsc Analysis ◽  
Protein Matrix ◽  
Potential Applications ◽  
Opposite Behavior ◽  
Protein Matrices ◽  
Thermal Stability Of

Plant-based protein matrices can be used for the formulation of delivery systems of cinnamic acid. Pumpkin, pea and almond protein matrices were used for the formulation of dried complexes. The matrices were used in varying amounts (1%, 2%, 5% and 10%) whilst the amount of cinnamic acid was maintained constant. The obtained complexes were analyzed by HPLC, DSC and FTIR-ATR. The highest amounts of cinnamic acid were determined on complexes prepared by the lowest amounts of protein matrices, regardless of their type. The highest affinity for cinnamic acid adsorption was determined for the pumpkin protein matrix. DSC analysis revealed that adsorption of cinnamic acid caused an increase in the thermal stability of the almond protein matrix, while the other two matrices had the opposite behavior. The complexation of protein matrices and cinnamic acid was proven by recording the IR spectra. The obtained complexes could have potential applications in food products to achieve enrichment with cinnamic acid as well as proteins.

scholarly journals Extraordinary thermal behavior of graphene oxide in air for electrode applications

2021 ◽  
Author(s):  
Joong Tark Han ◽  
Joon Young Cho ◽  
Jeong Hoon Kim
Keyword(s):  
Thermal Stability ◽  
Graphene Oxide ◽  
Physical Properties ◽  
Thermal Behavior ◽  
Stability Of Solution ◽  
Exfoliated Graphene ◽  
Potential Applications ◽  
Thermal Stability Of

The thermal stability of solution-exfoliated graphene oxide (GO) in air is one of the most important physical properties influencing its potential applications. To date, majority of the GO prepared by...

Toxic properties of Aeromonas proteolytica

1974 ◽  
Vol 20 (10) ◽  
pp. 1403-1409 ◽  
Author(s):  
B. G. Foster ◽  
Mary O. Hanna
Keyword(s):  
Thermal Stability ◽  
Culture Filtrate ◽  
Hemolytic Activity ◽  
Optimal Growth ◽  
Growth Conditions ◽  
The Other ◽  
Activity Peak ◽  
Endopeptidase Activity ◽  
Time Periods ◽  
Thermal Stability Of

Aeromonas proteolytica was grown for various time periods in nutrient broth, tryptic soy broth, a semisynthetic medium, and 1 and 5% peptone under different conditions involving temperature and in continuous shake and stationary flasks. The cell-free culture filtrates were tested for hemolytic, endopeptidase, and dermonecrotic activity and optimal growth conditions for their production were determined. The dermonecrotic activity and endopeptidase activity was found to be parallel in all tests, while hemolysin was independent of the other two. Studies on the thermal stability of the culture filtrate revealed that hemolysin and dermonecrotic and endopeptidase activity were destroyed at 70 °C for 30 min. Fractionation of the filtrate by Sephadex G-200 resolved three peaks at 280 nm. Peak I was inactive; peak II contained endopeptidase and dermonecrotic and hemolytic activity; peak III contained pigment and hemolysin. Evidence is presented that the endopeptidase and dermonecrotic substance found in the cell-free filtrates of A. proteolytica grown medium appear at the same time and thus may be the same entity.

Dependence of Vickers Hardness on Annealing Temperature at Co/Cu Multilayered Films

2007 ◽  
Vol 561-565 ◽  
pp. 2399-2402
Author(s):  
Yoshihisa Kaneko ◽  
H. Sakakibara ◽  
Satoshi Hashimoto
Keyword(s):  
Thermal Stability ◽  
Vickers Hardness ◽  
Room Temperature ◽  
Annealing Temperature ◽  
Copper Substrate ◽  
The Other ◽  
Multilayered Structures ◽  
Multilayered Films ◽  
Hardness Tests ◽  
Thermal Stability Of

Co/Cu and Ni/Cu multilayers fabricated by electroplating technique were annealed at various temperatures in order to investigate thermal stability of multilayered structures. Vickers hardness tests on the annealed Co/Cu and Ni/Cu multilayers were conducted at room temperature. It was recognized that after the annealing at 1023K the Co/Cu multilayer still maintained the hardness of as-deposited state. On the other hand, the hardness of Ni/Cu multilayer was almost identical to copper substrate after the annealing at 903K.

Ion Induced Mixing of AlGaAs/GaAs Superlattices

1987 ◽  
Vol 93 ◽  
Author(s):  
T. Venkatesan ◽  
S. A. Schwarz ◽  
P. Mei ◽  
H. W. Yoon
Keyword(s):  
Thermal Stability ◽  
Process Parameters ◽  
Alloy Composition ◽  
Device Fabrication ◽  
Crystalline Quality ◽  
Good Crystalline Quality ◽  
Potential Applications ◽  
Mixed Layers ◽  
High Degree ◽  
Thermal Stability Of

ABSTRACTSubsequent to the implantation of certain ions, the thermal stability of AlGaAs/GaAs superlattices can be reduced, enabling mixing of the layers at temperatures where they would otherwise be stable. The mixed layers have intermediate alloy composition and are of good crystalline quality. As a result this process is of great value in device fabrication where a high degree of vertical and lateral bandgap control is desirable. This paper reviews our work in understanding the mechanism of diffusion, its dependence on varilous process parameters, and potential applications in device fabrication.

Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization

2007 ◽  
Vol 539-543 ◽  
pp. 3497-3502 ◽  
Author(s):  
J.P. Chu ◽  
C.H. Lin
Keyword(s):  
Thermal Stability ◽  
Leakage Current ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
The Other ◽  
Oxide Semiconductor ◽  
Good Thermal Stability ◽  
Cu Films ◽  
Pure Cu ◽  
Thermal Stability Of

Sputtered Cu films containing various insoluble substances, such as Cu(W2.3), Cu(Mo2.0), Cu(Nb0.4), Cu(C2.1) and Cu(W0.4C0.7), are examined in this study. These films are prepared by magnetron sputtering, followed by thermal annealing. The crystal structure, microstructure, SIMS depth-profiles, leakage current, and resistivity of the films are investigated. Good thermal stability of these Cu films is confirmed with focused ion beam, X-ray diffractometry, SIMS, and electrical property measurements. After annealing at 400°C, obvious drops in resistivity, to ~3.8 μ-cm, are seen for Cu(W) film, which is lower than the other films. An evaluation of the leakage current characteristic from the SiO2/Si metal-oxide-semiconductor (MOS) structure also demonstrates that Cu with dilute tungsten is more stable than the other films studied. These results further indicate that the Cu(W) film has more thermal stability than the Cu(Mo), Cu(Nb), Cu(C), Cu(WC) and pure Cu films. Therefore, the film is suitable for the future barrierless metallization.

Diamondlike Carbon Materials as Low-k Dielectrics for Multilevel Interconnects in Ulsi

1996 ◽  
Vol 443 ◽  
Author(s):  
A. Grill ◽  
V. Patel ◽  
K.L. Saenger ◽  
C. Jahnes ◽  
S.A. Cohen ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Constants ◽  
Internal Stresses ◽  
Diamondlike Carbon ◽  
Potential Applications ◽  
Etch Stop ◽  
Si Content ◽  
Low K ◽  
Thermal Stability Of

AbstractA variety of diamondlike carbon (DLC) materials were investigated for their potential applications as low-k dielectrics for the back end of the line (BEOL) interconnect structures in ULSI circuits. Hydrogenated DLC and fluorine containing DLC (FDLC) were studied as a low-k interlevel and intralevel dielectrics (ILD), while silicon containing DLC (SiDLC) was studied as a potential low-k etch stop material between adjacent DLC based ILD layers, which can be patterned by oxygen-based plasma etchingIt was found that the dielectric constant (k) of the DLC films can be varied between >3.3 and 2.7 by changing the deposition conditions. The thermal stability of these DLC films was found to be correlated to the values of the dielectric constant, decreasing with decreasing k. While DLC films having dielectric constants k>3.3 appeared to be stable to anneals of 4 hours at 400 °C in He, a film having a dielectric constant of 2.7 was not, losing more than half of its thickness upon exposure to the same anneal. The stresses in the DLC films were found to decrease with decreasing dielectric constant, from 700 MPa to about 250 MPa. FDLC films characterized by a dielectric constant of about 2.8 were found to have similar thermal stability as DLC films with k >3.3. The thermally stable FDLC films have internal stresses <300 MPa and are thus promising candidates as a low-k ILD.For the range of Si contents examined (0-9% C replacement by Si), SiDLC films with a Si content of around 5% appear to provide an effective etch-stop for oxygen RIE of DLC or FDLC films, while retaining desirable electrical characteristics. These films showed a steady state DLC/SiDLC etch rate ratio of about 17, and a dielectric constant only about 30% higher than the 3.3 of DLC.

Thermal Stability of PALF-PP and PALF-PLA for Natural Fiber Honeycomb Core Materials

2021 ◽  
Vol 87 (1) ◽  
pp. 20-29
Author(s):  
Amira Syuhada Zainudin ◽  
Abdul Rahim Othman
Keyword(s):  
Thermal Stability ◽  
Natural Fiber ◽  
Thermal Characteristic ◽  
Inert Atmosphere ◽  
Filler Loading ◽  
Differential Scanning Calorimetric ◽  
Dsc Analysis ◽  
Honeycomb Core ◽  
Nitrogen Gas ◽  
Thermal Stability Of

This paper studied the thermal behaviour of pineapple leaf fiber (PALF) reinforced with polypropylene (PP) and polylactic acid (PLA) composite, used for natural fiber honeycomb core. Thermogravimetric analysis (TGA) and differential scanning calorimetric (DSC) analysis were used to measure the thermal characteristic of PALF-PP/PLA composites. In particular, the TGA analysis was utilized to measure the degradation and decomposition of materials in different composition (NF-PP/PLA (0%, 15%, 30% and 50%). The measurements were carried out in the temperature of 0oC- 900oC, at a heating rate of 10oCmin-1 and under an inert atmosphere (nitrogen gas). The temperature of DSC analysis was programmed to between 25oC- 500oC. The result shows the thermal stability of PALF-PP/PLA decreased as the PALF filler-loading increased. While from the DSC analysis this study clearly shows in the graph plot, the sample have glass transition temperature, crystallization and melting temperature. So that means the sample in this study is crystalline and amorphous domains.

Laddersiloxanes: Silsesquioxanes with Defined Ladder Structure

2007 ◽  
Vol 1007 ◽  
Author(s):  
Masafumi Unno
Keyword(s):  
Thermal Stability ◽  
Ir Spectra ◽  
Crystal Structures ◽  
Ladder Structure ◽  
X Ray ◽  
Stepwise Procedure ◽  
Thermal Stability Of

ABSTRACTA series of structurally-defined laddersiloxanes [1] are presented. Pentacyclic laddersiloxanes were prepared by a stepwise procedure from all-cis-tetraisopropylcyclotetrasiloxanetetraol. All-anti pentacyclic, tetracyclic, tricyclic, and bicyclic laddersiloxanes were obtained by oxidation from respecting all-anti pentacyclic ladder polysilane. Stereocontrolled approach using RS-disiloxanediol as an expanding unit enabled the synthesis of longer laddersiloxanes. Finally, methyl-substituted ladder polysilsesquioxane was obtained by the stepwise transformation from (MePhSiO) 4. The X-ray crystal structures, NMR and IR spectra, and thermal stability of these laddersiloxanes are summarized.

Thermal Stability of Rapidly Quenched TI-NI-AL Amorphous Alloys

1985 ◽  
Vol 58 ◽  
Author(s):  
K. Aoki ◽  
K. Hiraga ◽  
T. Masumoto
Keyword(s):  
Thermal Stability ◽  
Amorphous Phase ◽  
Amorphous Alloys ◽  
Melt Spinning ◽  
Composition Range ◽  
Amorphous Matrix ◽  
Al Alloys ◽  
The Other ◽  
Molten State ◽  
Thermal Stability Of

ABSTRACTTi-Ni-Al alloys were rapidly quenched from a molten state by the melt spinning method. Three kinds of metastable phases, namely, amorphous,nonequilibrium and quasicrystalline phases are formed in these alloys. The amorphous phase is formed in the range of 35 to 70 at% Ti and 0 to 25 at% Al. The nonequilibrium phases are formed in the composition range of 25 to 33 at% Ti. On the other hand, fine quasicrystalline phases are distributed in the amorphous matrix of the Ti-rich alloys. Crystallization temperatures and the hardness of the amorphous alloys were also examined.

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