scholarly journals Urea Formaldehyde Resin Resultant Plywood with Rapid Formaldehyde Release Modified by Tunnel-Structured Sepiolite

Polymers ◽  
2019 ◽  
Vol 11 (8) ◽  
pp. 1286 ◽  
Author(s):  
Li ◽  
Gao ◽  
Xia ◽  
Li ◽  
Zhou
Keyword(s):  
Shear Strength ◽  
Fracture Surface ◽  
Cross Section ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Formaldehyde Resin ◽  
Tunnel Structure ◽  
Formaldehyde Release ◽  
Uf Resin ◽  
The Cost

In order to reduce the cost of plywood and save edible resources (wheat flour), a cheap and resourceful clay, sepiolite, was used to modify urea formaldehyde (UF) resin. The performances of filler-filled UF resins were characterized by measuring the thermal behavior, cross section, and functional groups. Results showed that cured UF resin with SEP (sepiolite) formed a toughened fracture surface, and the wet shear strength of the resultant plywood was maximum improved by 31.4%. The tunnel structure of SEP was beneficial to the releasing of formaldehyde, as a result, the formaldehyde emission of the plywood bonded by UF resin with SEP declined by 43.7% compared to that without SEP. This study provided a new idea to reduce the formaldehyde emission, i.e. accelerating formaldehyde release before the product is put into use.

The Impact of Different Dosage of Additives on the UF Resin Used in Plywood

2011 ◽  
Vol 197-198 ◽  
pp. 147-150 ◽  
Author(s):  
Wei Wang ◽  
Li Bin Zhu ◽  
Ji You Gu ◽  
Xiang Li Weng ◽  
Hai Yan Tan
Keyword(s):  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Urea Formaldehyde Resin ◽  
Formaldehyde Resin ◽  
Synthetic Process ◽  
Resin Adhesive ◽  
Environmental Friendly ◽  
Uf Resin ◽  
Comprehensive Performance ◽  
The Impact

Through the study of the effects of different dosage of additives on the properties of urea formaldehyde resin adhesive prepared at low mole ratio of formaldehyde/urea, optimize the synthetic process of the UF resin which is used at the E0 grade plywood. The results showed that the product synthesized under the following condition: the mole ratio of formaldehyde/urea is 0.99:1, the dosage of the specific additive is 1.0% and that of melamine is 3-4%, had a good comprehensive performance and the formaldehyde emission of the plywood meets the E0 grade which is environmental-friendly.

scholarly journals Reduction of formaldehyde emission from urea-formaldehyde resin with a small quantity of graphene oxide

RSC Advances ◽  
2021 ◽  
Vol 11 (52) ◽  
pp. 32830-32836
Author(s):  
Kazuki Saito ◽  
Yasushi Hirabayashi ◽  
Shinya Yamanaka
Keyword(s):  
Graphene Oxide ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Urea Formaldehyde Resin ◽  
Formaldehyde Resin ◽  
Uf Resin

This is the first experiment to demonstrate that GO effectively prevents formaldehyde emission from UF resin.

Performances of Modified Urea-Formaldehyde Resins for Bonding Plywood

2011 ◽  
Vol 71-78 ◽  
pp. 3170-3173
Author(s):  
Ji Zhi Zhang ◽  
Xiao Ying Liu ◽  
Ying Ying Qiu ◽  
Xiao Mei Wang ◽  
Jian Zhang Li ◽  
...  
Keyword(s):  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Exothermic Peak ◽  
Urea Formaldehyde Resin ◽  
Molar Ratio ◽  
Formaldehyde Resin ◽  
Formaldehyde Content ◽  
Uf Resin ◽  
Dta Curve ◽  
Modified Urea

Urea-formaldehyde resin was modified by a modifier with different synthetic processes labelled as UFM1, UFM2, and UFM3 respectively. As a comparison, normal UF resin with a F/U molar ratio of 1.1 labelled as UF0 was synthesized. The thermal behavior of modified urea-formaldehyde resins was studied by TG-DTA techniques, and the properties of plywood bonded with the UFM resins were investigated. The conclusions were as follows: (1) the modifier used in this study could significantly reduce the free formaldehyde content of urea-formaldehyde resin and the formaldehyde emission of plywood; (2) The exothermic peak temperatures of DTA curve were 129.37, 125.05, 120.98, and 116.11 °C for UF0, UFM1, UFM2, and UFM3 respectively. (3) The plywood manufactured with UFM2 and UFM3 resins have high bonding strength (1.28MPa and 1.59MPa) and low formaldehyde emission value (E1 grade).

The Utilization of Phenol Components in Bio-Oil for Modifying Urea-Formaldehyde Resin Adhesive

2015 ◽  
Vol 1096 ◽  
pp. 209-213
Author(s):  
Yi Cheng ◽  
Qi Kui Tian ◽  
Rui Li
Keyword(s):  
Reaction Mechanism ◽  
Organic Acid ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Solid Content ◽  
Formaldehyde Resin ◽  
Uf Resin ◽  
Bio Oil ◽  
Ft Ir ◽  
Addition Amount

The components in bio-oil are mainly concluding organic acid, aldehydes and phenolics. As the irregular cracking of the pyrolysis, the products are complex and difficult to separate. A comprehensive concept was presented and the extractions from bio-oil were used for modifying urea-formaldehyde (UF) resin in this study. Characterization by FT-IR and GC-MS indicated that the reaction mechanism. Phenol-oil addition amount and particle boards test were investigated resulted those 10% phenol-oil shows the best properties: viscosity of 73.36 mm/s, solid content of 52.25% and pH of 8.35 and the best pressing condition is 125°C for 5min which produce a 1.23MPa bond strengthen and 1.05 mg/L formaldehyde emission plywood.

scholarly journals Cellulose sludge and wood bark as formaldehyde scavengers for plywood bonded with urea formaldehyde resin

2017 ◽  
Vol 6 (4) ◽  
pp. 187-193
Author(s):  
Смидракова ◽  
Mariya Smidrakova ◽  
Седлячик ◽  
Yan Sedlyachek
Keyword(s):  
Shear Strength ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Adhesive Joints ◽  
Urea Formaldehyde Resin ◽  
Formaldehyde Resin ◽  
Spruce Bark ◽  
Wood Bark

The aim of the research was to modify urea-formaldehyde resin (UF) by cellulose sludge and wood bark in order to reduce formaldehyde emission. Wood bark powder was a mixture containing 50 % of beech bark and 50 % of spruce bark. Release of formaldehyde and shear strength of the adhesive joints was tested on five resp. three-layer alder plywood. Formaldehyde emission was determined by 24-hour desiccator method and monitored during seven weeks after gluing. After 7 weeks of the experiment the reference UF adhesive showed formaldehyde emission decreased by 39 %.

Preparation of Water-Resistance Plywood with UF Resin Modified by Emulsifiable Polyisocyanate

2010 ◽  
Vol 26-28 ◽  
pp. 1056-1060
Author(s):  
Li Bin Zhu ◽  
Bo Han ◽  
Ji You Gu ◽  
Yan Hua Zhang ◽  
Hai Yan Tan ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Water Resistance ◽  
Urea Formaldehyde ◽  
Great Influence ◽  
Physical And Mechanical Properties ◽  
Formaldehyde Emission ◽  
Molar Ratio ◽  
Formaldehyde Resin ◽  
X Ray ◽  
Uf Resin

The purpose of the study was to manufacture water-resistance plywood with using UF resin modified by emulsifiable polyisocyanate. The emulsifiable polyisocyanate which contains plenty of hydrophilic segments and teminal isocyanate groups were synthesized by reaction between various kinds of polyether polyols and polymeric methane dipthenyl diisocyanate (pMDI). A type of composite adhesive was obtained from the mixture of emulsifiable polyisocyanate and urea formaldehyde resin. The process parameters, such as the molar ratio of –NCO and –OH, mass fraction of emulsifiable polyisocyanate in UF resin and accessory ingredient have a great influence on the composite adhesive. X-ray photoelectron spectroscopy (XPS) had been used to analyze the chemical structure of bonding interface. The results showed that the composite adhesive consisting of UF resin and emulsifiable polyisocyanate content of 7.5% and kaolin content of 1.5% was used in plywood with high physical and mechanical properties, water resistance and low formaldehyde emission.

Modified Nanocrystalline Cellulose Used for Improving Formaldehyde Emission and Bonding Strength of Urea Formaldehyde Resin Adhesive

2013 ◽  
Vol 562-565 ◽  
pp. 846-851
Author(s):  
Hao Zhang ◽  
Ying She ◽  
Shu Ping Song ◽  
Jun Wen Pu
Keyword(s):  
Bonding Strength ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Nanocrystalline Cellulose ◽  
National Standards ◽  
Control Group ◽  
Formaldehyde Resin ◽  
Hydroxyl Groups ◽  
Resin Adhesive ◽  
Uf Resin

Nanocrystalline cellulose (NCC) was used for improving the formaldehyde (HCHO) emission and bonding strength of urea formaldehyde (UF) resin adhesive in fiberboard and plywood. The original NCC was modified by 3-aminopropyltriethoxysilane (APTES) and the wetting property with UF resin adhesive was improved by 26.4%. The UF resin adhesive with modified NCC was characterized by X-ray powder diffraction (XRD), thermogravimetric analysis (TG) and Fourier transform infrared (FT-IR). The crystal region of UF resin adhesive was influenced by NCC and the diffraction intensity of the peak at 2θ = 22.82° was enhanced significantly. The thermal stability of UF resin adhesive with 1.0% modified NCC increased by 4.9%. And modified NCC led hydroxyl groups into the UF resin adhesive. HCHO emission and bonding strength of the UF resin adhesive with modified NCC were tested according to Chinese National Standards GB/T 17657-1999 and GB/T 9846-2004. The HCHO emission of fiberboard and plywood with 1.5% modified NCC decreased by 13.0% and 53.2%, respectively. The bonding strength of fiberboard increased by 158.3% (from 0.12 MPa of control group to 0.31 MPa of fiberboard with 1.5% modified NCC), while 1.5% modified NCC led to a 23.6% increase in the plywood.

Properties of Particleboard Manufactured with Modified Urea-Formaldehyde Resin

2010 ◽  
Vol 150-151 ◽  
pp. 1135-1138
Author(s):  
Ji Zhi Zhang ◽  
Jian Zhang Li ◽  
Shi Feng Zhang
Keyword(s):  
Hot Pressing ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Modulus Of Rupture ◽  
Formaldehyde Resin ◽  
Pressing Temperature ◽  
Technical Parameters ◽  
Pressing Time ◽  
Uf Resin ◽  
Modified Urea

This study modified urea-formaldehyde (UF) resin with a modifier, and focused on properties of particleboard manufactured with the modified UF resin. The orthogonal design was used to analyze the effects of different levels of hot-pressing temperature, hot-pressing time, glue content, and waterproof agent content on the modulus of rupture (MOR), internal bonding strength (IB), and formaldehyde emission (FE) of the particleboard, and thus determined the optimum technical parameters of hot-pressing. The conclusions were as follows: (1) the modifier used in this study could significantly reduce the free formaldehyde content of UF resin and the formaldehyde emission of particleboard; (2) the optimum hot-pressing technical parameters of particleboard manufactured with the modified UF resin were hot-pressing temperature 180°C, hot-pressing time 50s/mm, glue content 12%, and waterproof agent content 0.6%. The MOR and IB under the optimum technical parameters could reach 20.7 and 0.47 MPa, and the FE was 0.85 mg/L.

scholarly journals Properties of High-Density Fiberboard Bonded with Urea–Formaldehyde Resin and Ammonium Lignosulfonate as a Bio-Based Additive

Polymers ◽  
2021 ◽  
Vol 13 (16) ◽  
pp. 2775 ◽  
Author(s):  
Petar Antov ◽  
Viktor Savov ◽  
Neno Trichkov ◽  
Ľuboš Krišťák ◽  
Roman Réh ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Bending Strength ◽  
Urea Formaldehyde ◽  
Thermal Analyses ◽  
Formaldehyde Emission ◽  
High Density ◽  
Formaldehyde Resin ◽  
Gravimetric Analysis ◽  
Wood Fibers ◽  
Uf Resin

The potential of ammonium lignosulfonate (ALS) as an eco-friendly additive to urea–formaldehyde (UF) resin for manufacturing high-density fiberboard (HDF) panels with acceptable properties and low free formaldehyde emission was investigated in this work. The HDF panels were manufactured in the laboratory with very low UF resin content (4%) and ALS addition levels varying from 4% to 8% based on the mass of the dry wood fibers. The press factor applied was 15 s·mm−1. The physical properties (water absorption and thickness swelling), mechanical properties (bending strength, modulus of elasticity, and internal bond strength), and free formaldehyde emission were evaluated in accordance with the European standards. In general, the developed HDF panels exhibited acceptable physical and mechanical properties, fulfilling the standard requirements for HDF panels for use in load-bearing applications. Markedly, the laboratory-produced panels had low free formaldehyde emission ranging from 2.0 to 1.4 mg/100 g, thus fulfilling the requirements of the E0 and super E0 emission grades and confirming the positive effect of ALS as a formaldehyde scavenger. The thermal analyses performed, i.e., differential scanning calorimetry (DSC), thermal gravimetric analysis (TGA), and derivative thermogravimetry (DTG), also confirmed the main findings of the research. It was concluded that ALS as a bio-based, formaldehyde-free adhesive can be efficiently utilized as an eco-friendly additive to UF adhesive formulations for manufacturing wood-based panels under industrial conditions.

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