scholarly journals Influence of Heat Sink on the Mold Temperature of Gypsum Mold Used in Injection Molding

Polymers ◽  
2020 ◽  
Vol 12 (3) ◽  
pp. 701
Author(s):  
Chung-Chih Lin ◽  
Kun-Chen Chen ◽  
Hon-Chih Yeh

Gypsum molds have been developed as an alternative for the Rapid tooling (RT) method used in injection molding. However, the poor capability of the heat delivery forces the gypsum mold to operate under a high-risk condition, and distortion of the molded part becomes apparent. The goal is to investigate the effect of a heat sink on the reduction of the gypsum mold temperature and to establish a methodology for the heat sink design. The methodology used the advantage of the electrical circuit concept to analyze the mold temperature. The heat transfer of a mold was modeled using an equivalent thermal circuit. After all the components on the circuit were determined, the heat transfer rate could then be calculated. Once the heat transfer rate was known, the mold temperature could be easily analyzed. A modified thermal circuit considering transverse heat conduction was also proposed, which estimated the mold temperature more accurately. The mold temperature was reduced by 16.8 °C when a gypsum mold was installed with a 40 mm thick heat sink in a parallel configuration. Moreover, the reduction of the mold temperature improved the deflection of the molded part from 0.78 mm to 0.54 mm. This work provides a quick approach to analyze the mold temperature based on the thermal circuit concept. As the cooling system of the mold was modularized analytically, important properties of the cooling system in the heat transfer process were revealed by analyzing the thermal circuit of the mold, for example, the heat transfer rate or the mold temperature.

Author(s):  
T. Povey ◽  
K. S. Chana ◽  
T. V. Jones ◽  
J. Hurrion

Pronounced non-uniformities in combustor exit flow temperature (hot-streaks), which arise because of discrete injection of fuel and dilution air jets within the combustor and because of end-wall cooling flows, affect both component life and aerodynamics. Because it is very difficult to quantitatively predict the affects of these temperature non-uniformities on the heat transfer rates, designers are forced to budget for hot-streaks in the cooling system design process. Consequently, components are designed for higher working temperatures than the mass-mean gas temperature, and this imposes a significant overall performance penalty. An inadequate cooling budget can lead to reduced component life. An improved understanding of hot-streak migration physics, or robust correlations based on reliable experimental data, would help designers minimise the overhead on cooling flow that is currently a necessity. A number of recent research projects sponsored by a range of industrial gas turbine and aero-engine manufacturers attest to the growing interest in hot-streak physics. This paper presents measurements of surface and end-wall heat transfer rate for an HP nozzle guide vane (NGV) operating as part of a full HP turbine stage in an annular transonic rotating turbine facility. Measurements were conducted with both uniform stage inlet temperature and with two non-uniform temperature profiles. The temperature profiles were non-dimensionally similar to profiles measured in an engine. A difference of one half of an NGV pitch in the circumferential (clocking) position of the hot-streak with respect to the NGV was used to investigate the affect of clocking on the vane surface and end-wall heat transfer rate. The vane surface pressure distributions, and the results of a flow-visualisation study, which are also given, are used to aid interpretation of the results. The results are compared to two-dimensional predictions conducted using two different boundary layer methods. Experiments were conducted in the Isentropic Light Piston Facility (ILPF) at QinetiQ Farnborough, a short duration engine-size turbine facility. Mach number, Reynolds number and gas-to-wall temperature ratios were correctly modelled. It is believed that the heat transfer measurements presented in this paper are the first of their kind.


2001 ◽  
Author(s):  
Jeung Sang Go ◽  
Geunbae Lim ◽  
Hayong Yun ◽  
Sung Jin Kim ◽  
Inseob Song

Abstract This paper presented design guideline of the microfin array heat sink using flow-induced vibration to increase the heat transfer rate in the laminar flow regime. Effect of the flow-induced vibration of a microfin array on heat transfer enhancement was investigated experimentally by comparing the thermal resistances of the microfin array heat sink and those of a plain-wall heat sink. At the air velocities of 4.4m/s and 5.5 m/s, an increase of 5.5% and 11.5% in the heat transfer rate was obtained, respectively. The microfin flow sensor also characterized the flow-induced vibration of the microfin. It was determined that the microfin vibrates with the fundamental natural frequency regardless of the air velocity. It was also shown that the vibrating displacement of the microfin is increased with increasing air velocity and then saturated over a certain value of air velocity. Based on the numerical analysis of the temperature distribution resulted from microfin vibration and experimental results, a simple heat transfer model (heat pumping model) was proposed to understand the heat transfer mechanism of a microfin array heat sink. Under the geometric and structural constraints, the maximum heat transfer enhancement was obtained at the intersection of the minimum thickness of the microfin and constraint of the bending angle.


2005 ◽  
Vol 129 (1) ◽  
pp. 32-43 ◽  
Author(s):  
T. Povey ◽  
K. S. Chana ◽  
T. V. Jones ◽  
J. Hurrion

Pronounced nonuniformities in combustor exit flow temperature (hot-streaks), which arise because of discrete injection of fuel and dilution air jets within the combustor and because of endwall cooling flows, affect both component life and aerodynamics. Because it is very difficult to quantitatively predict the effects of these temperature nonuniformities on the heat transfer rates, designers are forced to budget for hot-streaks in the cooling system design process. Consequently, components are designed for higher working temperatures than the mass-mean gas temperature, and this imposes a significant overall performance penalty. An inadequate cooling budget can lead to reduced component life. An improved understanding of hot-streak migration physics, or robust correlations based on reliable experimental data, would help designers minimize the overhead on cooling flow that is currently a necessity. A number of recent research projects sponsored by a range of industrial gas turbine and aero-engine manufacturers attest to the growing interest in hot-streak physics. This paper presents measurements of surface and endwall heat transfer rate for a high-pressure (HP) nozzle guide vane (NGV) operating as part of a full HP turbine stage in an annular transonic rotating turbine facility. Measurements were conducted with both uniform stage inlet temperature and with two nonuniform temperature profiles. The temperature profiles were nondimensionally similar to profiles measured in an engine. A difference of one-half of an NGV pitch in the circumferential (clocking) position of the hot-streak with respect to the NGV was used to investigate the affect of clocking on the vane surface and endwall heat transfer rate. The vane surface pressure distributions, and the results of a flow-visualization study, which are also given, are used to aid interpretation of the results. The results are compared to two-dimensional predictions conducted using two different boundary layer methods. Experiments were conducted in the Isentropic Light Piston Facility (ILPF) at QinetiQ Farnborough, a short-duration engine-sized turbine facility. Mach number, Reynolds number, and gas-to-wall temperature ratios were correctly modeled. It is believed that the heat transfer measurements presented in this paper are the first of their kind.


Author(s):  
Hsiang-Sheng Huang ◽  
Jung-Chang Wang ◽  
Sih-Li Chen

This article provides an experimental method to study the thermal performance of a heat sink with two pairs (outer and inner pair) of embedded heat pipes. The proposed method can determine the heat transfer rate of the heat pipes under various heating power of the heat source. A comprehensive thermal resistance network of the heat sink is also developed. The network estimates the thermal resistances of the heat sink by applying the thermal performance test result. The results show that the outer and inner pairs of heat pipes carries 21% and 27% of the total heat transfer rate respectively, while 52% of the heating power is dissipated from the base plate to the fins. The dominated thermal resistance of the heat sink is the base to heat pipes resistance which is strongly affected by the thermal performance of the heat pipes. The total thermal resistance of the heat sink shows the lowest value, 0.23°C/W, while the total heat transfer rate of the heat sink is 140W and the heat transfer rate of the outer and inner pairs of heat pipes is 30W and 38 W, respectively.


Author(s):  
Suabsakul Gururatana ◽  
Xianchang Li

Extended surfaces (fins) have been used to enhance heat transfer in many applications. In electronics cooling, fin-based heat sinks are commonly designed so that coolants (gas or liquid) are forced to pass through the narrow straight channel. To improve the overall heat sink performance, this study investigated numerically the details of heat sinks with interrupted and staggered fins cooled by forced convection. Long and narrow flow passages or channels are widely seen in heat sinks. Based on the fundamental theory of heat transfer, however, a new boundary layer can be created periodically with interrupted fins, and the entrance region can produce a very high heat transfer coefficient. The staggered fins can take advantage of the lower temperature flow from the upstream. The tradeoff is the higher pressure loss. A major challenge for heat sink design is to reduce the pressure loss while keeping the heat transfer rate high. The effect of fin shapes on the heat sink performance was also examined. Two different shapes under study are rectangular and elliptic with various gaps between the interrupted fins in the flow direction. In addition, studies were also conducted on the parametric effects of Reynolds number and gap length. It is observed that heat transfer increases with the Reynolds number due to the feature of developing boundary layer. If the same pressure drop is considered, the heat transfer rate of elliptic fins is higher than that of rectangular fins.


Radiators used in the automotive application are a class of heat exchangers whose main purpose is to cool the coolant coming from the internal combustion engines. These coolants flow through tubes covered with fins that facilitate a faster way of heat transfer to the surrounding more efficiently. With the increase in efficiency of the engine cooling system it directly helps in the longevity of the engine in other words, the life of the internal combustion engine increases multifold times. Upon investigating we found different shapes that can be used to optimize the radiators efficiency. There are several other ways to improve the efficiency of a radiator. And these can be achieved by improving the surface area of the radiator, improving airflow through it, improving coolant property which flows through these tubes covered with fin all around and at last using alternate materials that prove to be more efficient than the present ones that are being used. The demand of the current times of climate change and energy crisis have paved way for improved heat transfer rates and designing radiators in smaller dimensions and sizes at the same time being more efficient than the previous generation of radiators. With the above conditions in mind, it has been found out that with a simple modification of changing the existing rectangular-shaped radiators into spiral-shaped ones thereby improving efficiency to improved levels, which finds its use in the current generation of vehicles which are benefitting from the improved rate of heat transfer taking place. The spiral radiator of copper tube used here is wound in two coils connected centrally. Spiral tubes of the radiator have circumferential fins. In this type of configuration, heat transfer rate will increase because of having a circumferential fin across the length of the spiral tube through which water flows. These design considerations have been done keeping in mind the major aims to achieve for this type of design and they are improving heat transfer rate and achieving compactness of shape of radiator. We also did Computational Fluid Dynamics or CFD Analysis to test the material properties for the application of heat transfer and how it fares against old materials.


Author(s):  
Aashish Kumar ◽  
Manoj Kumar Mondal

Abstract Improvement of thermal management can significantly enhance the coefficient of performance (COP) of the thermoelectric (TE) system which is one of the potential solutions for cooling electronic components. Since heat sinks are an integral part of all the electronic equipment, therefore, great consideration is given towards meticulous selection of heat sink for improving its reliability and performance. Various methods are being studied to improve heat transfer rates of heat sink such as microchannel, liquid cooling, nano-fluids, fin topology optimization, anodization of pins, and changing heat sink materials. Recent studies have demonstrated that perforations in pins increase the heat transfer rate of pin fin heat sink, though, the results are inadequate to infer the best geometry. Further research is hence necessary to establish the best possible combination of geometry, size, and number of perforations. The present work aims to numerically identify a heat sink configuration with maximum heat transfer rate among several configuration possibilities under laminar flow condition using ANSYS Fluent 18.2. The simulation results demonstrate that lateral perforation in fins enable higher heat transfer rate than the unmodified heat sink geometry, due to higher Nusselt number and reduced pressure drop. The parametric study also reveals that heat sink with three elliptical perforations boost heat transfer rates (about 21% higher) when compared to heat sink with solid and other perforated geometries. Furthermore, perforations reduce weight and greater effectiveness, making it more desirable for its wide-scale applications.


Author(s):  
Kamal Kumar Agrawal ◽  
Rohit Misra ◽  
Mayank Bhardwaj ◽  
Ghanshyam Das Agrawal ◽  
Anuj Mathur

Earth air tunnel heat exchanger (EATHE) is a capable and quite simple passive technique which may be utilized for space cooling/heating using the constant temperature of underground subsoil. However, it could not gain much attraction as a heating/cooling system as it requires larger trench lengths to accommodate longer pipes. Larger trench lengths involve huge excavation cost and a sufficiently large piece of land. The length of the trench needed can be reduced substantially by adopting a proper pipe layout. In the present study, the performance of U-shaped, slinky-coil, and helical-coil pipe layouts of an EATHE system is compared numerically using ANSYS FLUENT 15.0. Results reveal that the temperature drop and heat transfer rate per unit trench length are higher in the slinky-coil pipe layout than in U-shaped and helical-coil pipe layouts. After 12 h of continuous operation, the effectiveness of the EATHE system with U-shaped, slinky-coil, and helical-coil pipe layouts is obtained as 0.60, 0.80, and 0.78, respectively. The study reveals that the selection of pipe layout for the EATHE system mainly depends on temperature drop EATHE is capable of giving, heat transfer rate, pumping power required, and ease of fabrication and installation as all these factors directly affect the initial and recurring capital investment for the EATHE system.


Author(s):  
Mikyung Lim ◽  
You Kyoung Seo ◽  
Seung S. Lee ◽  
Young Kyu Hwang

Recent small electronic equipments with various functions require extreme increase of heat transfer rate per unit surface. Current small electronic equipments’ cooling abilities have limitation with its heat transfer rate. Boiling is one of the solutions for this problem since it can be applied by using microchannel and flow boiling. Also, it has much higher heat transfer coefficient than large-scale cooling system. However, boiling is not easily initiated and surface temperature often reaches high temperature even without boiling which could burn the electronic equipment. To enhance boiling, one of the best methods is coating nanoporous material on the surface. Synthesis characteristics of nanoporous material depend on both the temperature and concentration condition. Therefore, the accurate condition for the synthesis process is required but, the current synthesis method cannot control both temperature and concentration also wastes both time and resources. This research suggests a way of synthesizing nanoporous material using microchannel which can obtain accurate control of variables and save the resources. Microchannel reactor for nanoporous material synthesis is designed with channel on the SiO2 substrate. Cu-BTC solution passes through the microchannel and nanoporous material is coated on SiO2 substrate. Through time and temperature variable experiment, the procedure of growth of nanoporous material is observed within time change and transformation of crystalline structure of nanoporous material is obtained by temperature change. Most importantly, this method provides much higher synthesis rate and uniformity than the current synthesis method. The experiment on the effect of width of microchannel on synthesis rate was also performed. This has important meaning since it can be applied to the other materials which can be synthesized in microchannel and could increase their synthesis rate too. Synthesis in microchannel provides high reproducibility and helps to accomplish accurate analysis. Moreover, synthesis of nanoporous material in the microchannel is easier to fabricate and easier to be applied in the cooling system using the flow boiling. Therefore, synthesis in microchannel can make a significant improvement in cooling system of small equipments, and it contributes to miniaturization of electronic equipments.


Author(s):  
Tamanna Alam ◽  
Poh Seng Lee ◽  
Christopher R. Yap ◽  
Liwen Jin

Flow boiling in microgap heat sink is very attractive for high-performance electronics cooling due to its high heat transfer rate and easy fabrication process. In absence of thermal interface material between the active electronic component and a microgap cold plate, significant reduction in interface thermal resistance and enhancement in heat transfer rate can be achieved. In earlier studies by these authors, encouraging results have been obtained using microgap heat sink as it can potentially mitigate flow instabilities, flow reversal and maintain uniform wall temperatures over the heated surface. So, more work should be carried out to advance the fundamental understanding of the two-phase flow heat transfer associated with microgap heat sink and the underlying mechanisms. In this study, local flow boiling phenomena in different microgap sizes have been investigated experimentally. Experiments are performed in silicon based microgap heat sink having microgap depth ranging from 80 μm to 500 μm, using deionized water with 10 °C subcooled inlet temperature. The effects of mass flux and heat flux on heat transfer coefficient and pressure drop characteristics are examined by using different mass fluxes ranging from 400 kg/m2s to 1000 kg/m2s and effective heat flux varying from 0 to 100 W/cm2. Apart from these experimental investigations, simultaneous high speed visualizations are conducted to observe and explore the mechanism of flow boiling in microgap. Confined slug and annular boiling are observed as the two main heat transfer mechanisms in microgap. Moreover, experimental results show that flow boiling heat transfer coefficients are dependent on gap size, and the lower the gap size, higher the heat transfer coefficient.


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