A Role of Low Energy Grain Boundaries in the Abnormal Grain Growth in Fe-3%Si Alloy

2011 ◽  
Vol 127 ◽  
pp. 89-94 ◽  
Author(s):  
Ye Chao Zhu ◽  
Jiong Hui Mao ◽  
Fa Tang Tan ◽  
Xue Liang Qiao
Keyword(s):  
Grain Boundaries ◽  
Grain Growth ◽  
Electron Backscatter Diffraction ◽  
Dominant Role ◽  
Coincidence Site Lattice ◽  
Diffraction Method ◽  
Abnormal Grain Growth ◽  
Low Energy ◽  
Backscatter Diffraction

Low energy grain boundaries were considered to be important in abnormal grain growth by theoretical deduction. The disorientation angles and coincidence site lattice grain boundaries distribution of more than 20 Goss grains and their neighboring matrix grains in primary recrystallized Fe-3%Si alloy were investigated using an electron backscatter diffraction method. It was found that the frequency of low energy grain boundaries of Goss grains which are more likely to abnormally grow are higher than their neighboring matrix grains, which indicated that low energy grain boundaries play a dominant role in the abnormal grain growth of Fe-3%Si alloy. The result meets well with the abnormal grain growth theory.

Investigation of the Sintering Behavior of Ultrapure α-Alumina Containing Low Amounts of SiO2 or CaO

2006 ◽  
Vol 317-318 ◽  
pp. 1-6 ◽  
Author(s):  
Nicolas Louet ◽  
Thierry Epicier ◽  
Gilbert Fantozzi
Keyword(s):  
Grain Boundaries ◽  
Grain Growth ◽  
Oxygen Vacancies ◽  
Glassy Phase ◽  
Intermediate Stage ◽  
Abnormal Grain Growth ◽  
Sintering Behavior ◽  
Critical Temperatures ◽  
Heterogeneous Microstructures

The target of this work is to investigate the effect of small additions of SiO2 or CaO on the sintering behavior and the microstructure of an ultrapure α-alumina compound. The sintering behavior has been investigated through extensive dilatometric study. SiO2 additions lead to a significant decrease in shrinkage rate during the intermediate stage of sintering whereas CaO is beneficent to densification. It has been found that during this stage which corresponds to the maximum of densification rate, grain boundaries diffusion controls densification through oxygen vacancies. The study of the densification behavior under different atmospheres help us to explain the role of the additives in agreement with electroneutrality equations. S.E.M. investigations confirm the well know correlation between doping and heterogeneous microstructures. After doping with SiO2 or CaO, abnormal grain growth appears at temperatures corresponding to the lowest eutectics given by Al2O3-SiO2 or Al2O3-CaO phase diagrams. H.R.T.E.M. observations show that below the critical temperatures for abnormal grain growth, additives enrichment is observed near grain boundaries (GBs). Above these temperatures, glassy phase for SiO2-doping and calciumhexaluminate (CA6) for CaO-doping are present at grain boundaries.

Grain Boundary Engineering: Progress and Challenges

2007 ◽  
Vol 539-543 ◽  
pp. 3389-3394 ◽  
Author(s):  
Wei Guo Wang
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
Grain Boundary Character Distribution ◽  
Grain Boundary Engineering ◽  
Special Boundaries ◽  
Grain Boundary Character ◽  
Proposed Model ◽  
Backscatter Diffraction

The progress of grain boundary engineering (GBE) is overviewed and the challenges for further investigations emphasized. It points out that, the electron backscatter diffraction (EBSD) reconstruction of grain boundaries, which gives the information of connectivity interruption of general high angle boundaries (HABs), is more significant than purely pursuing high frequency of so-called special boundaries. The criterion for the optimization of grain boundary character distribution (GBCD) needs to be established. The energy spectrum and the degradation susceptibility of grain boundaries of various characters including HABs and low Σ（Σ≤29） coincidence site lattice (CSL) needs to be studied and ascertained. And finally, the newly proposed model of non-coherent Σ3 interactions for GBCD optimization are discussed.

Influence of Microstructure on Aggressive Chemical Mechanical Planarization Processes for Thick Copper Films

2007 ◽  
Vol 991 ◽  
Author(s):  
Patrick J. Andersen ◽  
Megan Frary
Keyword(s):  
Grain Boundaries ◽  
Electron Backscatter Diffraction ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Coincidence Site Lattice ◽  
Surface Orientation ◽  
Copper Films ◽  
Microstructural Parameters ◽  
Backscatter Diffraction ◽  
The Relationship

ABSTRACTNovel die-stacking schema using through-wafer vias may require thick electrodeposited copper and aggressive first-step chemical mechanical planarization (CMP). However, the effect of microstructural parameters, including surface orientation and grain size, on the CMP behavior of thick electrodeposited copper is not well understood. Here we explore the relationship be-tween the surface orientation of copper grains and local CMP removal parameters using electron backscatter diffraction and topography correlation techniques. In the present work, solid copper disks are studied which are annealed to produce samples with differing grain sizes. In addition, aggressive CMP is performed on copper films (30 μm) electrodeposited on silicon. At the bulk level, the slurry composition is found to have the greatest effect on the removal rate and surface roughness. At the microstructural level, the nature of the grain boundaries (e.g. coincidence site lattice (CSL) vs. non-CSL boundaries) is shown to impact the depth of grooving at the grain boundaries. A relationship between surface orientation and local removal rate is found.

Morphology Evolution of Grain Boundary Carbides in Highly Twinned Inconel Alloy 600

2016 ◽  
Vol 879 ◽  
pp. 1111-1116 ◽  
Author(s):  
Hui Li ◽  
Jiao Rong Ma ◽  
Xin Rong Liu ◽  
Shuang Xia ◽  
Wen Qing Liu ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Aging Time ◽  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
Morphology Evolution ◽  
Alloy 600 ◽  
Inconel Alloy ◽  
Electron Backscatter ◽  
Backscatter Diffraction

The effects of grain boundary characters on the morphology evolution of grain boundary carbides in Inconel Alloy 600 with high proportional low Σ coincidence site lattice (CSL) boundaries aged at 715 oC for 1-100 h were investigated by scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD). During the aging process, the carbides precipitated at coherent twin (Σ3) boundaries are very few and finest within all the aging time. Bar like carbides precipitated near both sides of the incoherent twin (Σ3) boundaries, and bigger carbides than that of coherent Σ3 boundaries had been found on the incoherent Σ3 boundaries. Bar like carbides precipitated near only one side of Σ9 boundaries, and much bigger carbides than that of Σ3 boundaries have been found on the Σ9 boundaries. The morphology of carbides precipitated at Σ27 and random grain boundaries are similar, and is bigger than that of precipitated at other grain boundaries. The carbides precipitated at grain boundaries with all types grow bigger with the aging time prolonging, but their growth rates are different.

On the Role of the Crystallographic Grain Characteristics in the Corrosion Behavior of Polycrystalline Copper

2014 ◽  
Vol 783-786 ◽  
pp. 1658-1663
Author(s):  
Linsey Lapeire ◽  
Esther Martinez Lombardia ◽  
Kim Verbeken ◽  
Iris de Graeve ◽  
Leo Kestens ◽  
...  
Keyword(s):  
Grain Boundaries ◽  
Grain Orientation ◽  
Electron Backscatter Diffraction ◽  
Chemical Interaction ◽  
Coincidence Site Lattice ◽  
Pure Copper ◽  
Copper Substrate ◽  
Decisive Role ◽  
Special Boundaries

In order to increase the sustainability of metals, a more detailed understanding of the corrosion phenomenon is of crucial importance. In current literature, corrosion is often considered as a purely chemical interaction with nearly exclusive dependence on compositional effects, whilst ignoring the microstructural features of the metal surface. In the present work, results are presented which illustrate both the role of grain orientation and grain boundaries in the corrosion process. To evaluate the grain orientation dependent electrochemical behavior, polycrystalline Cu, was brought into contact with a corrosive electrolyte. Subsequently, the attack was evaluated by measuring the surface with both Atomic Force Microscopy (AFM) and Electron Backscatter Diffraction (EBSD). It was demonstrated that the grain orientation itself did not significantly influence the corrosion kinetics, but, alternatively, that the orientation of the neighboring grains seemed to play a decisive role in the grain dissolution rate. To increase understanding on the role of grain boundaries, a method was developed based on the electrochemical (galvanic) displacement of gold, which is deposited from an aqueous solution on a pure copper substrate. This technique demonstrated its sensitivity to the grain boundary characteristics as far less gold was deposited on special boundaries, such as coincidence site lattice boundaries, as compared to the random high angle grain boundaries.

Effect of Phosphorus Contents on Texture and Grain Boundary Character for the Annealing High Strength Ti-IF Steels

2013 ◽  
Vol 652-654 ◽  
pp. 929-933 ◽  
Author(s):  
Xin Li Song ◽  
Kun Peng ◽  
P.P. Zhang ◽  
J.Y. Wu ◽  
J. Zhou ◽  
...  
Keyword(s):  
Grain Boundaries ◽  
Recrystallization Texture ◽  
Volume Fraction ◽  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
High Strength ◽  
Fiber Texture ◽  
Grain Boundary Character ◽  
Electron Backscatter ◽  
Backscatter Diffraction

The effect of phosphorus contents on texture and grain boundaries character for the high strength Ti-IF annealed for 120sec at 810oC are researched by electron backscatter diffraction technique（EBSD）. The recrystallization texture is approximated by the γ-fiber texture whose components are {111} and {111} orientation texture. The highest volume fraction of //ND texture is almost 80% for the sample containing 0.056%P. A large amount of coincidence site lattice(CSL) grain boundaries ∑3，∑5, ∑7，∑9，∑11 and ∑13b are obtained.

Investigation of grain boundaries for abnormal grain growth in polycrystalline SrTiO3

2010 ◽  
Vol 25 (2) ◽  
pp. 260-265 ◽  
Author(s):  
Shao-Ju Shih ◽  
Sergio Lozano-Perez ◽  
David J.H. Cockayne
Keyword(s):  
Grain Boundaries ◽  
Grain Growth ◽  
Energy Dispersive Spectrometry ◽  
Dominant Role ◽  
Morphological Type ◽  
Liquid Films ◽  
Model Material ◽  
Abnormal Grain Growth ◽  
Transmission Electron ◽  
Microstructural Behavior

Strontium titanate (SrTiO3) is widely used in electronic devices, and it is a model material for understanding the structural and dielectric properties of grain boundaries (GBs). In such materials, the GBs often play a dominant role in sintering and microstructural behavior. Abnormal grain growth (AGG) is a commonly observed phenomenon. Most studies explained that GBs contain continuous liquid films, and this liquid assists interface diffusion resulting in fast growth. However, few studies investigate the AGG behavior without any liquid. In this study, GB morphology and chemistry have been characterized by high-resolution transmission electron microscopy and x-ray energy-dispersive spectrometry, respectively. Different distributions of GB morphology have been observed in abnormal grains and matrix grains, and GB chemistry varies with different morphological type GBs. By correlating GB morphology and chemistry, a possible mechanism for AGG is proposed.

Effect of Trench Aspect Ratio on Microstructure and Texture in Damascene Cu Interconnects

2012 ◽  
Vol 706-709 ◽  
pp. 2605-2610
Author(s):  
L. Chen ◽  
G.J. Yuan ◽  
J.G. Xu ◽  
F. Guo ◽  
N. Pang
Keyword(s):  
Aspect Ratio ◽  
Grain Boundaries ◽  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
X Ray Diffraction ◽  
X Ray ◽  
Cu Interconnects ◽  
Electron Backscatter ◽  
Line Spacing ◽  
Backscatter Diffraction

The effect of trench aspect ratio and line spacing on microstructure and texture in annealed damascene Cu interconnects has been investigated. The X-ray diffraction (XRD) and electron backscatter diffraction (EBSD) analyses of Cu lines, showed a preferred {111} orientation and the trenches reduce the proportion of high-angle grain boundaries and increase the fraction of coincidence site lattice (CSL) grain boundaries, comparing with the Cu blanket film. In addition, both trench aspect ratio and line spacing can largely affect the microstructure and texture in annealed damascene Cu interconnects.

New understanding of the role of coincidence site lattice boundaries in abnormal grain growth of aluminium alloy

2015 ◽  
Vol 95 (4) ◽  
pp. 220-228 ◽  
Author(s):  
Chang-Soo Park ◽  
Hyung-Ki Park ◽  
Hyung-Seok Shim ◽  
Tae-Wook Na ◽  
Chan-Hee Han ◽  
...  
Keyword(s):  
Aluminium Alloy ◽  
Grain Growth ◽  
Coincidence Site Lattice ◽  
Abnormal Grain Growth ◽  
Site Lattice

Microstructure of Polycrystalline MgO Penetrated by a Silicate Liquid

1996 ◽  
Vol 2 (3) ◽  
pp. 113-128 ◽  
Author(s):  
Sundar Ramamurthy ◽  
Michael P. Mallamaci ◽  
Catherine M. Zimmerman ◽  
C. Barry Carter ◽  
Peter R. Duncombe ◽  
...  
Keyword(s):  
Grain Boundaries ◽  
Grain Growth ◽  
Glassy Phase ◽  
Silicate Liquid ◽  
Two Phase ◽  
The Matrix ◽  
Devitrification Process ◽  
Phase Mixture

Dense, polycrystalline MgO was infiltrated with monticellite (CaMgSiO4) liquid to study the penetration of liquid along the grain boundaries of MgO. Grain growth was found to be restricted with increasing amounts of liquid. The inter-granular regions were generally found to be comprised of a two-phase mixture: crystalline monticellite and a glassy phase rich in the impurities present in the starting MgO material. MgO grains act as seeding agents for the crystallization of monticellite. The location and composition of the glassy phase with respect to the MgO grains emphasizes the role of intergranular liquid during the devitrification process in “snowplowing” impurities present in the matrix.

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