Influence of Microstructure on Aggressive Chemical Mechanical Planarization Processes for Thick Copper Films

Removal Rate ◽

Chemical Mechanical Planarization ◽

Surface Orientation ◽

Copper Films ◽

Microstructural Parameters ◽

Backscatter Diffraction ◽

The Relationship

ABSTRACTNovel die-stacking schema using through-wafer vias may require thick electrodeposited copper and aggressive first-step chemical mechanical planarization (CMP). However, the effect of microstructural parameters, including surface orientation and grain size, on the CMP behavior of thick electrodeposited copper is not well understood. Here we explore the relationship be-tween the surface orientation of copper grains and local CMP removal parameters using electron backscatter diffraction and topography correlation techniques. In the present work, solid copper disks are studied which are annealed to produce samples with differing grain sizes. In addition, aggressive CMP is performed on copper films (30 μm) electrodeposited on silicon. At the bulk level, the slurry composition is found to have the greatest effect on the removal rate and surface roughness. At the microstructural level, the nature of the grain boundaries (e.g. coincidence site lattice (CSL) vs. non-CSL boundaries) is shown to impact the depth of grooving at the grain boundaries. A relationship between surface orientation and local removal rate is found.

A Role of Low Energy Grain Boundaries in the Abnormal Grain Growth in Fe-3%Si Alloy

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.127.89 ◽

2011 ◽

Vol 127 ◽

pp. 89-94 ◽

Cited By ~ 4

Author(s):

Ye Chao Zhu ◽

Jiong Hui Mao ◽

Fa Tang Tan ◽

Xue Liang Qiao

Keyword(s):

Grain Boundaries ◽

Grain Growth ◽

Dominant Role ◽

Diffraction Method ◽

Abnormal Grain Growth ◽

Low Energy ◽

Low energy grain boundaries were considered to be important in abnormal grain growth by theoretical deduction. The disorientation angles and coincidence site lattice grain boundaries distribution of more than 20 Goss grains and their neighboring matrix grains in primary recrystallized Fe-3%Si alloy were investigated using an electron backscatter diffraction method. It was found that the frequency of low energy grain boundaries of Goss grains which are more likely to abnormally grow are higher than their neighboring matrix grains, which indicated that low energy grain boundaries play a dominant role in the abnormal grain growth of Fe-3%Si alloy. The result meets well with the abnormal grain growth theory.

Grain Boundary Engineering: Progress and Challenges

10.4028/www.scientific.net/msf.539-543.3389 ◽

2007 ◽

Vol 539-543 ◽

pp. 3389-3394 ◽

Cited By ~ 2

Author(s):

Wei Guo Wang

Keyword(s):

Grain Boundary ◽

Grain Boundaries ◽

Grain Boundary Character Distribution ◽

Grain Boundary Engineering ◽

Special Boundaries ◽

Grain Boundary Character ◽

Proposed Model ◽

The progress of grain boundary engineering (GBE) is overviewed and the challenges for further investigations emphasized. It points out that, the electron backscatter diffraction (EBSD) reconstruction of grain boundaries, which gives the information of connectivity interruption of general high angle boundaries (HABs), is more significant than purely pursuing high frequency of so-called special boundaries. The criterion for the optimization of grain boundary character distribution (GBCD) needs to be established. The energy spectrum and the degradation susceptibility of grain boundaries of various characters including HABs and low Σ（Σ≤29） coincidence site lattice (CSL) needs to be studied and ascertained. And finally, the newly proposed model of non-coherent Σ3 interactions for GBCD optimization are discussed.

Morphology Evolution of Grain Boundary Carbides in Highly Twinned Inconel Alloy 600

10.4028/www.scientific.net/msf.879.1111 ◽

2016 ◽

Vol 879 ◽

pp. 1111-1116 ◽

Cited By ~ 3

Author(s):

Hui Li ◽

Jiao Rong Ma ◽

Xin Rong Liu ◽

Shuang Xia ◽

Wen Qing Liu ◽

...

Keyword(s):

Grain Boundary ◽

Grain Boundaries ◽

Aging Time ◽

Morphology Evolution ◽

Alloy 600 ◽

Inconel Alloy ◽

Electron Backscatter ◽

The effects of grain boundary characters on the morphology evolution of grain boundary carbides in Inconel Alloy 600 with high proportional low Σ coincidence site lattice (CSL) boundaries aged at 715 oC for 1-100 h were investigated by scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD). During the aging process, the carbides precipitated at coherent twin (Σ3) boundaries are very few and finest within all the aging time. Bar like carbides precipitated near both sides of the incoherent twin (Σ3) boundaries, and bigger carbides than that of coherent Σ3 boundaries had been found on the incoherent Σ3 boundaries. Bar like carbides precipitated near only one side of Σ9 boundaries, and much bigger carbides than that of Σ3 boundaries have been found on the Σ9 boundaries. The morphology of carbides precipitated at Σ27 and random grain boundaries are similar, and is bigger than that of precipitated at other grain boundaries. The carbides precipitated at grain boundaries with all types grow bigger with the aging time prolonging, but their growth rates are different.

Microstructure Evolution and Creep Behavior in ECAP Processed Metallic Materials

10.4028/www.scientific.net/msf.783-786.2689 ◽

2014 ◽

Vol 783-786 ◽

pp. 2689-2694

Author(s):

Vàclav Sklenička ◽

Petr Král ◽

Jiří Dvořák ◽

Marie Kvapilová ◽

Milan Svoboda

Keyword(s):

Creep Behavior ◽

Orientation Imaging Microscopy ◽

Microstructural Parameters ◽

Orientation Imaging ◽

Angular Pressing ◽

High Purity Aluminum ◽

Backscatter Diffraction ◽

The Relationship ◽

Zr Alloys

The creep behavior of high purity aluminum and copper, Al-0.2wt.%Sc and Cu-0.2wt.%Zr alloys was examined after processing by equal-channel angular pressing (ECAP) with an emphasis on the link between microstructure and creep. The microstructure was revealed by electron backscatter diffraction (EBSD) and analyzed by stereological methods. Representative microstructural parameters were obtained using orientation imaging microscopy and EBSD on the relationship between creep behavior and microstructure.

Effect of Phosphorus Contents on Texture and Grain Boundary Character for the Annealing High Strength Ti-IF Steels

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.652-654.929 ◽

2013 ◽

Vol 652-654 ◽

pp. 929-933 ◽

Cited By ~ 1

Author(s):

Xin Li Song ◽

Kun Peng ◽

P.P. Zhang ◽

J.Y. Wu ◽

J. Zhou ◽

...

Keyword(s):

Grain Boundaries ◽

Recrystallization Texture ◽

Volume Fraction ◽

High Strength ◽

Fiber Texture ◽

Grain Boundary Character ◽

Electron Backscatter ◽

The effect of phosphorus contents on texture and grain boundaries character for the high strength Ti-IF annealed for 120sec at 810oC are researched by electron backscatter diffraction technique（EBSD）. The recrystallization texture is approximated by the γ-fiber texture whose components are {111} and {111} orientation texture. The highest volume fraction of //ND texture is almost 80% for the sample containing 0.056%P. A large amount of coincidence site lattice(CSL) grain boundaries ∑3，∑5, ∑7，∑9，∑11 and ∑13b are obtained.

Effect of Trench Aspect Ratio on Microstructure and Texture in Damascene Cu Interconnects

10.4028/www.scientific.net/msf.706-709.2605 ◽

2012 ◽

Vol 706-709 ◽

pp. 2605-2610

Author(s):

L. Chen ◽

G.J. Yuan ◽

J.G. Xu ◽

F. Guo ◽

N. Pang

Keyword(s):

Aspect Ratio ◽

Grain Boundaries ◽

X Ray Diffraction ◽

X Ray ◽

Cu Interconnects ◽

Electron Backscatter ◽

Line Spacing ◽

The effect of trench aspect ratio and line spacing on microstructure and texture in annealed damascene Cu interconnects has been investigated. The X-ray diffraction (XRD) and electron backscatter diffraction (EBSD) analyses of Cu lines, showed a preferred {111} orientation and the trenches reduce the proportion of high-angle grain boundaries and increase the fraction of coincidence site lattice (CSL) grain boundaries, comparing with the Cu blanket film. In addition, both trench aspect ratio and line spacing can largely affect the microstructure and texture in annealed damascene Cu interconnects.

Experimental Study on the Influence of Grain Boundaries on the Subdivision Behaviour of Al-3%Mg Polycrystals during Cold Deformation Using Electron Backscatter Diffraction

Materials Science Forum - Textures of Materials - ICOTOM 14 ◽

10.4028/0-87849-975-x.1025 ◽

2005 ◽

pp. 1025-1030

Author(s):

Steven Van Boxel ◽

Marc Seefeldt ◽

Bert Verlinden ◽

Paul Van Houtte

Keyword(s):

Experimental Study ◽

Grain Boundaries ◽

Cold Deformation ◽

Electron Backscatter ◽

Pop-in behavior and elastic-to-plastic transition of polycrystalline pure iron during sharp nanoindentation

Scientific Reports ◽

10.1038/s41598-019-51644-5 ◽

2019 ◽

Vol 9 (1) ◽

Cited By ~ 6

Author(s):

Fabian Pöhl

Keyword(s):

Grain Boundaries ◽

Strong Influence ◽

Dislocation Nucleation ◽

Stress Fields ◽

Shear Stresses ◽

Statistical Process ◽

Iron Crystal ◽

Electron Backscatter ◽

Abstract This study analyzes the elastic-to-plastic transition during nanoindentation of polycrystalline iron. We conduct nanoindentation (Berkovich indenter) experiments and electron backscatter diffraction analysis to investigate the initiation of plasticity by the appearance of the pop-in phenomenon in the loading curves. Numerous load–displacement curves are statistically analyzed to identify the occurrence of pop-ins. A first pop-in can result from plasticity initiation caused by homogeneous dislocation nucleation and requires shear stresses in the range of the theoretical strength of a defect-free iron crystal. The results also show that plasticity initiation in volumes with preexisting dislocations is significantly affected by small amounts of interstitially dissolved atoms (such as carbon) that are segregated into the stress fields of dislocations, impeding their mobility. Another strong influence on the pop-in behavior is grain boundaries, which can lead to large pop-ins at relatively high indentation loads. The pop-in behavior appears to be a statistical process affected by interstitial atoms, dislocation density, grain boundaries, and surface roughness. No effect of the crystallographic orientation on the pop-in behavior can be observed.

Grain Boundary Analysis of Crept Alloy 617

MRS Proceedings ◽

10.1557/opl.2012.243 ◽

2012 ◽

Vol 1383 ◽

Cited By ~ 1

Author(s):

Fan Zhang ◽

David P. Field

Keyword(s):

Grain Boundary ◽

Grain Boundaries ◽

Creep Damage ◽

Original Material ◽

Alloy 617 ◽

Plane Normal ◽

Lattice Misorientation ◽

Two Parameters ◽

ABSTRACTAlloy 617, a high-temperature creep-resistant, nickel-based alloy, is being considered for the primary heat exchanger for the next generation nuclear plant, which is highly influenced by thermal creep. The main objective of this study is to inspect the crept grain boundaries under its imitated working condition, and to determine which boundaries are susceptible to damage and which are more resistant, in order to help improve its creep resistance in future manufacturing. Electron backscatter diffraction was used to measure the proportions of each boundary by observing and analyzing these crept microstructures. The grain-boundary distribution can be expressed in terms of five parameters including three parameters of lattice misorientation and two parameters of the grain-boundary plane normal. Three conditions were analyzed: the original material, metal that was annealed without stress, and ones that were crept at 1000ºC at 19 MPa and 25 MPa for various times. Though observation, it is found that the voids seldom occur at low angle grain boundaries, and coherent twin boundaries are also resist to creep damage.

Determining the orientation of parent β grain from one α variant in titanium alloys

Journal of Applied Crystallography ◽

10.1107/s1600576718008592 ◽

2018 ◽

Vol 51 (4) ◽

pp. 1125-1132 ◽

Cited By ~ 5

Author(s):

Z. B. Zhao ◽

Q. J. Wang ◽

H. Wang ◽

J. R. Liu ◽

R. Yang

Keyword(s):

Titanium Alloys ◽

Habit Plane ◽

Three Dimensional ◽

Dimensional Structure ◽

Plane Normal ◽

Β Phase ◽

Microstructural Morphology ◽

Backscatter Diffraction ◽

The Relationship

The relationship between the crystallographic orientation and habit plane normal of transformed α laths in titanium alloys is discussed according to the Burgers orientation relationship and the three-dimensional structure of the α lath. A new method (orientation–trace method) is developed to determine the orientation of the parent β phase using the orientation of the α lath, which was measured by electron backscatter diffraction, and the microstructural morphology of that α variant. This approach is validated in a near-α titanium alloy. Moreover, the habit plane normal direction of the transformed α lath can be obtained from the crystallographic orientations of the α lath itself and its parent β grain. The verification and the corresponding discussion show the reliability of this approach.