Study on Synthesis and Properties of Waterborne Polyurethane Modified by Epoxy Resin

2013 ◽  
Vol 395-396 ◽  
pp. 423-426 ◽  
Author(s):  
Zhi Ming Jin ◽  
Wen Lu Guo ◽  
Cai Hua Gao
Keyword(s):  
Epoxy Resin ◽  
Raw Materials ◽  
High Hardness ◽  
Waterborne Polyurethane ◽  
Isophorone Diisocyanate ◽  
Poly Propylene ◽  
Good Heat Resistance ◽  
Modified Epoxy ◽  
Epoxy Value ◽  
Good Heat

The waterborne polyurethane (WPU) modified by epoxy resin was synthesized by using isophorone diisocyanate (IPDI), poly propylene glycol (PPG-1000), 2,2-dimethylol propionic acid (DMPA) and epoxy resin as the main raw materials. The WPU properties were characterized by TGA, FTIR, and so on. The study shows that whennNCO/nOH=1.4, the mount of DMPA is 5.0%, the emulsifying property of WPU which is modified epoxy resin with high epoxy value is well. And when the mounts of E-20, E-44 are 2.0%, 4.0% respectively, the synthesized emulsion with small size has well stability. The modified WPU which possesses high hardness, low water absorption, good heat resistance and anticorrosion, has a well combination property.

scholarly journals Structures and Properties of Self - crosslinking Silicone Resin

2018 ◽  
Vol 38 ◽  
pp. 02019
Author(s):  
Yong-xin Zhao ◽  
Ying-qiang Zhang
Keyword(s):  
Thermal Decomposition ◽  
Raw Materials ◽  
Decomposition Temperature ◽  
Light Transmittance ◽  
Silicone Resin ◽  
Structures And Properties ◽  
Vis Spectroscopy ◽  
Ft Ir ◽  
Good Heat Resistance ◽  
Good Heat

Highly transparent silicone resin with self-crosslinking structure was prepared using phenyltrimethoxysilane, diphenyldimethoxysilane, 1,3,5,7-cyclotetra(methyl siloxane) and bisvinyltetramethyldisiloxane as main raw materials. The structure of silicone resin was determined by Fourier Transform Infrared Spectroscopy (FT-IR). The light transmittance was measured by UV-Vis spectroscopy. Thermogravimetric analysis (TGA) was used to study the thermal decomposition process. The microstructure of cured self-crosslinking silicone resin is more uniform, resulting in better light transmittance up to 100% in the range of 400nm ~ 800nm. The cured has relatively good heat resistance, the initial thermal decomposition temperature of the cured could be up to 315.8 °C. SEM observations show that the self-crosslinking silicone has a uniform, textured structure, higher transparency compared with the existing condensation silicone material, and can be used as advanced architectural translucent materials and optics packaging materials.

Preparation and Properties of Polysiloxane Modified Epoxy Encapsulating Material

2014 ◽  
Vol 1021 ◽  
pp. 3-6
Author(s):  
Hao Ran Zhou ◽  
Hong Xia Li ◽  
Wei Miao Yu
Keyword(s):  
Epoxy Resin ◽  
Raw Materials ◽  
Curing Agent ◽  
Reaction Conditions ◽  
The Poor ◽  
Fatigue Durability ◽  
Ft Ir ◽  
Shock Resistance ◽  
Modified Epoxy ◽  
Toughening Agent

In order to solve the poor toughness, fatigue durability and shock resistance defects of the cured epoxy resin, in this paper, the epoxy resin was modified via dichlorodiphenyl silane as a modifier. Then the electronic packaging materials were prepared using the modified EP as matrix, a nitrile rubber (CTBN) as a toughening agent, methyl nadic anhydride (MNA) as a curing agent, and 2, 4, 6 - tris (dimethyl amino methyl) phenol as a curing accelerator. The effects of raw materials ratio on the cured products’ properties was investigated. FT-IR, TG-DTG and DMA were used to test and characterize the product. And we determined the best raw materials ratio and reaction conditions. Finally epoxy encapsulating materials which have excellent mechanical properties, electrical properties were prepared.

Effects of HDI/IPDI Ratio on Properties of Waterborne Polyurethane

2012 ◽  
Vol 452-453 ◽  
pp. 674-678
Author(s):  
Ming Ji Zhou ◽  
Qing Ze Jiao ◽  
Yun Zhao ◽  
Wen Jia Cui
Keyword(s):  
Raw Materials ◽  
Average Particle Size ◽  
Waterborne Polyurethane ◽  
Hexamethylene Diisocyanate ◽  
Molar Ratio ◽  
Average Particle ◽  
Isophorone Diisocyanate ◽  
Polyester Polyol ◽  
Elongation At Break ◽  
Light Blue

A waterborne polyurethane (WPU) dispersoid was synthesized through the prepolymer method using aliphatic isocyanates [namely isophorone diisocyanate(IPDI), hexamethylene diisocyanate(HDI)] and self-made polyester polyol as main raw materials. The effects of HDI/IPDI ratio on properties of waterborne polyurethane were discussed. The FTIR results confirmed the successful synthesis of WPU. As the molar ratio of HDI/IPDI increased, the properties (including elongation at break, solvent resistance, viscosity and thermal stability) increased, while the tensile strength and the average particle size decreased. The stable WPU with light blue and translucent were obtained when the HDI/ IPDI ratio was 1.5:1.

scholarly journals Synthesis and Characterization of Epoxy Resins-Modified Waterborne Polyurethane Emulsion

2021 ◽  
pp. 1-9
Author(s):  
Chenhan Zhuang ◽  
Weilan Xue ◽  
Zuoxiang Zeng
Keyword(s):  
Epoxy Resin ◽  
Water Resistance ◽  
Raw Materials ◽  
Waterborne Polyurethane ◽  
Polyurethane Film ◽  
Modification Method ◽  
Suitable Amount ◽  
Overall Performance ◽  
Better Than

Aqueous polyurethane emulsion was prepared with diphenylmethane diisocyanate (MDI), polybutylene adipate diol (PBA-1000) as main raw materials and 2, 2-dihydroxymethyl propionic acid (DMPA) as hydrophilic chain extender. On this basis, epoxy resin E-44 was introduced to modify the polyurethane prepolymer, and epoxy resin modified waterborne polyurethane emulsion was obtained. In order to obtain better performance waterborne polyurethane, the effect of DMPA content、the amount of epoxy resin added and modification method on the properties of polyurethane was discussed. The results show that when the DMPA content is 4wt%, the overall performance of the emulsion and the film is the best. And the addition of epoxy resin significantly improves the water resistance, solvent resistance and tensile strength of the waterborne polyurethane film, and its hardness and thermal stability are also improved to a certain extent. When the amount of epoxy resin added is 8wt%, the storage stability decreases significantly, the suitable amount of epoxy resin added is 6wt%. The overall performance of the film obtained by chemical modification is better than that of physical modification.

Synthesis of New Benzoxazine from Cardanol-Furfural Resin and the Properties of the Corresponding Polymer

2011 ◽  
Vol 236-238 ◽  
pp. 317-320 ◽  
Author(s):  
Sheng Fang Li ◽  
Wei Dong Huang
Keyword(s):  
Renewable Resources ◽  
Ring Opening ◽  
Phenolic Resin ◽  
Raw Materials ◽  
Side Chain ◽  
H Nmr ◽  
Ring Opening Reaction ◽  
Yield Value ◽  
Good Heat Resistance ◽  
Good Heat

A novel benzoxazine-based phenolic resin containing furan groups and long alkyl side-chain (CFB) was synthesized using cardanol-furfural resin as phenolic raw materials. The new benzoxazine-based cardanol-furfural resin derived from renewable resources was characterized by FTIR,1H NMR spectra and Differential scanning calorimeter (DSC) etc. The thermal ring-opening reaction of the benzoxazine ring and the polymerization of the double bond were demonstrated with FTIR measurement. The thermal behavior of the cured product was also investigated with thermogravimetric analysis. The corresponding polybenzoxazine showed Tgvalue higher than that of polybenzoxazine prepared from cardanol, ammonia and formaldehyde. The char yield value at 800°C of the corresponding polybenzoxazine is 46.2% in N2atmosphere. The results showed that the polybenzoxazine cured from CFB had good heat resistance and toughness.

Modification of Epoxy Resin with Silicone for Electronic Encapsulation Application

2014 ◽  
Vol 936 ◽  
pp. 643-650 ◽  
Author(s):  
Li Xin Chen ◽  
Ling Yu Fan ◽  
Li Shuai Gao
Keyword(s):  
Thermal Stability ◽  
Thermal Resistance ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Base Material ◽  
Humidity Resistance ◽  
Electronic Elements ◽  
Modified Epoxy ◽  
Hot Melt ◽  
Epoxy Value

The reaction was carried out with a solventless (hot-melt) method using epoxy resin (E-20) as a base material and dihydroxydiphenylsilane (DHDPS) or polymethyltriethoxysilane (PTS) as a modifier. IR spectrum, epoxy value of modified epoxy resins indicated that DHDPS and PTS were incorporated into epoxy resin respectively. The influences of silicone contents on softening point and thermal resistance of cured silicone modified epoxy resin systems were studied. The thermal stability was investigated by thermogravimetic analysis (TGA). Effects of the viscosity of packaging slurry on the performance of encapsulated electronic elements were also investigated. In contrast to ED-20 cured system, the thermal resistance, toughness, humidity resistance of ETS-20 cured systems improved more obvious. And ETS-20 has exhibited excellent resistance to the thermal shock cycling test. It indicated that ETS-20 can be applicated for electronic encapsulation. The viscosity of packaging slurry was most appropriate when it was 170~200 mPas.

Study on Synthesis of Epoxy Resin Modified with Polysiloxane

2014 ◽  
Vol 496-500 ◽  
pp. 193-197
Author(s):  
Jiang Ling Han ◽  
Hui Lu Li ◽  
Kang Chen Shao ◽  
Wen Liu
Keyword(s):  
Molecular Weight ◽  
Reaction Time ◽  
Epoxy Resin ◽  
Reaction Temperature ◽  
Silicone Oil ◽  
Glycidyl Ether ◽  
Molar Ratio ◽  
Allyl Glycidyl Ether ◽  
Modified Epoxy ◽  
Epoxy Value

With allyl glycidyl ether and terminal hydrogen silicone oil, in certain conditions, the silicone-modified epoxy resin synthesized by the hydrosilylation reaction. This study discuss the effect of the structure and properties on the synthesized product, such as the catalyst, reaction time, reaction temperature and the C = C/Si-H molar ratio of allyl glycidyl ether and terminal hydrogen silicone oil. Infrared spectroscopy, gel permeation chromatography (GPC), epoxy value and hydrolysis chlorine of the polysiloxane-modified epoxy resin were characterized and analysized. The results show that the terminal hydrogen silicone oil-modified epoxy resin has balanced epoxy value, molecular weight and molecular weight distribution, the conversion of reactive hydrogen is the highest when the dosage of H2PtCl66H2O is 0.01% to 0.02% of reactant in weight, the molar ratio of C=C /Si-H in AGE (allyl glycidyl ether) and the terminal of hydrogen silicone oil is 4.28:1, the reaction temperature is 80°C to 85°C, reaction time is controlled in 6 hours.

The Mechanical Properties of Organic Modified Epoxy Resin

2020 ◽  
Vol 43 (3) ◽  
pp. 10-14
Author(s):  
Georgel MIHU ◽  
Claudia Veronica UNGUREANU ◽  
Vasile BRIA ◽  
Marina BUNEA ◽  
Rodica CHIHAI PEȚU ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Composite Materials ◽  
Epoxy Resin ◽  
Epoxy Matrix ◽  
Epoxy Resins ◽  
Mechanical Tests ◽  
Organic Modification ◽  
Three Point Bending ◽  
Modified Epoxy

Epoxy resins have been presenting a lot of scientific and technical interests and organic modified epoxy resins have recently receiving a great deal of attention. For obtaining the composite materials with good mechanical proprieties, a large variety of organic modification agents were used. For this study gluten and gelatin had been used as modifying agents thinking that their dispersion inside the polymer could increase the polymer biocompatibility. Equal amounts of the proteins were milled together and the obtained compound was used to form 1 to 5% weight ratios organic agents modified epoxy materials. To highlight the effect of these proteins in epoxy matrix mechanical tests as three-point bending and compression were performed.

scholarly journals Hydrophobic Modification of Graphene Oxide and Its Effect on the Corrosion Resistance of Silicone-Modified Epoxy Resin

Metals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 89
Author(s):  
Wei Yuan ◽  
Qian Hu ◽  
Jiao Zhang ◽  
Feng Huang ◽  
Jing Liu
Keyword(s):  
Contact Angle ◽  
Corrosion Resistance ◽  
Graphene Oxide ◽  
Physical Properties ◽  
Epoxy Resin ◽  
Electrochemical Impedance ◽  
Salt Spray ◽  
X Ray ◽  
Modified Graphene Oxide ◽  
Modified Epoxy

This study modified graphene oxide (GO) with hydrophilic octadecylamine (ODA) via covalent bonding to improve its dispersion in silicone-modified epoxy resin (SMER) coatings. The structural and physical properties of ODA-GO were characterized by field-emission scanning electron microscopy (FE-SEM), X-ray diffraction analysis (XRD), Fourier transform infrared spectroscopy (FT-IR), Raman spectroscopy, X-ray photoelectron spectroscopy (XPS), and contact angle tests. The ODA-GO composite materials were added to SMER coatings by physical mixing. FE-SEM, water absorption, and contact angle tests were used to evaluate the physical properties of the ODA-GO/SMER coatings, while salt spray, electrochemical impedance spectroscopy (EIS), and scanning Kelvin probe (SKP) methods were used to test the anticorrosive performance of ODA-GO/SMER composite coatings on Q235 steel substrates. It was found that ODA was successfully grafted onto the surfaces of GO. The resulting ODA-GO material exhibited good hydrophobicity and dispersion in SMER coatings. The anticorrosive properties of the ODA-GO/SMER coatings were significantly improved due to the increased interfacial adhesion between the nanosheets and SMER, lengthening of the corrosive solution diffusion path, and increased cathodic peeling resistance. The 1 wt.% ODA-GO/SMER coating provided the best corrosion resistance than SMER coatings with other amounts of ODA-GO (including no addition). After immersion in 3.5 wt.% NaCl solution for 28 days, the low-frequency end impedance value of the 1 wt.% ODA-GO/SMER coating remained high, at 6.2 × 108 Ω·cm2.

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