Thermal Resistance of Perforated Heat Sinks with Circular Pin Fins Cooled by Natural Convection

2015 ◽  
Vol 775 ◽  
pp. 88-92
Author(s):  
Mao Yu Wen ◽  
Cheng Hsiung Yeh
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Thermal Resistance ◽  
Base Plate ◽  
Type A ◽  
Heat Sinks ◽  
Type B ◽  
Pin Fin ◽  
Different Types ◽  
Pin Fins

This study examines thermal resistance under natural convection for two different types (Type A and Type B) of pin-fin heat sinks with/without a hollow in the heated base. The effects of the rate of heat transfer, the height of fin, the finning factor, the heat sink porosity and the perforated base plate on the thermal resistance were investigated and evaluated. Experimental results show that thermal resistance, using pin-fin heat sinks, is significantly different for Type A and Type B.

scholarly journals Experimental and Numerical Examinations of Temperature Distributions along SSF Pin Fins Cast through Semisolid Materials Processing

2019 ◽  
Vol 8 (12) ◽  
pp. 500-503
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Stainless Steel ◽  
Heat Sinks ◽  
Materials Processing ◽  
Length Scale ◽  
Pin Fin ◽  
Temperature Distributions ◽  
Pin Fins ◽  
Enhancing Heat Transfer

Heat sinks or fins stand deployed for enhancing heat transfer. That’s why, planned experiments remain fortified for examining the impacts of SSF pin fin on thermal dispersal concerning constant thermal value 6 W/cm2 . For that five chromel-alumel thermocouples are preferred, above and beyond, SSF pin fins materials of stainless steel and aluminum. As anticipated, for both the stated SSF pin fins, temperature declines for increasing length scale. Besides, both results are comparable with each other. However, temperature distributions over SSF aluminum pin fin declines relatively at faster rate comparable to that over SSF stainless steel pin fin. Obviously, it may be owing to higher thermal conductivity of SSF aluminum pin fin. Therefore, it carries superior, pleasant and momentous thermal performances.

Experimental and Numerical Investigation of Natural Convection Heat Transfer From Horizontal Rectangular Plate Fin Pin Fin Arrays

2020 ◽  
Author(s):  
Sunil V. Dingare ◽  
Narayan K. Sane ◽  
Ratnakar R. Kulkarni
Keyword(s):  
Heat Transfer ◽  
Nusselt Number ◽  
Natural Convection ◽  
Numerical Model ◽  
Convection Heat Transfer ◽  
Natural Convection Heat Transfer ◽  
Convection Heat ◽  
Pin Fin ◽  
Pin Fins ◽  
Fin Spacing

Abstract Fins are commonly employed for cooling of electronic equipment, compressors, Internal Combustion engines and for heat exchange in various heat exchangers. In short fin (length to height ratio, L/H = 5) arrays used for natural convection cooling, a stagnation zone forms at the central portion and that portion is not effective for carrying away heat. An attempt is made to modify plate fin heat sink geometry (PFHS) by inserting pin fins in the channels formed between plate fins and a plate fin pin fin heat sink (PFPFHS) is constructed to address this issue. An experimental setup is developed to validate numerical model of PFPFHS. The three-dimensional elliptic governing equations were solved using a finite volume based computational fluid dynamics (CFD) code. Fluent 6.3.26, a finite volume flow solver is used for solving the set of governing equations for the present geometry. Cell count based on grid independence and extended domain is used to obtain numerical results. Initially, the numerical model is validated for PFHS cases reported in the literature. After obtaining a good agreement with results from the literature, the numerical model for PFHS is modified for PFPFHS and used to carry out systematic parametric study of PFPFHS to analyze the effects of parameters like fin spacing, fin height, pin fin diameter, number of pin fins and temperature difference between fin array and surroundings on natural convection heat transfer from PFPFHS. It is observed that it is impossible to obtain optimum performance in terms of overall heat transfer by only concentrating on one or two parameters. The interactions among all the design parameters must be considered. This thesis presents Experimental and Numerical study of natural convection heat transfer from horizontal rectangular plate fin and plate fin pin fin arrays. The parameters of study are fin spacing, temperature difference between the fin surface and ambient air, fin height, pin fin diameter, number of pin fins and method of positioning pin fins in the fin channel. Experimental set up is validated with horizontal plate standard correlations. Results are generated in the form of variation in average heat transfer coefficient (ha), base heat transfer coefficient (hb), average Nusselt number (Nua) and base Nusselt number (Nub). Total 512 cases are studied numerically and finally an attempt is made to correlate the Nusselt Number (Nu), Rayleigh Number (Ra), increase in percentage by inserting pin fins (% Area), ratios like spacing to height (S/H) and L/H obtained in the present study.

scholarly journals Effect of an axial hole on natural convection heat transfer from a cylindrical pin fin attached to a horizontal plate

2018 ◽  
Vol 22 (6 Part A) ◽  
pp. 2493-2502
Author(s):  
Saurav Manna ◽  
Subhas Haldar ◽  
Subrata Ghosh
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Convection Heat Transfer ◽  
Base Plate ◽  
Hole Diameter ◽  
Natural Convection Heat Transfer ◽  
Convection Heat ◽  
Horizontal Plate ◽  
Pin Fin ◽  
Laminar Natural Convection

Heat transfer under laminar natural convection from a hollow cylindrical fin mounted on a horizontal base plate has been numerically studied. The flow outside the fin is much stronger than that inside the hole and as a consequence the rate of heat transfer from a hollow fin is primarily due to the contribution by the outer surface of the fin. Fortunately, the rate of heat transfer is not negatively affected by the presence of the hole at the fin centre. On the contrary, when the Grashof number is higher or the hole diameter is bigger, the inside surface contributes marginally to the heat transfer. A hollow fin saves material and weighs less compared to a solid fin. So, this feature may be exploited.

scholarly journals Experimental analysis of parallel plate and crosscut pin fin heat sinks for electronic cooling applications

2010 ◽  
Vol 14 (1) ◽  
pp. 147-156 ◽  
Author(s):  
Harish Sivasankaran ◽  
Godson Asirvatham ◽  
Jefferson Bose ◽  
Bensely Albert
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Parallel Plate ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Average Heat Transfer Coefficient ◽  
Average Heat ◽  
Pin Fin ◽  
Pin Fins

Experimental investigation of parallel plate fin and the crosscut pin fin heat sinks where the heating element placed asymmetrically is performed. Theoretical calculations were done and compared with the experimental results. A comparative study was made based on their efficiencies, heat transfer coefficient, and the thermal performance. From the experimental results it was found that the average heat transfer coefficient of parallel plate fins is higher than that of crosscut pin fins with many perforations. However the performance efficiency of both the crosscut pin fins and parallel plate fins is similar. A hybrid approach was employed to significantly optimize the distance between the fan and heat sink for parallel plate and crosscut pin fins. Parallel plate heat sink with an average heat transfer coefficient of 46 W/m?K placed at an optimum fan distance of 40-60 mm is selected as the suitable choice for the micro-electronic cooling when the heating element is placed asymmetrically.

Thermo-Mechanical Fatigue Life Prediction of Orthotropic Composite Pin Fin Heat Sinks for Electronic Packaging

2011 ◽  
Author(s):  
Sulaman Pashah ◽  
Abul Fazal M. Arif
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Packaging ◽  
Base Plate ◽  
Heat Sinks ◽  
Metallic Base ◽  
Plate Interface ◽  
Pin Fin ◽  
Pin Fins ◽  
Reliability Performance

Heat sinks are used in modern electronic packaging system to enhance and sustain system thermal performance by dissipating heat away from IC components. Pin fins are commonly used in heat sink applications. Conventional metallic pins fins are efficient in low Biot number range whereas high thermal performance can be achieved in high Biot number regions with orthotropic composite pin fins due to their adjustable thermal properties. However, several challenges related to performance as well as manufacturing need to be addressed before they can be successfully implemented in a heat sink design. A heat sink assembly with metallic base plate and polymer composite pin fins is a solution to address manufacturing constraints. During the service life of an electronic packaging, the heat sink assembly is subjected to power cycles. Cyclic thermal stresses will be important at the pin-fin and base-plate interface due to thermal mismatch. The cyclic nature of stresses can lead to fatigue failure that will affect the reliability of the heat sink and electronic packaging. A finite element model of the heat sink is used to investigate the thermal stress cyclic effect on thermo-mechanical reliability performance. The aim is to assess the reliability performance of the epoxy bond at the polymer composite pin fins and metallic base plate interface in a heat-sink assembly.

S-Shaped Pin-Fins for Enhancement of Overall Performance of the Pin-Fin Heat Sink

2010 ◽  
Author(s):  
T. J. John ◽  
B. Mathew ◽  
H. Hegab
Keyword(s):  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Pumping Power ◽  
Pin Fin ◽  
Pin Fins ◽  
Overall Performance

In this paper the authors are studying the effect of introducing S-shaped pin-fin structures in a micro pin-fin heat sink to enhance the overall thermal performance of the heat sinks. For the purpose of evaluating the overall thermal performance of the heat sink a figure of merit (FOM) term comprising both thermal resistance and pumping power is introduced in this paper. An optimization study of the overall performance based on the pitch distance of the pin-fin structures both in the axial and the transverse direction, and based on the curvature at the ends of S-shape fins is also carried out in this paper. The value of the Reynolds number of liquid flow at the entrance of the heat sink is kept constant for the optimization purpose and the study is carried out over a range of Reynolds number from 50 to 500. All the optimization processes are carried out using computational fluid dynamics software CoventorWARE™. The models generated for the study consists of two sections, the substrate (silicon) and the fluid (water at 278K). The pin fins are 150 micrometers tall and the total structure is 500 micrometer thick and a uniform heat flux of 500KW is applied to the base of the model. The non dimensional thermal resistance and nondimensional pumping power calculated from the results is used in determining the FOM term. The study proved the superiority of the S-shaped pin-fin heat sinks over the conventional pin-fin heat sinks in terms of both FOM and flow distribution. S-shaped pin-fins with pointed tips provided the best performance compared to pin-fins with straight and circular tips.

Natural Convection/Radiation Heat Transfer From Highly Populated Pin Fin Arrays

1985 ◽  
Vol 107 (1) ◽  
pp. 190-197 ◽  
Author(s):  
E. M. Sparrow ◽  
S. B. Vemuri
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Radiation Heat Transfer ◽  
Heat Transfer Characteristics ◽  
Radiation Heat ◽  
Pin Fin ◽  
Pin Fins ◽  
Pin Fin Arrays ◽  
Fin Length ◽  
Combined Mode

Experiments were performed to determine the combined-mode natural convection/radiation heat transfer characteristics of highly populated arrays of rodlike cylindrical fins (i.e., pin fins). The fins were oriented with their axes horizontal and were attached to a vertical heated baseplate. The investigated parameters included the number of fins in the array, the fin length and diameter, the baseplate-to-ambient temperature difference, and the presence or absence of adjacent shrouding surfaces. Finning was found to be highly enhancing (up to a sixfold increase in heat transfer), and even the longest fins were highly efficient. When the number of fins was increased for fixed values of the other parameters, the heat transfer increased at first, attained a maximum, and then decreased. Arrays having different diameter fins yielded about the same performance when the surface area of the fin-baseplate assembly was held fixed. Shrouding surfaces positioned close to the array decreased the rate of heat transfer. Calculations showed that the contribution of radiation was substantial and was greatest for more populous arrays, for longer fins, and at small temperature differences.

The Thermal Resistance of Pin Fin Heat Sinks in Transverse Flow

2003 ◽  
Author(s):  
Sukhvinder Kang ◽  
Maurice Holahan
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Heat Transfer Coefficient ◽  
Thermal Resistance ◽  
Transfer Coefficient ◽  
Building Blocks ◽  
Heat Sinks ◽  
Cfd Simulations ◽  
Pin Fin ◽  
Thermal Wake

This paper presents a physics based analytical model to predict the thermal behavior of pin fin heat sinks in transverse forced flow. The key feature of the model is the recognition that unlike plate fins, streamwise conduction does not occur in pin fin heat sinks. Thus, the heat transfer from each fin depends on its local air temperature or adiabatic temperature and the local adiabatic heat transfer coefficient. Both experimental data and simplified CFD simulations are used to develop the two building blocks of the model, the thermal wake function and the adiabatic heat transfer coefficient. These building blocks are then used to include the effect of the thermal wake from upstream fins on the adiabatic temperature of downstream fins in determining the fin-by-fin heat transfer within the pin fin array. This approach captures the essential physics of the flow and heat transport within the fin array and yields an accurate model for predicting the thermal resistance of pin fin heat sinks. Model predictions are compared with existing experimental data and CFD simulations. The model is expected to provide a sound basis for a consistent performance comparison with plate fin heat sinks.

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